IP Library Granted Patent US 7,212,697
Granted Patent B2
US 7,212,697 · App. 10/328,827 · Granted May 1, 2007

Planar optical circuit

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Quick Facts
Patent No.
US 7,212,697
App. No.
10/328,827
Granted
May 1, 2007
Kind
B2
Abstract

The invention relates a planar optical circuit having at least one functional layer with structures for guidance, changing, regulation, control, production and/or detection of optical signals, a carrier substrate on which the at least one functional layer is formed, and at least two physically separate functional units which are formed in the at least one functional layer on the carrier substrate. According to the invention, the at least two functional units ( 2, 3 ) are thermally separated from one another by at least one trench structure ( 4 ) in the functional layer ( 11 ) and/or in the carrier substrate ( 11 ).

Claims (32)

1. A planar optical circuit, comprising:

a carrier substrate;

at least one functional layer disposed on said carrier substrate;

a trench structure formed in at least one of said functional layer and said carrier substrate;

at least two physically separate functional units formed in said functional layer, said at least two functional units thermally separated from one another by said trench structure, a first one of the at least two functional units having different thermal requirements than a second one of the at least two functional units; and

waveguides passing around said trench structure and optically connecting said functional units to one another to transfer light from one of said at least two physically separate functional units to the other of said at least two physically separate functional units.

2. The planar optical circuit according to claim 1 , wherein said trench structure runs only in said functional layer.

3. The planar optical circuit according to claim 1 , wherein said trench structure runs only in said carrier substrate.

4. The planar optical circuit according to claim 1 , wherein said trench structure runs in said functional layer and in said carrier substrate.

5. The planar optical circuit according to claim 4 , wherein said trench structure is formed by a cutout extending completely through said functional layer and completely through said carrier substrate.

6. The planar optical circuit according to claim 1 , wherein said carrier substrate has a surface and said trench structure has side surfaces running at right angles to said surface of said carrier substrate.

7. The planar optical circuit according to claim 1 , wherein said carrier substrate has a surface and said trench structure has side surfaces formed such that said side surfaces run at a non-perpendicular angle to said surface of said carrier substrate.

8. The planar optical circuit according to claim 1 , wherein said trench structure is produced by laser cutting of at least one of said functional layer and of said carrier substrate.

9. The planar optical circuit according to claim 1 , wherein said trench structure is produced by one of wet etching and dry etching.

10. The planar optical circuit according to claim 1 , wherein said trench structure includes at least one trench formed in at least one of said carrier substrate and said functional layer and is disposed between said two functional units.

11. The planar optical circuit according to claim 10 , wherein said trench is one of a plurality of trenches each having an elongated shape.

12. The planar optical circuit according to claim 1 , wherein said trench structure includes flat cutouts formed in at least one of said carrier substrate and said functional layer.

13. The planar optical circuit according to claim 1 , wherein said trench structure is defined by a plurality of trenches formed in at least one of said carrier substrate and said functional layer and a thermally highly insulating material other than air filling said trenches.

14. The planar optical circuit according to claim 1 , further comprising:

a thermal insulator disposed underneath said trench structure.

15. The planar optical circuit according to claim 1 , wherein at least one of said functional units is subject to a heat supply during its operation.

16. The planar optical circuit according to claim 1 , wherein said two functional units are an optical filter and an optical switch.

17. The planar optical circuit according to claim 7 , wherein said side surfaces of said trench structure are V-shaped.

18. The planar optical circuit according to claim 1 , wherein said trench structure divides at least a portion of at least one of said carrier substrate and said functional layer into webs wherein the waveguides are positioned, said functional units are connected to one another only by said webs and are optically connected to each other by said waveguides.

19. The planar optical circuit according to claim 1 , wherein the substrate has a relatively higher thermal conductivity than a thermal conductivity of the functional layer.

20. The planar optical circuit according to claim 1 , wherein at least one of the functional units comprises an optical filter and another at least one of the functional units comprises one of: an optical switch; optical attenuator unit; sensor; light emitting diode; laser diode; and, optical amplifier.

21. The planar optical circuit according to claim 1 , wherein the functional layer comprises one of: silicon; glass; polymer.

22. The planar optical circuit according to claim 1 , wherein the substrate comprises one of: silicon; glass.

23. An add-drop multiplexer that includes the planar optical circuit according to claim 1 .

24. The planar optical circuit according to claim 1 , wherein:

operation of the first one of the functional units is based upon a substantially constant temperature of the first one of the functional units; and

operation of the second one of the functional units is based upon variations in temperature of the second one of the functional units.

Assignments (3)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →