Wiring structure in a semiconductor device
View Patent ↗A wiring structure includes a first wiring having a first wiring width, and a second wiring formed in the same layer as a layer in which the first wiring is formed, and having a second wiring width greater than the first wiring width. The second wiring is electrically connected to the first wiring. Both of the first and second wirings are composed of copper or an alloy predominantly containing copper therein. The first and second wirings have the same thickness as each other. A ratio of an area of the second wiring to an area of the first wiring is N:1 where N is equal to or greater than 2,000 and equal to or smaller than 200,000,000 (2,000≦N≦200,000,000).
1. A wiring structure including an upper wiring layer, and a lower wiring layer electrically connected to said upper wiring layer through a via contact,
wherein all of said upper wiring layer, said lower wiring layer and said via contact are composed of copper or an alloy predominantly containing copper therein,
a ratio in volume of at least one of said upper and lower wiring layers to said via contact is N:1 where N is equal to or smaller than 9, and
said via contact has a diameter equal to or smaller than 0.20 micrometers.
2. The wiring structure as set forth in claim 1 , wherein N is equal to or smaller than 3, and said via contact has a diameter equal to or smaller than 0.14 micrometers.
3. The wiring structure as set forth in claim 1 , wherein a wiring width of each of said upper and lower wiring layers is defined by a maximum diameter of a circle inscribed with said via contact, said circle having a center identical with a center of said via contact.
4. The wiring structure as set forth in claim 1 , wherein said upper and lower wiring layers are annealed at a temperature equal to or higher than 150° C.
5. The wiring structure as set forth in claim 1 , wherein if said upper and lower wiring layers are composed of an alloy predominantly containing copper therein, said upper and lower wiring layers are annealed at a temperature higher than a temperature at which said upper and lower wiring layers are annealed if said upper and lower wiring layers are composed of copper.
6. The wiring structure as set forth in claim 2 , wherein a wiring width of each of said upper and lower wiring layers is defined by a maximum diameter of a circle inscribed with said via contact, said circle having a center identical with a center of said via contact.
7. The wiring structure as set forth in claim 2 , wherein said upper and lower wiring layers are annealed at a temperature equal to or higher than 150° C.
8. The wiring structure as set forth in claim 2 , wherein if said upper and lower wiring layers are composed of an alloy predominantly containing copper therein, said upper and lower wiring layers are annealed at a temperature higher than a temperature at which said upper and lower wiring layers are annealed if said upper and lower wiring layers are composed of copper.