Apparatuses and method for maskless mesoscale material deposition
View Patent ↗Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.
1. An apparatus for maskless mesoscale material deposition of liquids or liquid particle suspensions in patterns on a target, said apparatus comprising:
a first module for and providing aerosolization of a liquid selected from one or more of molecular precursors and particle suspensions and for delivering aerosolized mist to a flowhead using a carrier gas;
a second module for focusing said liquid into an aerosol stream for depositing aerosol droplets or particles, said second module comprising a flowhead, a cylindrical chamber comprising a multi-stage virtual impactor for reducing a carrier gas flowrate, a heating assembly for evaporating solvents to modify fluid properties of an aerosol stream, and a shutter for interrupting flow of material to said target for patterning;
a control module for automated control and monitoring of process parameters;
a laser delivery module, comprising a processing laser, a mechanical shutter, an acousto-optic modulator, one or more delivery optics, and a focusing head;
a motion control module, comprising a motion control card, an I/O interface, a set of X-Y linear stages, a Z-axis, and one or more amplifiers; and
a computer-controlled platen;
wherein each stage of said virtual impactor comprises a disk-shaped insert with a cylindrical chamber opened at each end, an exit orifice of said chamber tapering to a diameter that is smaller than an entrance orifice of said chamber and opening to an area enclosed by a larger cylinder; and
wherein said exit orifice of a first stage and said entrance orifice of a second stage are connected to ambient conditions through a plurality of port holes in said cylinder wall.
2. The apparatus as claimed in claim 1 , wherein reduced pressure at said port holes causes a controlled amount of carrier gas to be removed from said flow, thus reducing said flowrate as it enters a next stage.
3. The apparatus as claimed in claim 2 , wherein concentration of said aerosolized mist is accomplished by removal of said carrier gas.