Microwave-attenuating composite materials, methods for preparing the same, intermediates for preparing the same, devices containing the same, methods of preparing such a device, and methods of attenuating microwaves
View Patent ↗The present invention provides microwave attenuating, filled composite materials which contain a polymer or ceramic matrix and metallic tubules and processes for making the same and devices which contain such materials.
1. A composite material, which comprises:
(a) a polymer matrix comprising an elastomeric polymer; and
(b) a plurality of metal microtubules dispersed within said polymer matrix, wherein said metal microtubules are one or more microtubules selected from the group consisting of nickel-coated lipid tubules, cobalt-coated lipid tubules, iron-coated lipid tubules, cobalt over copper-coated lipid tubules, iron-alloy coated lipid tubules, nickel-alloy coated lipid tubules, and boron-alloy coated lipid tubules,
wherein said plurality of metal microtubules further comprises one or more metal microtubules selected from the group consisting of copper-coated halloysite tubules, nickel-coated halloysite tubules, cobalt-coated halloysite tubules, iron-coated halloysite tubules, nickel over copper-coated halloysite tubules, cobalt over copper-coated halloysite tubules, iron-alloy coated halloysite tubules, nickel-alloy coated halloysite tubules, and boron-alloy coated halloysite tubules.
2. The composite material of claim 1 , wherein said polymer matrix comprises a polymer selected from the group consisting of vinyl resins, styrene-butadiene resins, natural rubber resins, nitrile rubbers, acrylic resins, polyurethanes, epoxy resins, and siloxanes.
3. An electronic device, which comprises a microwave-attenuating composite, wherein said microwave-attenuating composite is the composite of claim 1 .
4. The device of claim 3 , wherein said electronic device is selected from the group consisting of cellular telephones, pagers, palm-sized computers, lap-top computers, radios, radar systems, and microwave ovens.
5. A method for manufacturing an electronic device, said method comprising:
incorporating a microwave-attenuating composite material in an electronic device,
wherein said microwave-attenuating composite material is the composite of claim 1 .
6. A method for attenuating microwaves between a source point and a detection point by a method, which comprises:
placing a microwave-attenuating composite material between said source point and said detection point, wherein said microwave-attenuating composite material is the composite of claim 1 .
7. The composite material of claim 1 , wherein said metal microtubules have a length ranging from 2 to 200 μm, an outside diameter ranging from 0.5 to 3.0 μm, and an inside diameter ranging from 0 to 0.5 μm.
8. A method for preparing a composite material, comprising:
(1) incorporating a plurality of metal microtubules in a polymer or ceramic matrix;
(2) mixing a liquid base component with said metal microtubles, to obtain a first mixture;
(3) adding a curing agent to said first mixture, to obtain a second mixture; and
(4) loading said second mixture into a mold,
wherein said curing agent is selected from the group consisting of diisocyanate prepolymer containing a plasticizer, a polyoxypropylenediamine, and a copolymer of methylhydrosilane and dimethylsiloxane.
9. The method of claim 8 , further comprising heating said second mixture to a temperature of 40° C. to 60° C.
10. The method of claim 8 , wherein said loading comprises pouring or forcing under pressure.
11. The method of claim 8 , wherein said mold is an electronic device.
12. The method of claim 8 , wherein said metal microtubules are incorporated into a polymer matrix.
13. The method of claim 12 , wherein said polymer matrix comprises an elastomeric polymer.
14. The method of claim 12 , wherein said polymer matrix comprises a polymer selected from the group consisting of vinyl resins, styrene-butadiene resins, natural rubber resins, nitrile rubbers, acrylic resins, polyurethanes, epoxy resins, and siloxanes.
15. The method of claim 8 , wherein said metal microtubules are incorporated into a ceramic matrix.
16. The method of claim 8 , wherein said plurality of metal microtubules comprises one or more metal microtubules selected from the group consisting of copper-coated lipid tubules, nickel-coated lipid tubules, cobalt-coated lipid tubules, iron-coated lipid tubules, nickel over copper-coated lipid tubules, cobalt over copper-coated lipid tubules, iron-alloy coated lipid tubules, nickel-alloy coated lipid tubules, and boron-alloy coated lipid tubules.
