Electrical slip ring platter multilayer printed circuit board and method for making same

1. A method for manufacturing a slip ring, comprising the steps of:

providing a first double clad copper laminate having a first side and a second side separated by a first dielectric;

providing a second double clad copper laminate having a third side and a fourth side separated by a second dielectric;

selectively removing the copper on the second and third sides to provide desired patterns in the copper;

joining the second and third sides in a desired orientation;

removing substantially all of the copper from a window in the first and fourth sides to expose the first and second dielectrics;

machining a plurality of concentric grooves within the window and into the first and second dielectrics from the first and fourth sides; and

metalizing the concentric grooves to provide a plurality of concentric metalized rings.

2. The method of claim 1 , further including the steps of:

providing at least one ring hole in each of the concentric grooves;

providing a plurality of interconnecting holes to selectively interconnect portions of the patterns formed on the second surface and the third surface;

plating the at least one ring hole in each of the concentric grooves and the plurality of interconnecting holes; and

filling the at least one plated ring hole with a dielectric during the step of joining the second and third sides.

3. The method of claim 1 , wherein the step of metalizing the concentric grooves to provide the plurality of concentric metalized rings further includes the steps of:

conditioning the exposed surfaces of the first and second dielectrics;

depositing a layer of palladium on the first and second dielectrics;

depositing a first layer of nickel over the layer of palladium;

depositing at least one layer of copper over the first layer of nickel;

depositing a second layer of nickel over the at least one layer of copper to fully encapsulate the at least one layer of copper; and

depositing a layer of gold over the second layer of nickel.

4. The method of claim 3 , wherein the step of conditioning the exposed surfaces of the first and second dielectrics includes the steps of:

performing a desmear process on the exposed surfaces of the first and second dielectrics;

subjecting the exposed surfaces of the first and second dielectrics to an alkaline bath; and

rinsing the exposed surfaces of the first and second dielectrics after the alkaline bath.

5. The method of claim 4 , wherein the alkaline bath is a solution of 15 to 25 percent by volume of fifty percent sodium hydroxide, 0.9 to 1.8 percent aliphatic carboxylic acid salt, 0.09 to 0.45 percent monoethanolamine and deionized water.

6. The method of claim 1 , wherein the copper outside of the window is electrically connected to each of the plurality of concentric metalized rings and functions as a plating bus.

7. A method for manufacturing a slip ring, comprising the steps of:

providing a first single clad copper laminate having a first dielectric on a first side and a first copper sheet on a second side;

providing a second single clad copper laminate having a second copper sheet on a third side and a second dielectric on a fourth side;

selectively removing the copper on the second and third sides to provide desired patterns in the copper;

joining the second and third sides in a desired orientation;

machining a plurality of concentric grooves within a window and into the first and second dielectrics from the first and fourth sides; and

metalizing the concentric grooves to provide a plurality of concentric metalized rings.

8. The method of claim 7 , further including the steps of:

providing at least one ring hole in each of the concentric grooves;

providing a plurality of interconnecting holes to selectively interconnect portions of the patterns formed on the second surface and the third surface;

plating the at least one ring hole in each of the concentric grooves and the plurality of interconnecting holes; and

filling the at least one plated ring hole with a dielectric during the step of joining the second and third sides.

9. The method of claim 7 , wherein the step of metalizing the concentric grooves to provide the plurality of concentric metalized rings further includes the steps of:

conditioning the exposed surfaces of the first and second dielectrics;

depositing a layer of palladium on the first and second dielectrics;

depositing a first layer of nickel over the layer of palladium;

depositing at least one layer of copper over the first layer of nickel;

depositing a second layer of nickel on the at least one layer of copper to fully encapsulate the at least one layer of copper; and

depositing a layer of gold over the second layer of nickel.

10. The method of claim 9 , wherein the step of conditioning the exposed surfaces of the first and second dielectrics includes the steps of:

performing a desmear process on the exposed surfaces of the first and second dielectrics;

subjecting the exposed surfaces of the first and second dielectrics to an alkaline bath; and

rinsing the exposed surfaces of the first and second dielectrics after the alkaline bath.

