A torque motor ( 20 ) has a base ( 21 ), four polepieces ( 22 A, 22 B, 22 C, 22 D) extending away from the base, the polepieces being separated from one another and being arranged at the corners of an imaginary polygon ( 27 ), each polepiece terminating in a pole ( 23 A, 23 B, 23 C, 23 D); a coil ( 24 A, 24 B, 24 C, 24 D) surrounding each of the polepieces; an armature ( 26 ) pivotally mounted on the base, the armature having a portion arranged to move toward and away from an associated one of the poles, respectively, to define a variable-reluctance air gap (g A , g B , g C , g D ) therebetween; a permanent magnet ( 29 ) mounted on one of the base and armature and polarized in a direction parallel to the pivotal axis of the armature; and wherein at least a portion of the torque motor is formed by a MEMS technique; whereby the coil may be selectively energized to cause the armature to pivot about its axis.
1. A coil-on-a-substrate, comprising:
a one-piece wafer substrate having a first surface and a second surface;
a continuous wound deep-reactive ion-etched first recess extending into said substrate from said first surface;
a continuous wound deep-reactive ion-etched second recess extending into said substrate from said second surface;
said second recess communicating with said first recess through a passageway in such a manner that the lengths of said recesses will be connected in series with one another;
a dielectric coating provided on the portions of said substrate that face into said recesses and passageway; and
an electrically-conductive material in said recesses to form two series-connected oppositely-wound coils.
2. A coil-on-a-substrate as set forth in claim 1 wherein each recess has a substantially rectangular transverse cross-section.
3. A coil-on-a-substrate as set forth in claim 1 wherein the transverse cross-section of said recess is substantially constant along its length.
4. A coil-on-a-substrate as set forth in claim 2 wherein each recess has a depth-to-width ratio of at least about 10.
5. A coil-on-a-substrate as set forth in claim 1 wherein said substrate is silicon.
6. A coil-on-a-substrate as set forth in claim 5 wherein said dielectric coating is silicon dioxide.
7. A coil-on-a-substrate as set forth in claim 6 wherein the thickness of said dielectric coating is not greater than about 1 micron.
8. A coil-on-a-substrate as set forth in claim 1 wherein the adjacent convolutions of each coil are separated by a nominal distance of about 5 microns.
9. A coil-on-a-substrate as set forth in claim 1 wherein at least a portion of said coil is formed by a MEMS technique.
10. A coil-on-a-substrate as set forth in claim 1 wherein each recess is wound in a generally rectangular pattern.
11. A coil-on-a-substrate as set forth in claim 1 wherein said first surface is substantially planar.
12. A coil-on-a-substrate as set forth in claim 1 wherein said second surface is substantially planar.
13. A coil-on-a-substrate as set forth in claim 1 wherein said conductive material is copper.
14. A coil-on-a-substrate as set forth in claim 1 wherein the thickness of said substrate between said first and second surfaces is about 300 microns.
15. A coil-on-a-substrate as set forth in claim 14 wherein the depth of each recess is about 100 microns.