17. The method of claim 8 , wherein said plurality of metal microtubules comprises one or more metal microtubules selected from the group consisting of copper-coated halloysite tubules, nickel-coated halloysite tubules, cobalt-coated halloysite tubules, iron-coated halloysite tubules, nickel over copper-coated halloysite tubules, cobalt over copper-coated halloysite tubules, iron-alloy coated halloysite tubules, nickel-alloy coated halloysite tubules, and boron-alloy coated halloysite tubules.
18. The method of claim 8 , wherein said plurality of metal microtubules comprises one or more metal microtubules selected from the group consisting of copper-coated lipid tubules, nickel-coated lipid tubules, cobalt-coated lipid tubules, iron-coated lipid tubules, nickel over copper-coated lipid tubules, cobalt over copper-coated lipid tubules, iron-alloy coated lipid tubules, nickel-alloy coated lipid tubules, boron-alloy coated lipid tubules, copper-coated halloysite tubules, nickel-coated halloysite tubules, cobalt-coated halloysite tubules, iron-coated halloysite tubules, nickel over copper-coated halloysite tubules, cobalt over copper-coated halloysite tubules, iron-alloy coated halloysite tubules, nickel-alloy coated halloysite tubules, and boron-alloy coated halloysite tubules.
19. The method of claim 8 , wherein said metal microtubules have a length ranging from 2 to 200 μm, an outside diameter ranging from 0.5 to 3.0 μm, and an inside diameter ranging from 0 to 0.5 μm.
20. A composition, which comprises:
(a) an polymer matrix precursor comprising a liquid base component and a liquid curing agent; and
(b) a plurality of metal microtubules dispersed within said polymer matrix precursor.
21. The composition of claim 20 , wherein said curing agent is selected from the group consisting of diisocyanate prepolymer containing a plasticizer, a polyoxypropylenediamine, and a copolymer of methylhydrosilane and dimethylsiloxane.
22. The method of claim 20 , wherein said plurality of metal microtubules comprises one or more metal microtubules selected from the group consisting of copper-coated lipid tubules, nickel-coated lipid tubules, cobalt-coated lipid tubules, iron-coated lipid tubules, nickel over copper-coated lipid tubules, cobalt over copper-coated lipid tubules, iron-alloy coated lipid tubules, nickel-alloy coated lipid tubules, and boron-alloy coated lipid tubules.
23. The method of claim 20 , wherein said plurality of metal microtubules comprises one or more metal microtubules selected from the group consisting of copper-coated halloysite tubules, nickel-coated halloysite tubules, cobalt-coated halloysite tubules, iron-coated halloysite tubules, nickel over copper-coated halloysite tubules, cobalt over copper-coated halloysite tubules, iron-alloy coated halloysite tubules, nickel-alloy coated halloysite tubules, and boron-alloy coated halloysite tubules.
24. The method of claim 20 , wherein said plurality of metal microtubules comprises one or more metal microtubules selected from the group consisting of copper-coated lipid tubules, nickel-coated lipid tubules, cobalt-coated lipid tubules, iron-coated lipid tubules, nickel over copper-coated lipid tubules, cobalt over copper-coated lipid tubules, iron-alloy coated lipid tubules, nickel-alloy coated lipid tubules, boron-alloy coated lipid tubules, copper-coated halloysite tubules, nickel-coated halloysite tubules, cobalt-coated halloysite tubules, iron-coated halloysite tubules, nickel over copper-coated halloysite tubules, cobalt over copper-coated halloysite tubules, iron-alloy coated halloysite tubules, nickel-alloy coated halloysite tubules, and boron-alloy coated halloysite tubules.
25. The method of claim 20 , wherein said metal microtubules have a length ranging from 2 to 200 μm, an outside diameter ranging from 0.5 to 3.0 μm, and an inside diameter ranging from 0 to 0.5 μm.
