ESD-protected slider and head gimbal assembly
View Patent ↗A Head Gimbal Assembly (HGA) for use in a disk drive and comprising an ESD-protected slider comprising a head formed on a slider substrate. The slider may comprise an electrical-isolation circuit; an electrically-resistive path between head input connections and the slider; or both isolation circuits and resistive paths for reducing electrostatic charge on the slider while remaining connected during disk drive operations.
1. A ESD-protected slider for use in a disk drive, comprising:
a head formed on a slider substrate, the head having a first lead and a second lead;
a first electrically resistive path connected at one end to the first lead and to the slider substrate at another end; and
a second electrically resistive path connected at one end to the second lead and to the slider substrate at another end,
wherein the first and second electrically resistive paths are of sufficient resistance to reduce electrostatic charge on the slider and to remain connected during operation of the disk drive.
2. The slider as claimed in claim 1 , wherein each of the first and second resistive paths is characterized by a resistance in the range of 2 kilo ohms to 100 kilo-ohms.
3. The slider as claimed in claim 1 , wherein each of the first and second resistive paths is characterized by a resistance in the range of 5 kilo ohms to 50 kilo-ohms.
4. The slider as claimed in claim 1 , wherein each of the first and second resistive paths is formed integrally on the slider substrate.
5. The slider as claimed in claim 1 , wherein each of the first and second resistive paths is external to the slider substrate.
6. The slider as claimed in claim 1 , wherein the slider substrate is a composite material.
7. The slider as claimed in claim 6 , wherein the composite material is a titanium carbide compound.
8. The slider as claimed in claim 6 , wherein the composite material is an aluminum compound.
9. The slider as claimed in claim 1 , wherein each of the first and second resistive paths comprises a plurality of resistors placed in at least one of a series and parallel formation.
10. A Head Gimbal Assembly (HGA) for use in a disk drive, comprising:
a) an ESD-protected slider comprising:
a head formed on a slider substrate, the head having a first lead and a second lead;
a first electrically resistive path connected at one end to the first lead and to the slider substrate at another end; and
a second electrically resistive path connected at one end to the second lead and to the slider substrate at another end;
wherein the first and second electrically resistive paths are of sufficient resistance to reduce electrostatic charge on the slider and to remain connected during operation of the disk drive;
b) a suspension for supporting the head during disk drive operation; and
c) a conductor array for connecting the head to a signal processing circuit.
11. The HGA as claimed in claim 10 , wherein the slider is conductively coupled to the suspension.
12. The HGA as claimed in claim 11 , wherein the slider is conductively coupled to the suspension via a conductive adhesive.
13. The HGA as claimed in claim 12 , wherein the conductive adhesive is an Epoxy.
14. The HGA as claimed in claim 11 , wherein the slider is conductively coupled to the suspension via a substrate pad conductively connected to the slider substrate, a suspension pad conductively connected to the suspension, and a conductive path connected at one end to the substrate pad and to the suspension pad at another end.
15. The HGA as claimed in claim 10 , wherein each of the first and second resistive paths is characterized by a resistance in the range of 2 kilo-ohms to 100 kilo-ohms.
16. The HGA as claimed in claim 10 , wherein each of the first and second resistive paths is characterized by a resistance in the range of 5 kilo-ohms to 50 kilo-ohms.
17. The HGA as claimed in claim 10 , wherein each of the first and second resistive paths is formed integrally on the slider substrate.
18. The HGA as claimed in claim 10 , wherein each of the first and second resistive paths is external to the slider substrate.
19. The HGA as claimed in claim 10 , wherein the slider substrate is a composite material.
20. The HGA as claimed in claim 19 , wherein the composite material is at least one of a titanium carbide compound and an aluminum compound.
21. The HGA as claimed in claim 10 , wherein each of the first and second resistive paths comprises a plurality of resistors placed in at least one of a series and parallel formation.
22. A Head Gimbal Assembly (HGA) for use in a disk drive, comprising:
a) an ESD-protected slider comprising:
a head formed on a slider substrate, the head having a first head input node and a first head element node and a second head input node and a second head element node;
a first electrical-isolation circuit connected at one end to the first head input node and to the first head element node at another end;
a second electrical-isolation circuit connected at one end to the second head input node and to the second head element node at another end, wherein the first and second electrical-isolation circuits reduce a coupling of the electrostatic charge to the head and to remain connected during operation of the disk drive;
a first electrically resistive path connected at one end to the first head input node and to the slider substrate at another end; and
a second electrically resistive path connected at one end to the second head input node and to the slider substrate at another end,
wherein the first and second electrically resistive paths are of sufficient resistance to reduce electrostatic charge on the slider and to remain connected during operation of the disk drive;
b) a suspension for supporting the head during disk drive operation; and
c) a conductor array for connecting the head to a signal processing circuit.
