High conductivity inks with improved adhesion
Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.
1. A conductive ink composition for deposition onto a substrate comprising a mixture of
(a) a metallo-organic decomposition compound;
(b) a metal flake or powder present in an amount 1 to 20 times the amount of the metallo-organic decomposition compound by weight; and
(c) a latex polymer adhesion promoting additive.
2. The composition of claim 1 , wherein the metal flake is silver.
3. The composition of claim 2 , wherein the adhesion promoting additive is a polymer or mixture of polymers selected from the group consisting of polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride, polyester, polystyrene, polyurethane, copolymers thereof, acrylic and styrenic copolymers, or a primary diamine.
4. The composition of claim 1 , wherein the metallo-organic decomposition compound is silver neodecanoate.
5. The composition of claim 1 , wherein the metal powder has an average particle size of from 0.05 to 15 μm.
6. The composition of claim 1 , further comprising an organic liquid vehicle.
7. The composition of claim 6 wherein the organic liquid vehicle is present in an amount of 0.05 to 100 times the amount of the metallo-organic decomposition compound by weight.
8. A conductive ink composition for deposition onto a substrate comprising a mixture of
(a) a metallo-organic decomposition compound;
(b) a metal flake or powder present in an amount 1 to 20 times the amount of the metallo organic decomposition compound by weight; and
(c) a latex polymer adhesion promoting additive in an amount 0.05 to 2.0 times the amount of the metallo-organic decomposition compound by weight.
9. The composition of claim 8 , further comprising an organic liquid vehicle.
10. The composition of claim 9 , wherein the organic liquid vehicle is present in an amount of 0.05 to 100 times the amount of the metallo-organic decomposition compound by weight.
11. The composition of claim 8 , wherein the metal powder has an average particle size of from 0.05 to 15 μm.
12. A method for preparing an electrically conductive ink composition for deposition onto a substrate comprising mixing
(a) metallo-organic decomposition compound;
(b) metal flake or powder present in an amount 1 to 20 times the amount of the metallo-organic decomposition compound by weight; and
(c) a latex polymer adhesion promoting additive in the amount 0.05 to 2.0 times the amount of the metallo-organic decomposition compound by weight to form an electrically conductive ink composition.
13. The method of claim 12 , further comprising roll milling the mixture to produce a homogeneous composition.
14. The method of claim 12 , wherein the metal powder has an average particle size of from 0.05 to 15 μm.
15. The method of claim 12 , wherein the adhesion promoting additive is a polymer or mixture of polymers selected from the group consisting of polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride, polyester, polystyrene, polyurethane, copolymers thereof, acrylic and styrenic copolymers, or a primary diamine.
16. The method of claim 12 , wherein the metal is selected from copper and silver.
17. A conductive ink composition for deposition onto a substrate comprising a mixture of
(a) a metallo-organic decomposition compound;
(b) a metal flake or powder; and
(c) a latex polymer adhesion promoting additive present in an amount 0.05 to 2.0 times the amount of the metallo-organic decomposition compound by weight.
18. The composition of claim 17 , wherein the metal is silver.
19. The composition of claim 17 , wherein the adhesion promoting additive is a polymer or mixture of polymers selected from the group consisting of polyvinylidine chloride, polyvinyl chloride, polyethylene vinyl chloride, polyester, polystyrene, polyurethane, copolymers thereof, or a primary diamine.
20. The composition of claim 17 , wherein the metallo-organic decomposition compound is silver neodecanoate.
21. The composition of claim 17 , wherein the metal powder has an average particle size of from 0.05 to 15 μm.
22. The composition of claim 17 , further comprising an organic liquid vehicle.
23. The composition of claim 22 , wherein the organic liquid vehicle is present in an amount of 0.05 to 100 times the amount of the metallo-organic decomposition compound by weight.