Method and system for optical packaging
View Patent ↗Method and system for an optical package are disclosed. In one embodiment of the present invention, an optical package comprises: a lead frame; a substrate mounted inside the lead frame; one or more leads attached to the substrate; an optical device or component such as a LOA chip mounted on top of the substrate; a window cap hermetically sealing the optical device or component; one or more lens attached to either side of the window cap; two fibers attached on either side of the window cap; two holes or vias that may serve as inputs into the window cap or outputs from the window cap; an electrical out extending from the window cap; and an electrically isolated enclosure enveloping all contents inside the lead frame.
1. An optical package, comprising:
an electrically isolated substrate having one or more holes extending from a top surface of the substrate to a bottom surface of the substrate; and
a window cap encapsulating an optical device on the substrate, wherein at least two holes extend through the window cap.
2. The optical package of claim 1 , wherein the substrate comprises at least one layer of ceramic material.
3. The optical package of claim 1 , wherein at least one of the one or more holes in the substrate is configured to be a via.
4. The optical package of claim 1 , wherein a first hole of the at least two holes is disposed on a first side wall of the window cap.
5. The optical package of claim 4 , wherein a second hole of the at least two holes is disposed on a second side wall of the window cap.
6. The optical package of claim 1 , further comprising an electrical out on the substrate extending from the window cap.
7. The optical package of claim 6 , wherein the optical device is mounted on a sub-mount, the sub-mount being mounted on the substrate.
8. The optical package of claim 7 , wherein a first hole of the one or more holes in the substrate contacts the sub-mount via one or more bond wires.
9. The optical package of claim 8 , wherein the first hole of the one or more holes contacts the electrical out via one or more bond wires.
10. The optical package of claim 9 , wherein the substrate is attached to a frame.
11. The optical package of claim 10 , wherein the frame is a lead frame.
12. The optical package of claim 11 , wherein one or more isolation elements are mounted on one or more walls of the frame.
13. The optical package of claim 12 , wherein the isolation elements are ceramic.
14. The optical package of claim 1 , further comprising a Peltier element attached to the bottom surface of the substrate.
15. An optical package comprising:
an electrically isolated substrate having one or more holes extending from a top surface of the substrate to a bottom surface of the substrate;
an optical device mounted on a sub-mount that is mounted on the substrate;
a window cap encapsulating the optical device on the sub-mount, wherein at least one hole extends through the window cap;
an electrical out on the substrate extending from the window cap, wherein a first hole of the one or more holes in the substrate contacts the electrical out by one or more bond wires; and
an electrically isolated enclosure enclosing the window cap and substrate, the enclosure having a first end face and a second end face.
16. The optical package of claim 15 , wherein a first fiber extends through the first end face, the first fiber being optically coupled with a first lens on the window cap, and a second fiber extends through the second end face, the second fiber being optically coupled with a second lens on the window cap.
17. The optical package of claim 16 , further comprising
a first plurality of leads extending through a first ceramic terminal on the enclosure, the first plurality of leads being in electronic communication with the substrate; and
a second plurality of leads extending through a second ceramic terminal on the enclosure, the second plurality of leads being in electronic communication with the substrate.
18. An optical package comprising:
an electrically isolated substrate having one or more holes extending from a top surface of the substrate to a bottom surface of the substrate;
a window cap encapsulating an optical device on the substrate; and
an electrical out on the substrate extending from the window cap, wherein a first hole of the one or more holes contacts the electrical out by one or more bond wires.
19. The optical package of claim 18 , wherein the optical device is mounted on a sub-mount that is mounted on the substrate, wherein the first hole of the one or more holes contacts the sub-mount by one or more bond wires.
20. The optical package of claim 19 , wherein one or more isolation elements are mounted on one or more walls of the frame.
21. The optical package of claim 19 , wherein the substrate is attached to a lead frame.