26. A composite material, which comprises:
(a) a polymer matrix; and
(b) a plurality of metal microtubules dispersed within said polymer matrix, wherein said metal microtubules are one or more microtubules selected from the group consisting of nickel-coated lipid tubules, cobalt-coated lipid tubules, iron-coated lipid tubules, cobalt over copper-coated lipid tubules, iron-alloy coated lipid tubules, nickel-alloy coated lipid tubules, and boron-alloy coated lipid tubules,
wherein said plurality of metal microtubules further comprises one or more metal microtubules selected from the group consisting of copper-coated halloysite tubules, nickel-coated halloysite tubules, cobalt-coated halloysite tubules, iron-coated halloysite tubules, nickel over copper-coated halloysite tubules, cobalt over copper-coated halloysite tubules, iron-alloy coated halloysite tubules, nickel-alloy coated halloysite tubules, and boron-alloy coated halloysite tubules.
27. The composite material of claim 26 , which comprises a polymer matrix and wherein said polymer matrix comprises a polymer selected from the group consisting of vinyl resins, styrene-butadiene resins, natural rubber resins, nitrile rubbers, acrylic resins, polyurethanes, epoxy resins, and siloxanes.
28. An electronic device, which comprises a microwave-attenuating composite, wherein said microwave-attenuating composite is the composite of claim 26 .
29. The device of claim 28 , wherein said electronic device is selected from the group consisting of cellular telephones, pagers, palm-sized computers, lap-top computers, radios, radar systems, and microwave ovens.
30. A method for manufacturing an electronic device, said method comprising:
incorporating a microwave-attenuating composite material in an electronic device,
wherein said microwave-attenuating composite material is the composite of claim 26 .
31. A method for attenuating microwaves between a source point and a detection point by a method, which comprises:
placing a microwave-attenuating composite material between said source point and said detection point, wherein said microwave-attenuating composite material is the composite of claim 26 .
32. The composite material of claim 26 , wherein said metal microtubules have a length ranging from 2 to 200 μm, an outside diameter ranging from 0.5 to 3.0 μm, and an inside diameter ranging from 0 to 0.5 μm.
33. A composite material, which comprises:
(a) a polymer matrix; and
(b) a plurality of metal microtubules dispersed within said polymer matrix, wherein said metal microtubules are one or more microtubules selected from the group consisting of copper-coated halloysite tubules, nickel-coated halloysite tubules, cobalt-coated halloysite tubules, iron-coated halloysite tubules, nickel over copper-coated halloysite tubules, cobalt over copper-coated halloysite tubules, iron-alloy coated halloysite tubules, nickel-alloy coated halloysite tubules, and boron-alloy coated halloysite tubules.
34. The composite material of claim 33 , wherein said polymer matrix comprises an elastomeric polymer.
35. The composite material of claim 33 , which comprises a polymer matrix and wherein said polymer matrix comprises a polymer selected from the group consisting of vinyl resins, styrene-butadiene resins, natural rubber resins, nitrile rubbers, acrylic resins, polyurethanes, epoxy resins, and siloxanes.
36. An electronic device, which comprises a microwave-attenuating composite, wherein said microwave-attenuating composite is the composite of claim 33 .
37. The device of claim 36 , wherein said electronic device is selected from the group consisting of cellular telephones, pagers, palm-sized computers, lap-top computers, radios, radar systems, and microwave ovens.
38. A method for manufacturing an electronic device, said method comprising:
incorporating a microwave-attenuating composite material in an electronic device,
wherein said microwave-attenuating composite material is the composite of claim 33 .
39. A method for attenuating microwaves between a source point and a detection point by a method, which comprises:
placing a microwave-attenuating composite material between said source point and said detection point, wherein said microwave-attenuating composite material is the composite of claim 33 .
40. The composite material of claim 33 , wherein (b) further comprises one or more metal microtubules selected from the group consisting of copper-coated lipid tubules, nickel-coated lipid tubules, cobalt-coated lipid tubules, iron-coated lipid tubules, nickel over copper-coated lipid tubules, cobalt over copper-coated lipid tubules, iron-alloy coated lipid tubules, nickel-alloy coated lipid tubules, and boron-alloy coated lipid tubules.
