Large organic devices and methods of fabricating large organic devices
View Patent ↗Large, light-weight organic devices and methods of preparing large, light-weight organic devices. Specifically, flexible and rigid light-weight plastics are implemented. The flexible plastic may be disposed from a reel. A metal grid is fabricated on the flexible plastic to provide current conduction over the large area. A transparent oxide layer is provided over the metal grid to form the bottom electrode of the organic device. A light emitting or light gathering organic layer is disposed on the transparent oxide layer. A second electrode is disposed over the organic layer. Electrodes are coupled to the metal grid and the second electrode to provide electrical current to or from the organic layer. Depending on the type of materials used for the organic layer, the organic device may comprise an area light device or a photovoltaic device.
1. A method of fabricating an organic device comprising the acts of:
fabricating a transparent backer portion, wherein a plurality of apertures are formed in the transparent backer portion;
fabricating an active portion, wherein the active portion comprises an organic layer disposed between a first electrode and a second electrode;
coupling the transparent backer portion to the active portion; and
coupling electrical leads to each of the first electrode and the second electrode.
2. The method, as set forth in claim 1 , wherein the act of fabricating the transparent backer portion comprises the acts of:
providing a plastic layer having a front surface area of greater than one square foot;
forming a plurality of apertures in the plastic layer;
disposing a hermetic coating over the plastic layer; and
disposing an adhesive layer over the hermetic coating.
3. The method, as set forth in claim 2 , wherein the act of providing a plastic layer comprises the act of providing a polycarbonate layer.
4. The method, as set forth in claim 2 , wherein the act of disposing an adhesive layer comprises the act of disposing an adhesive layer comprising phosphor particles.
5. The method, as set forth in claim 2 , comprising the act of disposing a color changing layer between the hermetic coating and the adhesive layer.
6. A method of fabricating an organic device comprising the acts of:
fabricating a transparent backer portion; and
fabricating an active portion, wherein the act of fabricating the active portion comprises the acts of:
providing a transparent film;
disposing a metal layer on the transparent film;
forming a grid in the metal layer;
disposing the first electrode over the metal layer and the transparent film;
disposing the organic layer over the first electrode; and
disposing the second electrode over the organic layer;
coupling the transparent backer portion to the active portion; and
coupling electrical leads to each of the first electrode and the second electrode.
7. The method, as set forth in claim 6 , wherein the act of providing a transparent film comprises the act of providing a flexible transparent film from a reel.
8. The method, as set forth in 6 , wherein the act of disposing a metal layer comprises the act of disposing an aluminum layer.
9. The method, as set forth in claim 6 , wherein the act of forming a grid comprises the act of patterning the metal layer to form electrically isolated squares.
10. The method, as set forth in claim 6 , wherein the act of disposing the first electrode comprises the act of disposing a transparent conductive layer.
11. The method, as set forth in claim 10 , wherein the act of disposing the transparent conductive layer comprises the act of disposing an indium-tin-oxide (ITO) layer.
12. The method, as set forth in claim 6 , wherein the act of disposing the second electrode comprises the act of disposing an aluminum layer over the organic layer.
13. The method, as set forth in claim 6 , wherein the act of coupling the electrical leads to the first electrode comprises the acts of:
forming a plurality of openings in the transparent film, through a plurality of apertures in the transparent backer portion, wherein the apertures and openings are coincident with the grid pattern formed in the metal layer such that the metal layer is exposed through the apertures and openings;
disposing a conductive material into the openings such that the conductive material is electrically coupled to the metal layer; and
electrically coupling wires to the conductive material.
14. The method, as set forth in claim 6 , wherein the act of fabricating the transparent backer portion comprises the acts of:
providing a plastic layer having a front surface area of greater than one square foot;
forming a plurality of apertures in the plastic layer;
disposing a hermetic coating over the plastic layer; and
disposing an adhesive layer over the hermetic coating.
15. The method, as set forth in claim 14 , wherein the act of providing a plastic layer comprises the act of providing a polycarbonate layer.
16. The method, as set forth in claim 14 , wherein the act of disposing an adhesive layer comprises the act of disposing an adhesive layer comprising phosphor particles.
17. The method, as set forth in claim 14 , comprising the act of disposing a color changing layer between the hermetic coating and the adhesive layer.
18. A method of fabricating an organic device comprising the acts of:
providing a flexible transparent film;
forming a metal grid pattern on the flexible transparent film;
disposing a transparent conductive oxide (TCO) layer over the metal grid pattern and the transparent film;
disposing the organic layer over the transparent conductive oxide layer; and
disposing a metal layer over the organic layer.
19. The method, as set forth in claim 18 , wherein the act of providing a flexible transparent film comprises the act of providing the flexible transparent film from a reel.
20. The method, as set forth in claim 18 , wherein the act of providing the flexible transparent film comprises the act of providing a flexible transparent film having a width in the range of approximately 1–2 feet.
21. The method, as set forth in claim 18 , wherein the act of forming a grid comprises the act of patterning a metal layer to form a plurality of electrically isolated metal squares.
22. The method, as set forth in claim 18 , wherein the act of disposing the transparent conductive layer comprises the act of disposing an indium-tin-oxide (ITO) layer.
23. The method, as set forth in claim 18 , wherein the act of disposing the organic layer comprises the act of disposing a plurality of layers comprising organic polymers.
24. The method, as set forth in claim 18 , wherein the act of disposing the metal layer comprises the act of disposing an aluminum layer over the organic layer.
25. The method, as set forth in claim 18 , comprising the act of coupling electrical leads to each of the metal grid pattern and the metal layer.
26. The method, as set forth in claim 21 , comprising the act of coupling electrical leads to some of the plurality of metal squares.