IP Library Granted Patent US 6,911,244
Granted Patent B2
US 6,911,244 · App. 10/325,002 · Granted Jun 28, 2005

Encapsulated barrier for flexible films and a method of making the same

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,911,244
App. No.
10/325,002
Granted
Jun 28, 2005
Kind
B2
Abstract

The present invention relates to a film structure and a method of manufacturing the same. More specifically, the film structure may include a barrier material made from EVOH, nylon or other thermally sensitive barrier material encapsulated by a first adhesive material. The barrier material and the first adhesive material form a barrier layer and a first set of adhesive layers when coextruded. The barrier layer and the first set of adhesive layers may be coextruded at the same or a similar temperature to form a first extrudate. The extrudate may be encapsulated by or otherwise coextruded with a second adhesive material to form a second extrudate at a higher temperature than the first extrudate that then may be formed into a flat sheet via a die. The first set of adhesive layers protects the barrier layer from high temperatures and long residence times related to the coextrusion/lamination process that may degrade the barrier layer. In addition, acid terpolymer consisting of ethylene/methyl acrylate/acrylic acid adheres a barrier material of EVOH to outer layers of the film structure.

Claims (81)

1. A film structure comprising:

a barrier layer made from a thermally sensitive material;

a first adhesive material wherein the thermally sensitive material is encapsulated by the first adhesive material forming a first extrudate upon coextrusion of the thermally sensitive material and the first adhesive material at a first temperature wherein the first adhesive material forms first and second adhesive layers on opposite sides of the barrier layer;

a second adhesive material adhered to the first extrudate on a surface of the first extrudate wherein the second adhesive material forms a third adhesive layer on at least one outside surface of the first adhesive material wherein the second adhesive material is coextruded with the first extrudate at a second temperature to form a second extrudate wherein the second temperature is higher than the first temperature; and

at least one substrate laminated to an outside surface of the second extrudate at a temperature higher than the first temperature wherein said substrate comprises oriented polypropylene.

2. The film structure of claim 1 further comprising:

a sealant layer laminated to the polypropylene layer; and

an outer layer laminated to another outside surface of the second extrudate.

3. A method of manufacturing a film structure, the method comprising the steps of:

providing a first extruder for extruding a thermally sensitive barrier material;

extruding said barrier material;

providing a second extruder for extruding a first adhesive material;

extruding the first adhesive material;

encapsulating the barrier material by the first adhesive material in a first encapsulator to form a first extrudate at a first temperature;

providing a second adhesive material;

extruding the second adhesive material via a third extruder;

adhering the first extrudate to the second adhesive at a second temperature to form a combined meltstream wherein the second temperature is higher than the first temperature;

feeding the combined meltstream through a die to form a flat sheet wherein the flat sheet includes a barrier layer encapsulated by first adhesive layers on opposite sides of the barrier layer and further wherein at least one of the first adhesive layers are bonded to a second adhesive layer on an outside surface of the first adhesive layers; and

laminating said sheet to at least one substrate at a temperature higher than the first temperature wherein said substrate comprises an oriented polypropylene layer.

4. A film structure comprising:

a thermally sensitive barrier layer made from a first polymeric material comprising ethylene vinyl alcohol copolymer wherein said first polymeric material has a melt temperature range between about 400° F. and about 450° F.;

first and second adhesive layers disposed on opposite surfaces of the barrier layer wherein the first and second adhesive layers are made from a second polymeric material having a melt temperature between about 400° F. and about 450° F. wherein said first and second adhesive layers are formed by encapsulating said barrier layer with said second polymeric material;

a third adhesive layer on an outside surface of the first adhesive layer having a melt temperature between about 550° F. and about 620° F. wherein said barrier layer and first, second and third adhesive layers are coextruded together to form an extrudate; and

at least one substrate laminated to said extrudate, wherein said substrate comprises oriented polypropylene and further wherein the film structure comprises a sealant layer forming a first outside layer of the film structure disposed adjacent to the polypropylene layer and a second outside layer of the film structure disposed on an opposite side of the film structure from the sealant layer.

5. The film structure of claim 4 wherein the second outside layer comprises a material selected from the group consisting of polyester, oriented polypropylene, biaxially oriented nylon, paper, polyvinylidene chloride copolymer coated substrates, metallized substrates and glass coated substrates.

