IP Library Granted Patent US 7,023,503
Granted Patent B2
US 7,023,503 · App. 10/347,149 · Granted Apr 4, 2006

Image sensor with photosensitive thin film transistors

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Quick Facts
Patent No.
US 7,023,503
App. No.
10/347,149
Granted
Apr 4, 2006
Kind
B2
Abstract

An image sensor array includes image sensors having photo TFTs to generate photocurrent in response to received images. The photo TFTs each have their respective gate electrodes shorted to source electrodes to increase generated photocurrent. Storage capacitors are coupled to each photo TFT and discharged upon generation of a photocurrent. Each storage capacitor is coupled to a readout TFT that passes a current from the storage capacitor to a data line. Data lines indicate location of the received image on the image sensor array.

Claims (41)

1. An image sensor for sensing received image, comprising:

a substrate;

a photo TFT disposed on the substrate to generate a photocurrent responsive to the received image, the photo TFT including,

a gate electrode,

a source electrode coupled to the gate electrode,

a drain electrode, and

a semiconductor layer coupled to the source and drain electrodes; and

a storage capacitor disposed on the substrate and coupled to the source electrode and drain electrode of the photo TFT, the storage capacitor storing a charge generated by the photocurrent.

2. The image sensor of claim 1 wherein the storage capacitor comprises a stacked capacitor.

3. The image sensor of claim 1 wherein the semiconductor layer includes a n+ layer in contact with the source and drain electrodes.

4. The image sensor of claim 1 wherein the source electrode and the drain electrode of the photo TFT each include a plurality of extending members, the extending members of the source electrode interdigitated with the extending members of the drain electrode.

5. The image sensor of claim 1 wherein the semiconductor layer of the photo TFT includes amorphous silicon.

6. The image sensor of claim 1 wherein the photo TFT includes a gate insulator disposed between the respective gate electrode and semiconductor layer and preventing contact between the gate electrode and the semiconductor layer.

7. The image sensor of claim 1 wherein the gate electrode is selected from a group consisting of Cu, Cr, Al, Ta, and Ti.

8. The image sensor of claim 1 further comprising a passivation layer disposed on the photo TFT.

9. The image sensor of claim 8 wherein the passivation layer is selected from the group consisting of silicon nitride, silicon oxide, and tantalum oxide.

10. The image sensor of claim 1 further comprising a screen disposed adjacent the photo TFT to convert received x-rays to visible light.

11. An image sensor for sensing a received image, comprising:

a substrate;

a photo TFT disposed on the substrate to generate a photocurrent responsive to the received image, the photo TFT including,

a gate electrode,

a source electrode coupled to the gate electrode,

a drain electrode, and

a semiconductor layer coupled to the source and drain electrodes;

a storage capacitor disposed on the substrate and coupled to the source electrode and drain electrode of the photo TFT, the storage capacitor storing a charge generated by the photocurrent; and

a readout TFT disposed on the substrate, including,

a gate electrode coupled to a select line,

a source electrode coupled to the drain electrode of the photo TFT,

a drain electrode coupled to a data line, and

a semiconductor layer coupled to the source and drain electrodes.

12. The image sensor of claim 11 wherein the storage capacitor comprises a stacked capacitor.

13. The image sensor of claim 12 wherein the storage capacitor includes a center electrode coupled to the source electrode of the readout TFT.

14. The image sensor of claim 11 wherein the semiconductor layer of the photo TFT includes a n+ layer in contact with the source and drain electrodes.

15. The image sensor of claim 11 wherein the source electrode and the drain electrode of the photo TFT each include a plurality of extending members, the extending members of the source electrode interdigitated with the extending members of the drain electrode.

16. The image sensor of claim 11 wherein the semiconductor layer of the photo TFT includes amorphous silicon.

17. The image sensor of claim 11 wherein the photo TFT and the readout TFT each include a gate insulator disposed between the respective gate electrode and semiconductor layer and preventing contact between the gate electrode and the semiconductor layer.

18. The image sensor of claim 11 wherein the gate electrode is selected from a group consisting of Cu, Cr, Al, Ta, and Ti.

19. The image sensor of claim 11 further comprising a passivation layer disposed on the photo TFT and the readout TFT.

20. The image sensor of claim 19 wherein the passivation layer is selected from the group consisting of silicon nitride, silicon oxide, and tantalum oxide.

21. The image sensor of claim 19 further comprising a light shield disposed on the passivation layer substantially above the readout TFT.

22. The image sensor of claim 11 further comprising a screen disposed adjacent the photo TFT to convert received x-rays to visible light.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Dec 11, 2009
From: BANK OF AMERICA, N.A.
To: PLANAR SYSTEMS, INC.
Reel/Frame 023639/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2009
From: PLANAR SYSTEMS, INC.
To: APPLE INC.
Reel/Frame 022856/0450 →
SECURITY AGREEMENT Recorded Sep 28, 2007
From: PLANAR SYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 019892/0957 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2003
From: DEN BOER, WILLEM
To: PLANAR SYSTEMS, INC.
Reel/Frame 014163/0302 →