High conductivity inks with low minimum curing temperatures
Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.
1. A conductive ink composition for deposition onto a substrate comprising a mixture of
(a) a metallo-organic decomposition compound;
(b) a metal powder present in an amount 1 to 20 times the amount of the metallo-organic decomposition compound by weight; and
(c) a latex polymer cure temperature lowering agent.
2. The composition of claim 1 , wherein the metal powder is silver.
3. The composition of claim 1 , wherein the cure temperature lowering agent is a latex polymer selected from polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride, or copolymers thereof.
4. The composition of claim 1 , wherein the cure temperature lowering agent is present in an amount of 0.5 to 10% weight in the composition.
5. The composition of claim 1 , wherein the metal powder has an average particle size of from about 0.05 to 15 μm.
6. The composition of claim 1 , further comprising an organic liquid vehicle.
7. The composition of claim 6 , wherein the organic liquid vehicle is present in an amount of 0.05 to 100 times the amount of the metallo-organic decomposition compound by weight.
8. A conductive ink composition for deposition onto a substrate comprising a mixture of
(a) a metallo-organic decomposition compound;
(b) a metal powder present in an amount 1 to 20 times the amount of the metallo-organic decomposition compound by weight; and
(c) a latex polymer cure temperature lowering agent in an amount of about 0.5 to 10% by weight.
9. The composition of claim 8 , further comprising an organic liquid vehicle.
10. The composition of claim 9 , wherein the organic liquid vehicle is present in an amount of 0.05 to 100 times the amount of the metallo-organic decomposition compound by weight.
11. The composition of claim 8 , wherein the cure temperature lowering agent is a latex polymer selected from polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride, or copolymers thereof.
12. The composition of claim 8 , wherein the metal powder has an average particle size of from about 0.05 to 15 μm.
13. A method for preparing an electrically conductive ink composition for deposition onto a substrate comprising mixing
(a) a metallo-organic decomposition compound;
(b) a metal powder present in an amount 1 to 20 times the amount of the metallo- organic decomposition compound by weight; and
(c) a latex polymer cure temperature lowering agent in the amount of 0.5 to 10% by weight to form an electrically conductive ink composition.
14. The method of claim 13 , further comprising roll milling the mixture to produce a homogeneous composition.
15. The method of claim 13 , wherein the metal powder has an average particle size of from about 0.05 to 15 μm.
16. The method of claim 13 , wherein the cure temperature lowering agent is a latex polymer selected from polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride, or copolymers thereof.
17. The method of claim 13 , wherein the metal is silver.
18. A conductive ink composition for deposition onto a substrate comprising a mixture of:
(a) a reactive organic medium, wherein the reactive organic medium is a metallo-organic decomposition compound;
(b) a metal powder;
(c) a latex polymer cure temperature lowering agent; and
(d) an organic liquid vehicle present in an amount of 0.05 to 100 times the amount of the metallo-organic decomposition compound by weight.
19. The composition of claim 18 , wherein the metal powder is silver.
20. The composition of claim 18 , wherein the cure temperature lowering agent is a latex polymer selected from the group consisting of polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride, or copolymers thereof.
21. The composition of claim 18 , wherein the metal powder is present in an amount 1 to 20 times the amount of the metallo-organic decomposition compound by weight.
22. The Composition of claim 18 , wherein the cure temperature lowering agent is present in an amount of 0.5 to 10% weight in the composition.
23. The Composition of claim 18 , wherein the metal powder has an average particle size of from about 0.05 to 15 μm.