6. A film structure comprising:

a thermally sensitive barrier layer made from a first polymeric material comprising ethylene vinyl alcohol copolymer wherein said first polymeric material has a melt temperature range between about 400° F. and about 450° F.;

first and second adhesive layers disposed on opposite surfaces of the barrier layer wherein the first and second adhesive layers are made from a second polymeric material having a melt temperature between about 400° F. and about 450° F. wherein said first and second adhesive layers are formed by encapsulating said barrier layer with said second polymeric material;

a third adhesive layer on an outside surface of the first adhesive layer having a melt temperature between about 550° F. and about 620° F. wherein said barrier layer and first, second and third adhesive layers are coextruded together to form an extrudate;

at least one substrate laminated to said extrudate;

a sealant layer forming an outside layer of the film structure disposed adjacent to an outside surface of the substrate; and

an outside layer of the film structure disposed on an opposite side of the film structure from the sealant layer, wherein the outside layer comprises a material selected from the group consisting of polyester, oriented polypropylene, biaxially oriented nylon, paper, polyvinylidene chloride copolymer coated substrates, metallized substrates and glass coated substrates.

7. A film structure comprising:

a barrier layer made from a thermally sensitive material comprising ethylene vinyl alcohol copolymer;

a first adhesive material wherein the thermally sensitive material is encapsulated by the first adhesive material forming a first extrudate upon coextrusion of the thermally sensitive material and the first adhesive material at a first temperature wherein the first adhesive material forms first and second adhesive layers on opposite sides of the barrier layer;

a second adhesive material adhered to the first extrudate on a surface of the first extrudate wherein the second adhesive material forms a third adhesive layer on at least one outside surface of the first adhesive material wherein the second adhesive material is coextruded with the first extrudate at a second temperature to form a second extrudate wherein the second temperature is higher than the first temperature; and

at least one substrate laminated to an outside surface of the second extrudate wherein said substrate comprises oriented polypropylene and further wherein said film structure comprises a sealant layer laminated to the polypropylene and an outer layer laminated to another outside surface of the second extrudate.

8. A method of manufacturing a film structure, the method comprising the steps of:

providing a first extruder for extruding a thermally sensitive barrier material comprising ethylene vinyl alcohol copolymer;

extruding said barrier material;

providing a second extruder for extruding a first adhesive material;

extruding the first adhesive material;

encapsulating the barrier material by the first adhesive material in a first encapsulator to form a first extrudate at a first temperature;

providing a second adhesive material;

extruding the second adhesive material via a third extruder;

adhering the first extrudate to the second adhesive at a second temperature to form a combined meltstream wherein the second temperature is higher than the first temperature;

feeding the combined meltstream through a die to form a flat sheet wherein the flat sheet includes a barrier layer encapsulated by first adhesive layers on opposite sides of the barrier layer and further wherein at least one of the first adhesive layers are bonded to a second adhesive layer on an outside surface of the first adhesive layers; and

laminating said sheet to at least one substrate wherein said substrate comprises an oriented polypropylene layer.

9. The film structure comprising:

a thermally sensitive barrier layer made from a first polymeric material comprising ethylene vinyl alcohol copolymer wherein said first polymeric material has a melt temperature range between about 400° F. and about 450° F. ;

first and second adhesive layers disposed on opposite surfaces of the barrier layer wherein the first and second adhesive layers are made from a second polymeric material having a melt temperature between about 400° F. and about 450° F. wherein said first and second adhesive layers are formed by encapsulating said barrier layer with said second polymeric material;

a third adhesive layer on an outside surface of the first adhesive layer having a melt temperature between about 550° F. and about 620° F. wherein said barrier layer and first, second and third adhesive layers are coextruded together to form an extrudate; and

at least one substrate layer formed separately from and adhered to said extrudate wherein said substrate comprises oriented polypropylene and further wherein the film structure comprises:

a sealant layer forming a first outside layer of the film structure disposed adjacent to the polypropylene layer; and

a second outside layer of the film structure disposed on an opposite side of the film structure from the sealant layer.

10. The film structure of claim 9 , wherein the outside layer comprises a material selected from the group consisting of polyester, oriented polypropylene, biaxially oriented nylon, paper, polyvinylidene chloride copolymer coated substrates, metallized substrates and glass coated substrates.

