Chip level hermetic and biocompatible electronics package using SOI wafers
View Patent ↗The invention is directed to a hermetically packaged and implantable integrated circuit for electronics that is made by producing streets in silicon-on-insulator chips that are subsequently coated with a selected electrically insulating thin film prior to completing the dicing process to yield an individual chip. A thin-layered circuit may transmit light, allowing a photodetector to respond to transmitted light to stimulate a retina, for example. Discrete electronic components may be placed in the three-dimensional street area of the integrated circuit package, yielding a completely integrated hermetic package that is implantable in living tissue.
1. An electronics package suitable for implantation in living tissue comprising:
a silicon-on-insulator chip assembly comprising a silicon layer on top of an insulator substrate and said silicon layer bonded to said insulator substrate; and
a hermetic electrically insulating thin film covering the top and the sides of said silicon layer and extending the sides of said insulator substrate to a partial thickness of said insulator substrate.
2. The electronics package according to claim 1 wherein said silicon layer comprises an integrated circuit.
3. The electronics package according to claim 1 wherein said insulator substrate has an exposed area of said insulator substrate that is covered by said hermetic electrically insulating thin film.
4. The electronics package according to claim 1 wherein said hermetic electrically insulating thin film is comprised of alumina.
5. The electronics package according to claim 1 wherein said hermetic electrically insulating thin film is comprised of diamond.
6. The electronics package according to claim 1 wherein said hermetic electrically insulating thin film is biocompatible.
7. The electronics package according to claim 1 wherein said insulator substrate is biocompatible.
8. The electronics package according to claim 1 wherein at least one discrete electronic component is bonded to said insulator substrate and is covered by said hermetic electrically insulating thin film.
9. The electronics package according to claim 8 wherein said at least one discrete electronic component is further comprised of a capacitor.
10. The electronics package according to claim 8 wherein said at least one discrete electronic component is embedded.
11. An electronics package suitable for implantation in living tissue comprising:
a silicon-on-insulator chip assembly comprising a silicon layer on top of an insulator substrate and said silicon layer bonded to said insulator substrate;
a hermetic electrically insulating thin film covering the top and the sides of said silicon layer and extending the sides of said insulator substrate to a partial thickness of said insulator substrate; and
wherein said insulator substrate is transparent to light.
12. The electronics package according to claim 11 wherein said silicon layer contains at least one photoelectric cell that produces an electric impulse when stimulated by electromagnetic radiation.
13. The electronics package according to claim 11 wherein said silicon layer contains at least one photoelectric cell that produces an electric impulse when stimulated by light.
14. The electronics package according to claim 11 wherein said insulator substrate is glass.
15. The electronics package according to claim 11 wherein said insulator substrate is sapphire.
16. The electronics package according to claim 11 wherein said electronics package comprises a neural prosthesis.
17. The electronics package according to claim 7 wherein said insulator substrate is sapphire, diamond, silica, or at least one oxide ceramic.
18. The electronics package according to claim 1 wherein said hermetic electrically insulating thin film diamond such as ultra-nanocrystalline diamond or ceramics, such as alumina.