IP Library Granted Patent US 7,009,818
Granted Patent B1
US 7,009,818 · App. 10/334,349 · Granted Mar 7, 2006

Thin film magnetic head having improved thermal characteristics, and method of manufacturing

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Quick Facts
Patent No.
US 7,009,818
App. No.
10/334,349
Granted
Mar 7, 2006
Kind
B1
Abstract

A thin film magnetic head having one or more magneto-resistive (MR) elements. A thermally conductive stud is incorporated in an underlayer of the head, below the bottom shield of the MR element. This stud acts as a heat sink, and enhances the heat flow from the bottom shield to the substrate to thereby reduce thermal contact noise in the device, as well as allowing use of higher bias currents when reading signals from the media.

Claims (30)

1. A thin film magnetic head, comprising:

a substrate;

a first magnetic shield layer;

a thermally conductive stud disposed between the substrate and the first magnetic shield layer, wherein contact between the first magnetic shield layer and the thermally conductive stud is absent; and

an electrical insulator layer disposed between the first magnetic shield layer and the thermally conductive stud, wherein the electrical insulator layer provides electrical insulation between the first magnetic shield layer and the thermally conductive stud.

2. The thin film magnetic head of claim 1 , further comprising:

an MR element disposed above the first magnetic shield layer; and

a second magnetic shield layer disposed above the MR element.

3. The thin film magnetic head of claim 2 , further comprising:

a second electrical insulator layer disposed between the MR element and the first magnetic shield layer; and

a third electrical insulator layer disposed between the MR element and the second magnetic shield layer.

4. The thin film magnetic head of claim 1 , wherein the thermally conductive stud is electrically conductive.

5. The thin film magnetic head of claim 4 , wherein the thermally conductive stud comprises copper.

6. The thin film magnetic head of claim 4 , wherein the thermally conductive stud comprises aluminum.

7. The thin film magnetic head of claim 1 , wherein the electrical insulator layer comprises alumina.

8. The thin film magnetic head of claim 1 , wherein the electrical insulator layer comprises a thin electrical insulator layer between the stud and the first magnetic shield layer.

9. A method of producing a thin film magnetic head, comprising the steps of:

forming a substrate layer;

forming a thermally conductive stud above the substrate;

forming an electrical insulator layer above the thermally conductive stud;

forming a magnetic shield layer above the electrical insulator layer such that the electrical insulator layer provides electrical insulation between the thermally conductive stud and the magnetic shield layer, wherein contact between the magnetic shield layer and the thermally conductive stud is absent and wherein the electrical insulator layer is between the magnetic shield layer and the thermally conductive stud; and

forming a read element above the magnetic shield layer.

10. The method of claim 9 , wherein the read element is a magneto-resistive element.

11. A method of using a thin film magnetic head to process data on a magnetic tape media, said method comprising the steps of

contacting a magnetic tape with a thin film magnetic head, said magnetic tape having data, said thin film magnetic head comprising:

a substrate;

a first magnetic shield layer;

a thermally conductive stud disposed between the substrate and the first magnetic shield layer, wherein contact between the first magnetic shield layer and the thermally conductive stud is absent; and

an electrical insulator layer disposed between the first magnetic shield layer and the thermally conductive stud, wherein the electrical insulator layer provides electrical insulation between the first magnetic shield layer and the thermally conductive stud; and

accessing the data on the magnetic tape with the thin film magnetic head.

Assignments (3)
MERGER Recorded Feb 4, 2016
From: STORAGE TECHNOLOGY CORPORATION
To: SUN MICROSYSTEMS, INC.
Reel/Frame 037692/0820 →
MERGER AND CHANGE OF NAME Recorded Feb 4, 2016
From: SUN MICROSYSTEMS, INC.; ORACLE USA, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037694/0966 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2003
From: ARNOLD, CARL STEPHEN; DENISON, EDWARD VIRGIL; ALSTRIN, APRIL LYNN
To: STORAGE TECHNOLOGY CORPORATION
Reel/Frame 013690/0406 →