23. The HGA as claimed in claim 22 , wherein each of the first and second electrical-isolation circuits is an array of electrical switches, configured to protect the head from electrostatic discharge or electrical overstress events.
24. The HGA as claimed in claim 23 , wherein the array of electrical switches comprises a plurality of transistors configured to protect the head from electrostatic discharge or electrical overstress events.
25. The HGA as claimed in claim 22 , wherein each of the first and second electrical-isolation circuits is an array of diodes, configured to protect the head from electrostatic discharge or electrical overstress events.
26. The HGA as claimed in claim 25 , wherein the array of diodes comprises a plurality of diodes placed in parallel formation and configured to allow current flows of opposite direction to one another.
27. The HGA as claimed in claim 26 , wherein the array of diodes comprises at least one reverse-biased diode.
28. The HGA as claimed in claim 22 , wherein the slider is conductively coupled to the suspension.
29. The HGA as claimed in claim 28 , wherein the slider is conductively coupled to the suspension via a conductive adhesive.
30. The HGA as claimed in claim 29 , wherein the conductive adhesive is an Epoxy.
31. The HGA as claimed in claim 28 , wherein the slider is conductively coupled to the suspension via a substrate pad conductively connected to the slider substrate, a suspension pad conductively connected to the suspension, and a conductive path connected at one end to the substrate pad and to the suspension pad at another end.
32. The HGA as claimed in claim 22 , wherein each of the first and second resistive paths is characterized by a resistance in the range of 2 kilo-ohms to 100 kilo-ohms.
33. The HGA as claimed in claim 22 , wherein each of the first and second resistive paths is characterized by a resistance in the range of 5 kilo-ohms to 50 kilo-ohms.
34. The HGA as claimed in claim 22 , wherein each of the first and second resistive paths is formed integrally on the slider substrate.
35. The HGA as claimed in claim 22 , wherein each of the first and second resistive paths is external to the slider substrate.
36. The HGA as claimed in claim 22 , wherein the slider substrate is a composite material.
37. The HGA as claimed in claim 36 , wherein the composite material is at least one of a titanium carbide compound and an aluminum compound.
38. The HGA as claimed in claim 22 , wherein each of the first and second resistive paths comprises a plurality of resistors placed in at least one of a series and parallel formation.
39. An ESD-protected slider comprising:
a head formed on a slider substrate, the head having a first head input node and a first head element node, and a second head input node and a second head element node;
a first electrical-isolation circuit connected at one end to the first head input node and to the first head element node at another end;
a second electrical-isolation circuit connected at one end to the second head input node and to the second head element node at another end, wherein the first and second electrical-isolation circuits reduce a coupling of the electrostatic charge to the head and to remain connected during operation of the disk drive;
a first electrically resistive path connected at one end to the first head input node and to the slider substrate at another end; and
a second electrically resistive path connected at one end to the second head input node and to the slider substrate at another end, wherein the first and second electrically resistive paths are of sufficient resistance to reduce electrostatic charge on the slider and to remain connected during operation of the disk drive.
40. The slider as claimed in claim 39 , wherein each of the first and second resistive paths is characterized by a resistance in the range of 2 kilo-ohms to 100 kilo-ohms.
41. The slider as claimed in claim 39 , wherein each of the first and second resistive paths is characterized by a resistance in the range of 5 kilo-ohms to 50 kilo-ohms.
42. The slider as claimed in claim 39 , wherein each of the first and second resistive paths is formed integrally on the slider substrate.
43. The slider as claimed in claim 39 , wherein each of the first and second resistive paths is external to the slider substrate.
44. The slider as claimed in claim 39 , wherein the slider substrate is a composite material.
45. The slider as claimed in claim 44 , wherein the composite material is at least one of a titanium carbide compound and aluminum compound.
46. The slider as claimed in claim 39 , wherein each of the first and second resistive paths comprises a plurality of resistors placed in at least one of a series and parallel formation.
47. The slider as claimed in claim 39 , wherein each of the first and second electrical-isolation circuits is an array of electrical switches configured to protect the head from electrostatic discharge or electrical overstress events.
48. The slider as claimed in claim 47 , wherein the array of electrical switches comprises a plurality of transistors configured to protect the head from electrostatic discharge or electrical overstress events.
49. The slider as claimed in claim 39 , wherein each of the first and second electrical-isolation circuits is an array of diodes configured to protect the head from electrostatic discharge or electrical overstress events.
50. The slider as claimed in claim 49 , wherein the array of diodes comprises a plurality of diodes placed in parallel formation and configured to allow current flows of opposite direction to one another.
51. The slider as claimed in claim 50 , wherein the array of diodes comprises at least one reverse-biased diode.