IP Library Granted Patent US 6,977,363
Granted Patent B2
US 6,977,363 · App. 10/337,436 · Granted Dec 20, 2005

Correlated double sampling circuit and CMOS image sensor including the same

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Quick Facts
Patent No.
US 6,977,363
App. No.
10/337,436
Granted
Dec 20, 2005
Kind
B2
Abstract

A correlated double sampling circuit that reduces a shift in the potential of a node on the reference voltage side produced by reset operation. A reset signal RST is turned to “H” and then is turned to “L.” By doing so, a photodiode begins integration according to the intensity of light. This detected signal is sent to a CDS circuit. An SW 1 and a connection switch for sampling in the CDS circuit are turned to ON to accumulate the detected signal according to integration time in C 1 and C 2 as electric charges. After a certain period of time elapsed, the SW 1 and connection switch for sampling are turned to OFF to hold the detected signal sampled. Next, the RST is turned again to “H” and the SW 1 is turned to ON. Then the RST is turned to “L” and the SW 1 is turned to OFF. By doing so, reset noise is sampled and held in the C 1 . As a result, only a signal component can be extracted from the detected signal. After that a connection switch for outputting SW 3 and a connection switch for reading are turned to ON to transfer an output voltage signal according to the signal component included in the detected signal to an output bus line.

Claims (29)

1. A correlated double sampling circuit for processing signals output from a pixel section where solid-state image sensing devices are arranged like a matrix, the circuit comprising:

a first capacitor for sampling and holding reset level signals corresponding to noise produced by resetting the pixel section;

a second capacitor for sampling and holding detected signals obtained by a photoelectric conversion in the pixel section;

a connection switch for sampling for controlling connection between predetermined power supply which generates predetermined potential to sample the detected signals with the predetermined potential as reference and the second capacitor; and

a connection switch for reading for controlling reading of output signals according to a difference between the detected signals and the reset level signals obtained from electric charges sampled and held in the second capacitor and the first capacitor,

wherein a width of a gate of a switching element included in the connection switch for sampling is narrower than a width of a gate of a switching element included in the connection switch for reading.

2. The correlated double sampling circuit according to claim 1 , wherein a width of a gate of a switching element included in the connection switch for sampling is a minimum width formed in a semiconductor production process.

3. A correlated double sampling circuit for processing signals output from a pixel section where solid-state image sensing devices are arranged like a matrix, the circuit comprising:

a first capacitor for sampling and holding reset level signals corresponding to noise produced by resetting the pixel section;

a second capacitor for sampling and holding detected signals obtained by a photoelectric conversion in the pixel section;

a connection switch for sampling for controlling connection between predetermined power supply which generates predetermined potential to sampling the detected signals with the predetermined potential as reference and the second capacitor; and

a connection switch for reading for controlling reading of output signals according to a difference between the detected signals and the reset level signals obtained from electric charges sampled and held in the second capacitor and the first capacitor,

wherein a switching element included in the connection switch for sampling is connected to a dummy switching element, a gate of the dummy switching element being provided with a signal with a phase reverse to a phase of an input signal provided to a gate of the switching element included in the connection switch for sampling and a source and drain of the dummy switching element being connected to each other.

4. A correlated double sampling circuit for processing signals output from a pixel section where solid-state sensing devices are arranged like a matrix, the circuit comprising:

a first capacitor for sampling and holding reset level signals corresponding to noise produced by resetting the pixel section, a first terminal of the first capacitor being connected to an output terminal of the pixel section at sampling time, and a second terminal of the first capacitor being connected to predetermined power supply for generating predetermined reference potential for sampling; and

a second capacitor connected in parallel with the first capacitor and connected via a connection switch for sampling and a connection switch for reading located in parallel with the connection switch for sampling to the second terminal of the first capacitor and the predetermined power supply for sampling and holding detected signals obtained by a photoelectric conversion in the pixel section, wherein:

the connection switch for sampling connects the second capacitor to the first capacitor and the predetermined power supply while the second capacitor samples the detected signals; and

the connection switch for reading connects the second capacitor to the first capacitor and the predetermined power supply while output signals according to a difference between the detected signals and the reset level signals obtained from electric charges sampled and held in the second capacitor and the first capacitor are read.

5. The correlated double sampling circuit according to claim 4 , wherein a width of a gate of a switching element included in the connection switch for sampling is narrower than a width of a gate of a switching element included in the connection switch for reading.

6. The correlated double sampling circuit according to claim 4 , wherein a width of a gate of a switching element included in the connection switch for sampling is a minimum width formed in a semiconductor production process.

7. The correlated double sampling circuit according to claim 4 , wherein a switching element included in the connection switch for sampling is connected to a dummy switching element, a gate of the dummy switching element being provided with a signal with a phase reverse to a phase of an input signal provided to a gate of the switching element included in the connection switch for sampling and a source and drain of the dummy switching element being connected to each other.

8. A CMOS image sensor comprising:

a pixel section where unit pixels including a photodiode and transistors are arranged like a matrix;

a scanning circuit for scanning the pixels; and

a correlated double sampling circuit for processing signals output from the pixel section, the circuit including:

a first capacitor for sampling and holding reset level signals corresponding to noise produced by resetting the pixel section, a first terminal of the first capacitor being connected to an output terminal of the pixel section at sampling time, and a second terminal of the first capacitor being connected to predetermined power supply for generating predetermined reference potential for sampling; and

a second capacitor connected in parallel with the first capacitor and connected via a connection switch for sampling and a connection switch for reading located in parallel with the connection switch for sampling to the second terminal of the first capacitor and the predetermined power supply for sampling and holding detected signals obtained by a photoelectric conversion in the pixel section, wherein:

the connection switch for sampling connects the second capacitor to the first capacitor and the predetermined power supply while the second capacitor samples the detected signals; and

the connection switch for reading connects the second capacitor to the first capacitor and the predetermined power supply while output signals according to a difference between the detected signals and the reset level signals obtained from electric charges sampled and held in the second capacitor and the first capacitor are read.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0337 →
CHANGE OF NAME Recorded Jul 22, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024982/0245 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021998/0645 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 2, 2003
From: KOKUBUN, MASATOSHI
To: FUJITSU LIMITED
Reel/Frame 013639/0430 →