Cover for ball-grid array connector

1. A cover for a ball-grid array connector, comprising a top member and no more than a first and a second side member adjoining opposing ends of the top member so that the cover is substantially U-shaped, the first and second side members each having a raised portion formed thereon for engaging a housing of the ball grid array connector by way of respective slots formed in the housing, the raised portions being configured to slide within the respective slots so that the cover is movable in relation to the housing when the cover is mated with the ball-grid array connector.

2. The cover of claim 1 , wherein the first and second side members each have two of the raised portions formed thereon.

3. The cover of claim 1 , wherein the raised portions on the first side member are spaced apart by a first distance and the raised portions on the second side member are spaced apart by a second distance unequal to the first distance.

4. The cover of claim 1 , wherein the cover is retained on the housing by a friction fit between the raised portions and the contacting surfaces of the housing.

5. The cover of claim 1 , wherein the cover is movable between a first position wherein the top portion is spaced from the housing by a first distance, and a second position wherein the top portion is spaced from the housing by a second distance, the second distance being unequal to the first distance.

6. The cover of claim 5 , wherein the top portion covers the housing when the cover is in the first position.

7. A cover for a ball-grid array connector, comprising a top member and a first and a second side member adjoining opposing ends of the top member, the first and the second side members each having a mating feature formed thereon for engaging a housing of the ball-grid array connector by way of a respective complementary mating feature formed in the housing so that the cover is movable between a first and a second position in relation to the housing, wherein the cover is completely electrically-non-conductive.

8. The cover of claim 7 , wherein the mating features formed on each of the first and second side portions comprise a raised portion adapted to engage the housing by way of a respective slot formed in the housing.

9. The cover of claim 8 , wherein the mating features formed on each of the first and second side portions comprise two of the raised portions, the raised portions on the first side member are spaced apart by a first distance, and the raised portions on the second side member are spaced apart by a second distance unequal to the first distance.

10. The cover of claim 8 , wherein the cover is retained on the housing by a friction fit between the raised portions and the contacting surfaces of the housing.

11. The cover of claim 7 , wherein the cover is movable between a first position wherein the top portion is spaced from the housing by a first distance, and a second position wherein the top portion is spaced from the housing by a second distance, the second distance being unequal to the first distance.

12. The cover of claim 11 , wherein the top portion covers the housing when the cover is in the first position.

13. A kit for mounting a ball-grid array connector on a substrate, comprising:

the ball-grid array connector, the ball-grid array connector comprising a housing, a plurality of electrical contacts mounted within the housing, and a grid array of fusible elements each being mechanically coupled to a respective one of the electrically-conductive elements; and

a cover for mating with the housing and movable between a first position on the housing wherein a portion of the cover is closely spaced from the housing so that the cover substantially isolates the electrical contacts from a heated gas flowing over the ball-grid array connector, and a second position wherein the portion of the cover is spaced from the housing so that the heated gas enters the housing and heats the electrical contacts.

14. The kit of claim 13 , wherein the housing has mating features for engaging complementary mating features on a second connector matable with the ball-grid array connector, and the cover has mating features that engage the mating features of the housing.

15. The kit of claim 14 , wherein the cover comprises a top member and a first and a second side member adjoining opposing ends of the top member, the mating features of the cover being formed on the first and second side members.

16. The kit of claim 15 , wherein the portion of the housing comprises the top portion.

17. The kit of claim 13 , wherein the heated gas enters the housing when the cover is in the second position and heats the electrical contacts so that the electrical contacts each heat a respective one of the fusible elements.

18. The kit of claim 13 , wherein the grid array of fusible elements comprises a plurality of solder balls.

19. A kit for mounting a ball-grid array connector on a substrate, comprising:

the ball-grid array connector, the ball-grid array connector comprising a housing having mating features for engaging complementary mating features on a second connector matable with the ball-grid array connector, a plurality of electrical contacts mounted on the housing, and a grid array of fusible elements each mechanically coupled to a respective one of the electrical contacts; and

a cover for mating with the ball-grid array connector, the cover comprising a top member and no more than a first and a second side member adjoining opposing ends of the top member so that the cover is substantially U-shaped, the cover having mating features that engage the mating features of the ball-grid array connector, the cover being movable between a first and a second position in relation to the ball-grid array connector.

20. The kit of claim 19 , wherein the cover comprises a top member and a first and a second side member adjoining opposing ends of the top member.

21. The kit of claim 20 , wherein the top member is closely spaced from and covers the housing when the cover is in the first position so that the electrical contacts are substantially isolated from a heated gas flowing over the ball-grid array connector, and the top member of the cover is spaced from the housing when the cover is in the second position so that the heated gas enters the housing and heats the electrical contacts.

22. The kit of claim 20 , wherein the mating features of the cover comprise a raised portion formed on each of the side members and the mating features of the cover comprise slots configured to received a respective one of the raised portions.