41. The composite material of claim 33 , wherein said metal microtubules have a length ranging from 2 to 200 μm, an outside diameter ranging from 0.5 to 3.0 μm, and an inside diameter ranging from 0 to 0.5 μm.
42. A composite material, which comprises:
(a) a ceramic matrix; and
(b) a plurality of metal microtubules dispersed within said ceramic matrix, wherein said metal microtubules are one or more microtubules selected from the group consisting of copper-coated lipid tubules, nickel-coated lipid tubules, cobalt-coated lipid tubules, iron-coated lipid tubules, nickel over copper-coated lipid tubules, cobalt over copper-coated lipid tubules, iron-alloy coated lipid tubules, nickel-alloy coated lipid tubules, and boron-alloy coated lipid tubules,
wherein said plurality of metal microtubules further comprises one or more metal microtubules selected from the group consisting of copper-coated halloysite tubules, nickel-coated halloysite tubules, cobalt-coated halloysite tubules, iron-coated halloysite tubules, nickel over copper-coated halloysite tubules, cobalt over copper-coated halloysite tubules, iron-alloy coated halloysite tubules, nickel-alloy coated halloysite tubules, and boron-alloy coated halloysite tubules.
43. An electronic device, which comprises a microwave-attenuating composite, wherein said microwave-attenuating composite is the composite of claim 42 .
44. The device of claim 43 , wherein said electronic device is selected from the group consisting of cellular telephones, pagers, palm-sized computers, lap-top computers, radios, radar systems, and microwave ovens.
45. A method for manufacturing an electronic device, said method comprising:
incorporating a microwave-attenuating composite material in an electronic device,
wherein said microwave-attenuating composite material is the composite of claim 42 .
46. A method for attenuating microwaves between a source point and a detection point by a method, which comprises:
placing a microwave-attenuating composite material between said source point and said detection point, wherein said microwave-attenuating composite material is the composite of claim 42 .
47. The composite material of claim 42 , wherein said metal microtubules have a length ranging from 2 to 200 μm, an outside diameter ranging from 0.5 to 3.0 μm, and an inside diameter ranging from 0 to 0.5 μm.
48. A composite material, which comprises:
(a) a ceramic matrix; and
(b) a plurality of metal microtubules dispersed within said ceramic matrix, wherein said metal microtubules are one or more microtubules selected from the group consisting of copper-coated halloysite tubules, nickel-coated halloysite tubules, cobalt-coated halloysite tubules, iron-coated halloysite tubules, nickel over copper-coated halloysite tubules, cobalt over copper-coated halloysite tubules, iron-alloy coated halloysite tubules, nickel-alloy coated halloysite tubules, and boron-alloy coated halloysite tubules.
49. The composite material of claim 48 , wherein (b) further comprises one or more metal microtubules selected from the group consisting of copper-coated lipid tubules, nickel-coated lipid tubules, cobalt-coated lipid tubules, iron-coated lipid tubules, nickel over copper-coated lipid tubules, cobalt over copper-coated lipid tubules, iron-alloy coated lipid tubules, nickel-alloy coated lipid tubules, and boron-alloy coated lipid tubules.
50. An electronic device, which comprises a microwave-attenuating composite, wherein said microwave-attenuating composite is the composite of claim 48 .
51. The device of claim 50 , wherein said electronic device is selected from the group consisting of cellular telephones, pagers, palm-sized computers, lap-top computers, radios, radar systems, and microwave ovens.
52. A method for manufacturing an electronic device, said method comprising:
incorporating a microwave-attenuating composite material in an electronic device,
wherein said microwave-attenuating composite material is the composite of claim 48 .
53. A method for attenuating microwaves between a source point and a detection point by a method, which comprises:
placing a microwave-attenuating composite material between said source point and said detection point, wherein said microwave-attenuating composite material is the composite of claim 48 .
54. The composite material of claim 48 , wherein said metal microtubules have a length ranging from 2 to 200 μm, an outside diameter ranging from 0.5 to 3.0 μm, and an inside diameter ranging from 0 to 0.5 μm.