IP Library › Granted Patent US 6,899,612
Granted Patent B2
US 6,899,612 · App. 10/373,513 · Granted May 31, 2005

Polishing pad apparatus and methods

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Quick Facts
Patent No.
US 6,899,612
App. No.
10/373,513
Granted
May 31, 2005
Kind
B2
Abstract

Polishing pads having a surface morphology that results in a high degree of planarization efficiency when planarizing a wafer surface are disclosed. One conditioned polishing pad is non-porous and has a surface height distribution with a surface roughness Ra<3 microns. Another conditioned polishing pad is porous and has a surface height probability distribution with a pad surface height Ratio R≧60%, or alternatively has an asymmetric surface height probability distribution characterized by an asymmetry factor A 10 ≦0.50. Methods of pad conditioning and planarizing a wafer using the polishing pads are also disclosed.

Claims (7)

1. A polishing pad suitable for chemical mechanical planarization, comprising:

a porous pad conditioned surface having a substantially flat surface characterized by a surface height probability distribution with a pad surface height ratio R≧60%.

2. The polishing pad of claim 1 , wherein R is ≧70%.

3. A polishing pad suitable for chemical mechanical planarization, comprising:

a porous pad conditioned surface characterized by an asymmetric surface height probability distribution having an asymmetry factor A 10 ≦0.50.

4. The polishing pad of claim 3 wherein the surface height probability distribution has a pad surface height ratio R≧60%.

5. The polishing pad of 4 wherein R is ≧70%.