IP Library Granted Patent US 6,845,004
Granted Patent B2
US 6,845,004 · App. 10/365,209 · Granted Jan 18, 2005

Protecting resin-encapsulated components

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Quick Facts
Patent No.
US 6,845,004
App. No.
10/365,209
Granted
Jan 18, 2005
Kind
B2
Abstract

A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.

Claims (18)

1. A method of protecting surface mount capacitors from moisture and oxygen corrosion, the capacitor having at least one capacitor element and terminals connected to the capacitor element, said method comprising the steps of:

applying a thermally curable pre-coat resin to a portion of the terminals of the capacitor; and

encapsulating the capacitor element with a protective resin;

wherein the pre-coat resin is substantially rigid at ambient temperatures and flexible at high temperatures.

2. A method of protecting surface mount capacitors according to claim 1 further comprising the step of selecting the pre-coat resin from thermally curable epoxy resins.

3. A method of protecting surface mount capacitors according to claim 1 further comprising the step of selecting the pre-coat resin from thermally curable lactone-containing epoxy resins.

4. A method of protecting surface mount capacitors according to claim 1 , wherein said pre-coat resin applying step is performed using a wiper to apply the pre-coat resin onto the portion of the terminals of the capacitor.

5. A method of protecting surface mount capacitors according to claim 1 , wherein said pre-coat resin applying step is performed using a brush to apply the pre-coat resin onto the portion of the terminals of the capacitor.

6. A method of protecting surface mount capacitors according to claim 1 , wherein said pre-coat resin applying step is performed using a counter-rotating wheel assembly to apply the pre-coat resin onto the portion of the terminals of the capacitor.

7. A method of protecting surface mount capacitors from moisture and oxygen corrosion, the capacitor having at least one capacitor element, an anode riser wire connecting said capacitor element to an anode terminal and a cathode terminal connected to said cathode capacitor element, said method comprising the steps of:

applying a thermally curable pre-coat resin to a portion of at least one of said anode terminal or said cathode terminal; and

encapsulating the capacitor element with a protective resin;

wherein the pre-coat resin is substantially rigid at ambient temperatures and flexible at high temperatures.

8. A method of protecting surface mount capacitors according to claim 7 further comprising the step of selecting the pre-coat resin from thermally curable epoxy resins.

9. A method of protecting surface mount capacitors according to claim 7 further comprising the step of selecting the pre-coat resin from thermally curable lactone-containing epoxy resins.

10. A method of protecting surface mount capacitors according to claim 7 , wherein said pre-coat resin applying step is performed using a wiper to apply the pre-coat resin onto the portion of the terminals of the capacitor.

11. A method of protecting surface mount capacitors according to claim 7 , wherein said pre-coat resin applying step is performed using a brush to apply the pre-coat resin onto the portion of the terminals of the capacitor.

12. A method of protecting surface mount capacitors according to claim 7 , wherein said pre-coat resin applying step is performed using a counter-rotating wheel assembly to apply the pre-coat resin onto the portion of the terminals of the capacitor.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →
SECURITY AGREEMENT Recorded May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
SECURITY INTEREST Recorded Oct 5, 2010
From: KEMET ELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A. AS AGENT
Reel/Frame 025150/0023 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 022892/0795 Recorded May 18, 2010
From: K FINANCING, LLC
To: KEMET CORPORATION
Reel/Frame 024397/0774 →
SECURITY AGREEMENT Recorded Jul 1, 2009
From: KEMET CORPORATION
To: K FINANCING, LLC
Reel/Frame 022892/0795 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2003
From: MELODY, BRIAN JOHN; KINARD, JOHN TONY; PERSICO, DANIEL F.; STOLARSKI, CHRIS; LESSNER, PHILLIP MICHAEL; CHEN, QINGPING; PRITCHARD, KIM; HARRINGTON, ALBERT KENNEDY; WHEELER, DAVID ALEXANDER
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 014326/0685 →