IP Library Granted Patent US 7,053,466
Granted Patent B2
US 7,053,466 · App. 10/321,874 · Granted May 30, 2006

High-speed signaling interface with broadside dynamic wave coupling

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 7,053,466
App. No.
10/321,874
Granted
May 30, 2006
Kind
B2
Abstract

A contact-less high-speed signaling interface and method provide for the communication of high-speed signals across an interface, such as a die-substrate interface or die-die interface. The interface includes a transmission-line structure disposed on a dielectric medium to carry a high-speed forward incident signal, and another transmission-line structure disposed on another dielectric medium and substantially aligned with the other transmission-line structure to generate a coupled high-speed signal in a direction opposite to the incident signal.

Claims (17)

1. A high-speed signaling interface comprising:

a first transmission-line structure disposed on a surface of a first dielectric medium to carry a high-speed forward incident electromagnetic wave; and

a second transmission-line structure disposed on a surface of a second dielectric medium and substantially aligned with the first transmission-line structure to generate a coupled high-speed electromagnetic wave in a reverse direction to the incident electromagnetic wave,

wherein the high-speed forward incident electromagnetic wave is to be dynamically wave coupled from the first transmission line structure to the second transmission line structure in a coupling region of the transmission line structures.

2. The interface of claim 1 wherein the first transmission-line structure is a first planar transmission-line structure comprised of conductive elements residing in a first plane, and the second transmission-line structure is a second planar waveguide comprised of conductive elements residing in a second plane, the second plane being substantially parallel to the first plane, wherein the first and second transmission-line structures are substantially aligned to provide broadside dynamic wave coupling therebetween to generate the high-speed coupled wave.

3. The interface of claim 2 wherein the first and second transmission-line structures comprise co-planar strips residing respectively within the first and second planes.

4. The interface of claim 2 wherein the first and second transmission-line structures each comprise a pair of differential lines residing respectively within the first and second planes.

5. The interface of claim 3 further comprising:

a first broadband termination at an end of the first transmission-line structure to terminate the high-speed forward incident wave, the first broadband termination being a resistive termination to substantially reduce reflections of the high-speed forward incident wave; and

a second broadband termination at a corresponding end of the second transmission-line structure, the second broadband termination being a resistive termination.

6. The interface of claim 5 wherein the first and second transmission-line structures are substantially aligned in the coupling region, the coupling region not including the terminations, the coupling region having a length being approximately a quarter-wavelength of frequency of operation.

7. The interface of claim 6 wherein the first and second transmission-line structures have a narrower width in the coupling region and wider width outside the coupling region, and

wherein the length of the coupling region is approximately a quarter-wavelength of an arithmetic mean of odd and even mode guided wavelengths of the incident electromagnetic wave at approximately a center frequency of operation.

8. The interface of claim 6 wherein the transmission line structures in the coupling region are one of either a spiral shape, an “S” shape, a straight line, or a curved line.

9. The interface of claim 3 wherein the first transmission-line structure and first broadband termination are disposed on a die, and the second transmission-line structure and second broadband termination are disposed on a substrate, the die and substrate having significantly different coefficients of thermal expansion (CTE), the substrate being comprised of either a ceramic or an organic material.

10. The interface of claim 3 wherein the high-speed forward incident wave is a digital signal, and wherein the coupled high-speed wave is to be integrated to compensate at least in part for differentiation effects of the interface to generate a digital signal corresponding with the high-speed forward incident wave.

11. The interface of claim 3 wherein the high-speed forward incident wave comprises a carrier frequency modulated with a data signal, the carrier frequency being within a coupling bandwidth of the interface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2002
From: PROKOFIEV, VICTOR; BRAUNISCH, HENNING
To: INTEL CORPORATION
Reel/Frame 013598/0826 →
Continuity (1)
Related Publication 20040113239A1 · Jun 17, 2004