Interface for UV-curable adhesives
View Patent ↗In an embodiment of this invention, an adhesion layer is deposited on an encapsulation lid to provide strong adhesion with the UV-curable adhesive in order to improve encapsulation of an organic electronic device. The adhesion layer is comprised of a metallic layer or a ceramic layer that is thin enough to be nonopaque and thick enough to provide stronger adhesion at an interface with said UV-curable adhesive than said encapsulation lid.
1. An encapsulated organic electronic device, comprising:
a substrate;
an organic electronic device on said substrate;
an ultraviolet (“UV”)-curable adhesive on said substrate, said UV-curable adhesive surrounds a perimeter of said organic electronic device;
an adhesion layer on said UV-curable adhesive, wherein said adhesion layer is comprised of tantalum or vanadium and is nonopaque to UV radiation; and
an encapsulation lid directly on said adhesion layer, said encapsulation lid being nonopaque to UV radiation.
2. The encapsulated organic electronic device of claim 1 wherein said adhesion layer is comprised of an alloy of tantalum or an alloy of vanadium.
3. The encapsulated organic electronic device of claim 1 wherein said organic electronic device is an OLED, an organic transistor, an organic light sensor, an organic solar cell, or an organic laser.
4. A method to encapsulate an organic electronic device, comprising fabricating said encapsulated organic electronic device of claim 1 .
5. The method of claim 4 wherein said adhesion layer is thin enough to provide a reasonable TAC time.
6. The method of claim 4 wherein said adhesion layer is comprised of an alloy of tantalum or an alloy of vanadium.
7. The method of claim 4 wherein said organic electronic device is an OLED, an organic transistor, an organic light sensor, an organic solar cell, or an organic laser.
8. The method of claim 4 wherein said encapsulation lid is comprised of glass, or plastic with a barrier layer on said plastic, wherein said barrier layer is nonopaque.
9. The encapsulated organic electronic device of claim 1 , wherein said encapsulation lid is comprised of glass.
10. The encapsulated organic electronic device of claim 1 , wherein the adhesion layer is directly on the UV-curable adhesive.
11. The encapsulated organic electronic device of claim 1 , wherein the adhesion layer substantially covers one surface of the encapsulation lid.