Thermally or electrically-conductive form-in-place gap filter
View Patent ↗Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An of the compound is dispensed from a nozzle or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.
1. A method of filling a gap between a first and a second surface, the method comprising the steps of:
(a) providing a supply of a fluent, form-stable compound comprising an admixture of: (I) a cured polymer gel component; and (II) a particulate filler component;
(b) providing an orifice connected in fluid communication with the supply of the compound;
(c) dispensing from the orifice under an applied pressure an amount of the compound; and
(d) prior to or following step (c), forming the gap between the first and the second surface, the gap being at least partially filled by at least a portion of the compound dispensed in step (c),
wherein the cured gel component in the compound as dispensed from the orifice in step (c) does not exhibit further appreciable curing.
2. The method of claim 1 wherein:
the compound dispensed in step (c) is dispensed onto one of the first and the second surface; and
the gap of step (d) is formed following step (d) by disposing the one of the first and the second surfaces as adjoining the other of the first and the second surface, with the compound dispensed in step (c) being deflected therebetween to at least partially fill the gap.
3. The method of claim 1 wherein:
the gap of step (d) is formed prior to step (d); and
the compound dispensed in step (c) is dispensed into the gap.
4. The method of claim 1 wherein the compound comprises, by total weight of the components (I) and (II), between about 20–80% of the filler component.
5. The method of claim 1 wherein the filler component has a mean average particle size of between about 0.01–10 mil (0.25–250 μm).
6. The method of claim 1 wherein the gap formed in step (d) has a thickness of between about 2–100 mils (0.05–2.5 mm).
7. The method of claim 1 wherein:
the gap is a thermal gap; and
the filler component is thermally-conductive.
8. The method of claim 7 wherein the filler component has a thermal conductivity of at least about 20 W/m-K.
9. The method of claim 7 wherein the filler component is selected from the group consisting of oxide, nitride, carbide, diboride, graphite, and metal particles, and mixtures thereof.
10. The method of claim 7 wherein the compound has a thermal conductivity of at least about 0.5 W/m-K.
11. The method of claim 1 wherein the compound has a viscosity of about 15 million cps at about 25–30° C.
12. The method of claim 1 wherein the compound is provided in step (a) as charged into a container.
13. The method of claim 2 wherein the compound is substantially self-adherent to at least the one of the first and the second surface onto which the compound is dispensed in step (c).
14. The method of claim 1 wherein:
the gap is an EMI shielding gap; and
the filler component is electrically-conductive.
15. The method of claim 14 wherein the compound has an electrical volume resistivity of not greater than about 1 Ω-cm.
16. The method of claim 1 wherein the compound exhibits an EMI shielding effectiveness of-at least about 60 dB substantially over a frequency range of between about 10 MHz and about 10 GHz.
17. The method of claim 1 wherein the polymer gel component comprises a silicone polymer.