11. The film structure comprising:

a thermally sensitive barrier layer made from a first polymeric material comprising ethylene vinyl alcohol copolymer wherein said first polymeric material has a melt temperature range between about 400° F. and about 450° F. ;

first and second adhesive layers disposed on opposite surfaces of the barrier layer wherein the first and second adhesive layers are made from a second polymeric material having a melt temperature between about 400° F. and about 450° F. wherein said first and second adhesive layers are formed by encapsulating said barrier layer with said second polymeric material;

a third adhesive layer on an outside surface of the first adhesive layer having a melt temperature between about 550° F. and about 620° F. wherein said barrier layer and first, second and third adhesive layers are coextruded together to form an extrudate; and

at least one substrate layer formed separately from and adhered to said extrudate further comprising:

a sealant layer forming an outside layer of the film structure disposed adjacent to an outside surface of the substrate; and

an outside layer of the film structure disposed on an opposite side of the film structure from the sealant layer wherein the outside layer comprises a material selected from the group consisting of polyester, oriented polypropylene, biaxially oriented nylon, paper, polyvinylidene chloride copolymer coated substrates, metallized substrates and glass coated substrates.

12. The film structure comprising:

a barrier layer made from a thermally sensitive material comprising ethylene vinyl alcohol copolymer;

a first adhesive material wherein the thermally sensitive material is encapsulated by the first adhesive material forming a first extrudate upon coextrusion of the thermally sensitive material and the first adhesive material at a first temperature wherein the first adhesive material forms first and second adhesive layers on opposite sides of the barrier layer;

a second adhesive material adhered to the first extrudate on a surface of the first extrudate wherein the second adhesive material forms a third adhesive layer on at least one outside surface of the first adhesive material wherein the second adhesive material is coextruded with the first extrudate at a second temperature to form a second extrudate wherein the second temperature is higher than the first temperature; and

at least one substrate formed separately from and adhered to an outside surface of the second extrudate;

wherein said substrate comprises oriented polypropylene and further wherein said film structure comprises:

a sealant layer laminated to the polypropylene layer, and an outer layer laminated to another outside surface of the second extrudate.

13. A method of manufacturing a film structure, the method comprising the steps of:

providing a first extruder for extruding a thermally sensitive barrier material comprising ethylene vinyl alcohol copolymer;

extruding said barrier material;

providing a second extruder for extruding a first adhesive material;

extruding the first adhesive material;

encapsulating the barrier material by the first adhesive material in a first encapsulator to form a first extrudate at a first temperature;

providing a second adhesive material;

extruding the second adhesive material via a third extruder;

adhering the first extrudate to the second adhesive at a second temperature to form a combined meltstream wherein the second temperature is higher than the first temperature;

feeding the combined meltstream through a die to form a flat sheet wherein the flat sheet includes a barrier layer encapsulated by first adhesive layers on opposite sides of the layer and further wherein at least one of the first adhesive layers are bonded to a second adhesive layer on an outside surface of the first adhesive layers; and

laminating said sheet to at least one substrate formed separately from said sheet herein said substrate comprises an oriented polypropylene layer.

Assignments (6)
RELEASE OF SECURITY INTEREST IN PATENTS Recorded May 3, 2018
From: WELLS FARGO BANK, NATIONAL ASSOCIATION (SUCCESSOR BY ASSIGNMENT TO GENERAL ELECTRIC CAPITAL CORPORATION)
To: COVERIS FLEXIBLES US LLC (FORMERLY KNOWN AS EXOPACK, LLC); COVERIS TECHNOLOGY LLC (FORMERLY KNOWN AS EXOPACK-TECHNOLOGY, LLC); COVERIS ADVANCED COATINGS US LLC (FORMERLY KNOWN AS EXOPACK ADVANCED COATINGS, LLC)
Reel/Frame 047077/0799 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 031645/0475 Recorded May 3, 2018
From: GOLDMAN SACHS BANK USA
To: COVERIS FLEXIBLES US LLC (FORMERLY, EXOPACK, LLC)
Reel/Frame 046063/0208 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 026376/0569 Recorded May 3, 2018
From: WELLS FARGO BANK, NATIONAL ASSOCIATION (SUCCESSOR BY ASSIGNMENT TO GENERAL ELECTRIC CAPITAL CORPORATION)
To: COVERIS FLEXIBLES US LLC (FORMERLY, EXOPACK, LLC); COVERIS TECHNOLOGY LLC (FORMERLY, EXOPACK-TECHNOLOGY, LLC); COVERIS ADVANCED COATINGS US LLC (FORMERLY, EXOPACK ADVANCED COATINGS, LLC)
Reel/Frame 046070/0676 →
CHANGE OF NAME Recorded Jan 11, 2018
From: EXOPACK, LLC
To: COVERIS FLEXIBLES US LLC
Reel/Frame 045059/0480 →
RELEASE OF PATENT SECURITY AGREEMENT Recorded Nov 18, 2013
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: EXOPACK, LLC
Reel/Frame 031664/0856 →
PATENT SECURITY AGREEMENT Recorded Nov 15, 2013
From: EXOPACK, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 031645/0475 →