IP Library Granted Patent US 6,973,110
Granted Patent B2
US 6,973,110 · App. 10/372,987 · Granted Dec 6, 2005

Monolithic laser configuration

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Quick Facts
Patent No.
US 6,973,110
App. No.
10/372,987
Granted
Dec 6, 2005
Kind
B2
Abstract

A monolithic laser configuration has a substrate, a laser diode disposed on the substrate for generating a light beam, a photodetector disposed on the substrate in the path of the light beam for receiving at least one part of the light beam, and a deflection device disposed on the substrate for deflecting the light beam substantially perpendicularly to the substrate surface. The monolithic laser configuration can advantageously be used in a coupling module with a plastic SMT housing of a standard configuration, it being possible to produce the optical access through an opening in the leadframe of the coupling module.

Claims (41)

1. A monolithic laser configuration, comprising:

a surface;

a laser diode for generating a light beam;

a deflection device receiving the light beam and deflecting the light beam substantially perpendicularly to said surface of the monolithic laser configuration; and

a photodetector disposed in a path of the light beam between said laser diode and said deflection device and receiving at least one part of the light beam, said photodetector detecting a portion of the light beam emitted from said laser diode before the light beam falls on said deflection device, said photodetector being offset with respect to a center axis of the light beam;

said laser diode, said photodetector, and said deflection device being integrated monolithically in one component.

2. The monolithic laser configuration according to claim 1 , wherein said photodetector is formed as a continuation of a laser layer.

3. The monolithic laser configuration according to claim 1 , wherein said photodetector is disposed in a forward coupled-out light path of said laser diode.

4. The monolithic laser configuration according to claim 1 , further comprising a housing covering said laser diode, said photodetector and said deflection device, said housing enclosing the beam path.

5. The monolithic laser configuration according to claim 1 , wherein said laser diode includes an edge-emitting laser diode chip.

6. The monolithic laser configuration according to claim 1 , wherein said laser diode includes a Fabry-Perot laser chip.

7. The monolithic laser configuration according to claim 1 , wherein said laser diode is a distributed feedback laser chip.

8. The monolithic laser configuration according to claim 1 , further comprising a substrate and said deflection device being formed by an interface of said substrate.

9. The monolithic laser configuration according to claim 8 , wherein said interface runs at an angle of approximately 45° relative to the surface of the monolithic laser configuration.

10. The monolithic laser configuration according to claim 8 , wherein said interface is a mirrored surface of said substrate.

11. A method for producing a monolithic laser configuration according to claim 1 , which comprises the steps of:

producing a semiconductor substrate;

etching into the semiconductor substrate for producing an interface functioning as a deflection device.

12. The method according to claim 11 , which further comprises:

forming the semiconductor substrate from InP and epitaxial layers; and

using an HCl—HBr etching solution during the etching step.

13. The method according to claim 12 , which further comprises setting a mixture ratio of HCl to HBr to be approximately two to one.

14. The method according to claim 11 , which further comprises carrying out the etching step at a temperature of approximately 5° Celsius.

15. A coupling module for coupling a light beam to an optical waveguide, the coupling module comprising:

a leadframe;

a submount disposed on said leadframe; and

a monolithic laser configuration disposed on said submount and, containing:

a surface;

a laser diode for generating a light beam;

a deflection device receiving the light beam and deflecting the light beam substantially perpendicularly to said surface; and

a photodetector disposed in a path of the light beam between said laser diode and said deflection device and receiving at least one part of the light beam, said photodetector detecting a portion of the light beam emitted from said laser diode before the light beam falls on said deflection device, said photodetector being offset with respect to a center axis of the light beam;

said laser diode, said photodetector, and said deflection device being integrated monolithically in one component.

16. The coupling module according to claim 15 , wherein said leadframe has a cutout formed therein and through said cutout the light beam is deflected by said deflection device.

17. The coupling module according to claim 16 , further comprising a lens disposed in the path of the light beam in a region of said cutout for optically influencing the light beam.

18. The coupling module according to claim 17 , wherein said lens is monolithically integrated into said submount.

19. The coupling module according to claim 15 , further comprising a surface mounted technology housing and said monolithic laser configuration is disposed in said surface mounted technology housing.

20. A laser configuration, comprising:

a surface;

a laser diode for generating a light beam;

a deflection device receiving the light beam and deflecting the light beam substantially perpendicularly to said surface of the monolithic laser configuration; and

a photodetector disposed in a path of the light beam between said laser diode and said deflection device and receiving at least one part of the light beam, said photodetector detecting a portion of the light beam emitted from said laser diode before the light beam falls on said deflection device, said photodetector being offset with respect to a center axis of the light beam.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2017
From: QUARTERHILL INC.
To: WI-LAN INC.
Reel/Frame 043167/0149 →
MERGER AND CHANGE OF NAME Recorded Jun 20, 2017
From: WI-LAN INC.; QUARTERHILL INC.
To: QUARTERHILL INC.
Reel/Frame 042902/0973 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2009
From: INFINEON TECHNOLOGIES AG
To: WI-LAN INC.
Reel/Frame 022951/0022 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2005
From: ALTHAUS, HANS-LUDWIG; BORCHERT, BERND; BORCHERT, INKA CATRIN; FIDORRA, SYBILLE; JANIAK, KLEMENS
To: INFINEON TECHNOLOGIES AG
Reel/Frame 017063/0659 →