Optoelectronic component and method for the production thereof, module and device comprising a module of this type

1. An optoelectronic component comprising:

a flexible chip support having a first main face with an opening or recess formed therein;

a semiconductor chip mounted on the chip support;

a pair of conductor tracks on the first main face of the chip support for electrically connecting the semiconductor chip; and

a housing frame disposed on the first main face of the chip support and filled with a radiation-permeable medium, the housing frame comprising a retaining peg,

wherein the opening or recess is engaged by the retaining peg.

2. The component of claim 1 , wherein the semiconductor chip is a light emitting diode chip.

3. The component of claim 2 , wherein the inside face of the housing frame is embodied as a reflector, which deflects electromagnetic radiation, projected laterally from the semiconductor chip, in a projection direction or deflects electromagnetic radiation, striking outside the component and to be received by the semiconductor chip, toward the semiconductor chip.

4. The component of claim 1 , further comprising a shielding layer on a second main face of the chip support, which is opposite to the first main face, for shielding against interfering waves.

5. A module having a plurality of components of claim 2 , further comprising a substrate element having a plurality of openings, and wherein the components are each secured to the chip support on one component side of the substrate element in such a way that each housing frame protrudes into or passes through a respective one of the openings.

6. The module of claim 5 , wherein the substrate element is a flexible substrate element.

7. The module of claim 5 , wherein electrical line structures on the substrate element are embodied for electrically connecting the components.

8. An optical display device having a module of claim 5 , wherein a surface of the substrate element on the projection side is radiation-absorbent.

9. The optical display device of claim 8 , wherein the surface of the substrate element on the projection side is blackened.

10. An illumination or backlighting device having a module of claim 5 , wherein a surface of the substrate element on the projection side is diffusely reflective.

11. The illumination or backlighting device of claim 10 , wherein the surface of the substrate element on the projection side is white.

12. The illumination or backlighting device of claim 10 , further comprising a scattering plate disposed downstream of the substrate element on the projection side.

13. A liquid crystal display, wherein a device of claim 10 is disposed on a side remote from an observation side.

14. A method for producing and packaging a plurality of components of claim 1 , comprising the steps of:

a) furnishing a chip support film strip;

b) producing a plurality of pairs of strip conductors, each pair for one semiconductor chip on the chip support film strip;

c) embodying one housing frame at each place on the chip support film strip where a semiconductor chip or a semiconductor chip array of an individual component is provided;

d) mounting a plurality of semiconductor chips on the chip support film strip; and

e) at least partly filling the radiation slots, formed by the housing frames, with a filler compound.

15. The method of claim 14 , wherein the chip support film strip, with the mounted and encapsulated semiconductor chips, is rolled up into a packaging unit containing a plurality of surface-mountable components.

16. The method of claim 14 , wherein step c) is accomplished by means of injection molding or extrusion.

17. The component of claim 1 , wherein the radiation-permeable medium is a filler compound.

18. The component of claim 17 , wherein the filler compound contains at least one of a luminescent material and a diffusor material.