Method for manufacturing electronic tag
View Patent ↗In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the double-faced adhesive tape is wound on a reel. Then, this reel is contained in a case and shipped to the customer. The electronic tag is adhered to an article in the following manner. That is, the double-faced adhesive tape is cut to obtain pieces of the electronic tags, and the cover tape on the rear surface of the double-faced adhesive tape is peeled, and then, the electronic tag is adhered to the article by the use of the double-faced adhesive tape.
1. A method of manufacturing an electronic tag, comprising a first step of adhering a plurality of electronic tags to a surface of a double-faced adhesive tape, each electronic tag being provided with a rectangular lead constituting an antenna; a slit formed in a part of the lead and having an end extending to an outer edge of the lead; a semiconductor chip mounted on the lead near the slit; a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and resin for sealing the semiconductor chip and the wire; and a second step of packaging the double-faced adhesive tape to which the electronic tags are adhered, and then shipping the same.
2. The method of manufacturing an electronic tag according to claim 1 ,
wherein a surface area of the adhesive applied to the double-faced adhesive tape is made smaller than that of the conductor piece.
3. The method of manufacturing an electronic tag according to claim 1 ,
wherein perforations are provided to the double-faced adhesive tape around respective areas to which electronic tags are adhered.
4. The method of manufacturing an electronic tag according to claim 1 ,
wherein, when adhering the electronic tags to the double-faced adhesive tape, the electronic tags are oriented so that the longitudinal direction of the leads and that of the double-faced adhesive tape are parallel to each other.
5. The method of manufacturing an electronic tag according to claim 1 ,
wherein the double-faced adhesive tape to which the electronic tags are adhered is folded in a zigzag fashion and then shipped.
6. The method of manufacturing an electronic tag according to claim 1 ,
wherein the double-faced adhesive tape to which the electronic tags are adhered is wound on a reel and then shipped.
7. The method of manufacturing an electronic tag according to claim 1 , in combination with the following additional steps:
a third step of separating a portion of the double-faced adhesive tape to obtain a piece including an electronic tag from the plurality of electronic tags; and
a fourth step of attaching the electronic tag to an article by adhering the double-faced adhesive tape of the piece obtained in the third step to the article.
8. A method of manufacturing an electronic tag, which is provided with a rectangular lead constituting an antenna; a slit formed in a part of the lead and having an end extending to an outer edge of the lead; a semiconductor chip mounted on the lead near the slit; a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and resin for sealing the semiconductor chip and the wire,
the method comprising the steps of:
(a) preparing a lead frame in which a plurality of leads are arranged in parallel to each other, and both longitudinal ends of the leads are held by a pair of support frames extending in a direction perpendicular to the longitudinal direction of the leads;
(b) mounting a semiconductor chip on each lead;
(c) connecting the lead and the semiconductor chip with a wire;
(d) sealing the semiconductor chip and the wire with resin; and
(e) cutting both ends of the respective leads to separate the leads from the support frames.
9. The method of manufacturing an electronic tag according to claim 8 ,
wherein no support frame extending in the longitudinal direction of the leads is provided between the respective leads.
10. A method of manufacturing an electronic tag, the electronic tag being provided with a rectangular lead constituting an antenna; a slit formed in a part of the lead and having an end extending to an outer edge of the lead; a semiconductor chip mounted on the lead near the slit; a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and resin for sealing the semiconductor chip and the wire, comprising the steps of:
(a) preparing a lead frame to which a plurality of the leads each constituting an antenna of an electronic tag are connected via support frames;
(b) mounting a semiconductor chip on each lead of the lead frame, and then electrically connecting the lead to the semiconductor chip;
(c) sealing the semiconductor chips mounted on the leads with resin, thereby producing a plurality of electronic tags;
(d) after the step (c), adhering the lead frame having the plurality of electronic tags to a surface of a double-faced adhesive tape;
(e) after the step (d), cutting the support frames of the lead frame to remove the same;
(f) checking the quality of the electronic tags, which are adhered to the surface of the double-faced adhesive tape and electrically isolated from each other; and
(g) after the step (f), packaging the double-faced adhesive tape to which the electronic tags are adhered, and then shipping the same.
11. The method of manufacturing an electronic tag according to claim 10 ,
wherein the double-faced adhesive tape to which the electronic tags are adhered is folded in a zigzag fashion and then shipped.
12. The method of manufacturing an electronic tag according to claim 10 ,
wherein the double-faced adhesive tape to which the electronic tags are adhered is wound on a reel and then shipped.
13. The method of manufacturing an electronic tag according to claim 10 , in combination with the following additional steps:
(h) after the step (g), separating a portion of the double-faced adhesive tape to obtain a piece including an electronic tag from the plurality of electronic tags; and
(i) after the step (h), attaching the electronic tag to an article by adhering the double-faced adhesive tape of the piece obtained in step (h) to the article.
14. A method of manufacturing an electronic tag, the electronic tag being provided with a rectangular lead constituting an antenna; a slit formed in a part of the lead and having an end extending to an outer edge of the lead; a semiconductor chip mounted on the lead near the slit; a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and resin for sealing the semiconductor chip and the wire, comprising the steps of:
(a) preparing a lead frame to which a plurality of the leads each constituting an antenna of an electronic tag are connected via support frames;
(b) mounting a semiconductor chip on each lead of the lead frame, and then electrically connecting the lead to the semiconductor chip;
(c) sealing the semiconductor chips mounted on the leads with resin, thereby producing electronic tags;
(d) after the step (c), cutting the support frames of the lead frame to remove the same, thereby separating the electronic tags from the support frames;
(e) checking quality of the electronic tags;
(f) after the step (e), adhering a plurality of the electronic tags to a surface of a double-faced adhesive tape; and
(g) packaging the double-faced adhesive tape to which the plurality of electronic tags are adhered, and then shipping the same.
15. The method of manufacturing an electronic tag according to claim 14 ,
wherein the double-faced adhesive tape to which the electronic tags are adhered is folded in a zigzag fashion and then shipped.
16. The method of manufacturing an electronic tag according to claim 14 ,
wherein the double-faced adhesive tape to which the electronic tags are adhered is wound on a reel and then shipped.
17. The method of manufacturing an electronic tag according to claim 14 , in combination with the following additional steps:
(h) after the step (g), separating a portion of the double-faced adhesive tape to obtain a piece including an electronic tag from the plurality of electronic tags; and
(i) after the step (h), attaching the electronic tag to an article by adhering the double-faced adhesive tape of the piece obtained in step (h) to the article.
18. A method comprising the steps of:
providing a double-faced adhesive tape having a plurality of electronic tags disposed over substantially an entire surface thereof, each electronic tag being provided with a rectangular lead constituting an antenna; a slit formed in a part of the lead and having an end extending to an outer edge of the lead; a semiconductor chip mounted on the lead near the slit; a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and resin for sealing the semiconductor chip and the wire; and
separating a portion of the double-faced adhesive tape to obtain a piece including an electronic tag from the plurality of electronic tags.
19. A method according to claim 18 , further comprising attaching the electronic tag to an article by adhering the double-faced adhesive tape of the obtained piece to the article.