11. The method of claim 10 , wherein the alkaline bath is a solution of 15 to 25 percent by volume of fifty percent sodium hydroxide, 0.9 to 1.8 percent aliphatic carboxylic acid salt, 0.09 to 0.45 percent monoethanolamine and deionized water.

12. The method of claim 7 , wherein a copper layer formed outside of the window is electrically connected to each of the plurality of concentric metalized rings and functions as a plating bus.

13. A slip ring, comprising:

a first single clad copper laminate having a first dielectric on a first side and a first copper sheet on a second side; and

a second single clad copper laminate having a second copper sheet on a third side and a second dielectric on a fourth side, wherein the copper on the second and third sides is selectively removed to provide desired patterns in the copper, and wherein the second and third sides are joined in a desired orientation, where a plurality of concentric grooves are machined into the first and second dielectrics from the first and fourth sides, and where the concentric grooves are metalized to provide a plurality of concentric metalized rings.

14. The slip ring of claim 13 , wherein at least one ring hole is provided in each of the concentric grooves and a plurality of interconnecting holes is provided to selectively interconnect portions of the patterns formed on the second surface and the third surface, and wherein the at least one ring hole in each of the concentric grooves and the plurality of interconnecting holes are plated and the at least one plated ring hole is filled with a dielectric when the second and third sides are joined.

15. The slip ring of claim 13 , wherein the concentric grooves are metalized by conditioning the exposed surfaces of the first and second dielectrics, depositing a layer of palladium on the first and second dielectrics, depositing a first layer of nickel over the layer of palladium, depositing at least one layer of copper over the first layer of nickel, depositing a second layer of nickel over the at least one layer of copper to fully encapsulate the at least one layer of copper and depositing a layer of gold over the second layer of nickel.

16. The slip ring of claim 15 , wherein the exposed surfaces of the first and second dielectrics are conditioned by performing a desmear process on the exposed surfaces of the first and second dielectrics, subjecting the exposed surfaces of the first and second dielectrics to an alkaline bath and rinsing the exposed surfaces of the first and second dielectrics after the alkaline bath.

17. The slip ring of claim 16 , wherein the alkaline bath is a solution of 15 to 25 percent by volume of fifty percent sodium hydroxide, 0.9 to 1.8 percent aliphatic carboxylic acid salt, 0.09 to 0.45 percent monoethanolamine and deionized water.

18. A slip ring, comprising:

a first single clad copper laminate having a first dielectric on a first side and a first copper sheet on a second side; and

a second single clad copper laminate having a second copper sheet on a third side and a second dielectric on a fourth side, wherein the copper on the second and third sides is selectively removed to provide desired patterns in the copper, and wherein the second and third sides are joined in a desired orientation, where a plurality of concentric grooves are machined into the first and second dielectrics from the first and fourth sides, and where the concentric grooves are metalized to provide a plurality of concentric metalized rings that have a peel strength greater than about four pounds per square inch (PSI).

19. The slip ring of claim 18 , wherein at least one ring hole is provided in each of the concentric grooves and a plurality of interconnecting holes is provided to selectively interconnect portions of the patterns formed on the second surface and the third surface, and wherein the at least one ring hole in each of the concentric grooves and the plurality of interconnecting holes are plated and the at least one plated ring hole is filled with a dielectric when the second and third sides are joined in a desired orientation.

20. The slip ring of claim 18 , wherein the concentric grooves are metalized by conditioning the exposed surfaces of the first and second dielectrics, depositing a layer of palladium on the first and second dielectrics, depositing a first layer of nickel over the layer of palladium, depositing at least one layer of copper over the first layer of nickel, depositing a second layer of nickel over the at least one layer of copper to fully encapsulate the at least one layer of copper and depositing a layer of gold over the second layer of nickel.

21. The slip ring of claim 20 , wherein the exposed surfaces of the first and second dielectrics are conditioned by performing a desmear process on the exposed surfaces of the first and second dielectrics, subjecting the exposed surfaces of the first and second dielectrics to an alkaline bath and rinsing the exposed surfaces of the first and second dielectrics after the alkaline bath.

