Method of fabricating organic electroluminescence display device

1. A method of fabricating an organic electroluminescence display device, comprising the steps of:

forming a hole injection layer on a substrate;

positioning a mold supporter over the hole injection layer, the mold supporter having a mold on a surface thereof disposed toward the hole injection layer, the mold having an opening;

adhering the mold onto the hole injection layer;

applying hole transporting layer material in the opening of the mold on the hole injection layer;

spin coating the hole transporting layer material to form a hole transporting layer;

separating the mold from the hole injection layer such that the hole transporting layer remains on the hole injection layer;

forming an emissive layer on the hole transporting layer;

forming an electron transporting layer on the emissive layer; and

forming an electron injection layer on the electron transporting layer.

2. The method according to claim 1 , wherein an adhesion between the mold and the hole injection layer is stronger than an adhesion between the mold and the mold supporter.

3. The method according to claim 1 , wherein the step of separating the mold uses a mold removing plate.

4. The method according to claim 3 , wherein an adhesion between the mold and the mold removing plate is stronger than the adhesion between the mold and the hole injection layer.

5. The method according to claim 1 , wherein the mold includes polydimethylsiloxane.

6. The method according to claim 5 , wherein the mold includes a hardening agent of about 10 percent by weight.

7. The method according to claim 1 , wherein the spin coating step includes annealing the hole transporting layer material.

8. The method according to claim 1 , wherein the step of applying the hole transporting layer material includes a step of a applying hole transporting layer material on a portion of the hole injection layer within the opening of the mold.

9. The method according to claim 1 , wherein the mold has an inclined inside wall.

10. A method of forming a hole transporting layer of an organic electroluminescence display device, comprising the steps of:

positioning a mold supporter over a substrate, the mold supporter having a mold on a surface thereof disposed toward the substrate, the mold having an opening;

adhering the mold onto the substrate;

spin coating hole transporting layer material in the opening of the mold on the substrate to form the hole transporting layer; and

separating the mold from the substrate having the hole transporting layer thereon.

11. The method according to claim 10 , wherein an adhesion between the mold and the substrate is stronger than an adhesion between the mold and the mold supporter.

12. The method according to claim 10 , wherein the step of separating the mold uses a mold removing plate.

13. The method according to claim 12 , wherein an adhesion between the mold and the mold removing plate is stronger than the adhesion between the mold and the substrate.

14. The method according to claim 10 , wherein the mold includes polydimethylsiloxane.

15. The method according to claim 14 , wherein the mold includes a hardening agent of about 10 percent by weight.

16. The method according to claim 10 , wherein the spin coating step includes annealing the hole transporting layer material.

17. The method according to claim 10 , wherein the spin coating step includes applying hole transporting layer material on a portion of the substrate within the opening of the mold.

18. The method according to claim 10 , wherein the mold has an inclined inside wall.

19. A method of fabricating an organic electroluminescence display device, comprising the steps of:

forming an electron injection layer on a substrate;

forming an electron transporting layer on the electron injection layer;

forming an emissive layer on the electron transporting layer;

positioning a mold supporter over the emissive layer, the mold supporter having a mold on a surface thereof disposed toward the emissive layer, the mold having an opening;

adhering the mold onto the emissive layer;

applying hole transporting layer material in the opening of the mold on the emissive layer;

spin coating the hole transporting layer material to form a hole transporting layer;

separating the mold from the emissive layer such that the hole transporting layer remains on the emissive layer; and

forming a hole injection layer on the hole transporting layer.