22. The slip ring of claim 21 , wherein the alkaline bath is a solution of 15 to 25 percent by volume of fifty percent sodium hydroxide, 0.9 to 1.8 percent aliphatic carboxylic acid salt, 0.09 to 0.45 percent monoethanolamine and deionized water.

23. A method for manufacturing a slip ring, comprising the steps of:

providing a first double clad copper laminate having a first side and a second side separated by a first dielectric;

selectively removing the copper on the second side to provide desired patterns in the copper;

removing substantially all of the copper from a window in the first side to expose the first dielectric;

machining a plurality of concentric grooves within the window and into the first dielectric from the first side; and

metalizing the concentric grooves to provide a plurality of concentric metalized rings.

24. The method of claim 23 , further including the steps of:

providing at least one ring hole in each of the concentric grooves;

providing a plurality of interconnecting holes to selectively interconnect portions of the patterns formed on the second surface;

plating the at least one ring hole in each of the concentric grooves and the plurality of interconnecting holes; and

filling the at least one plated ring hole with a dielectric.

25. The method of claim 23 , wherein the step of metalizing the concentric grooves to provide the plurality of concentric metalized rings further includes the steps of:

conditioning the exposed surfaces of the first dielectric;

depositing a layer of palladium on the first dielectric;

depositing a first layer of nickel over the layer of palladium;

depositing at least one layer of copper over the first layer of nickel;

depositing a second layer of nickel over the at least one layer of copper to fully encapsulate the at least one layer of copper; and

depositing a layer of gold over the second layer of nickel.

26. The method of claim 25 , wherein the step of conditioning the exposed surfaces of the first dielectric includes the steps of:

performing a desmear process on the exposed surfaces of the first dielectric;

subjecting the exposed surfaces of the first dielectric to an alkaline bath; and

rinsing the exposed surfaces of the first dielectric after the alkaline bath.

27. The method of claim 26 , wherein the alkaline bath is a solution of 15 to 25 percent by volume of fifty percent sodium hydroxide, 0.9 to 1.8 percent aliphatic carboxylic acid salt, 0.09 to 0.45 percent monoethanolamine and deionized water.

28. The method of claim 23 , wherein the copper outside of the window is electrically connected to each of the plurality of concentric metalized rings and functions as a plating bus.

29. A slip ring, comprising:

a first single clad copper laminate having a first dielectric on a first side and a first copper sheet on a second side, wherein the copper sheet on the second side is selectively removed to provide desired patterns in the copper sheet, and wherein a plurality of concentric grooves are machined into the first dielectric from the first side, where the concentric grooves are metalized to provide a plurality of concentric metalized rings.

30. The slip ring of claim 29 , wherein at least one ring hole is provided in each of the concentric grooves and a plurality of interconnecting holes is provided to selectively interconnect portions of the patterns formed on the second surface, and wherein the at least one ring hole in each of the concentric grooves and the plurality of interconnecting holes are plated and the at least one plated ring hole is filled with a dielectric.

31. The slip ring of claim 29 , wherein the concentric grooves are metalized by conditioning the exposed surfaces of the first dielectric, depositing a layer of palladium on the first dielectric, depositing a first layer of nickel over the layer of palladium, depositing at least one layer of copper over the first layer of nickel, depositing a second layer of nickel over the at least one layer of copper to fully encapsulate the at least one layer of copper and depositing a layer of gold over the second layer of nickel.

32. The slip ring of claim 31 , wherein the exposed surfaces of the first dielectric are conditioned by performing a desmear process on the exposed surfaces of the first dielectric, subjecting the exposed surfaces of the first dielectric to an alkaline bath and rinsing the exposed surfaces of the first dielectric after the alkaline bath.

33. The slip ring of claim 32 , wherein the alkaline bath is a solution of 15 to 25 percent by volume of fifty percent sodium hydroxide, 0.9 to 1.8 percent aliphatic carboxylic acid salt, 0.09 to 0.45 percent monoethanolamine and deionized water.