High speed optical transmission assembly
View Patent ↗An optical assembly that can be utilized as a transmitter in a high data rate optical transceiver system is presented. The optical assembly allows a laser driver to be mounted near the laser and allows the laser driver and the laser to utilize a common heat sink. Further, assembly can be performed reliably and quickly to reduce the cost of production of the optical assembly.
1. An optical assembly, comprising:
a feed-through assembly, the feed-through assembly including an access mount for a laser driver, a heat sink, a layered ceramic assembly, and a sealant ring formed around the layered ceramic assembly and the heat sink, the sealant ring forming a hermetic seal with the layered ceramic assembly and the heat sink;
a laser assembly mounted on the heat sink,
wherein the access mount for the laser driver and the laser assembly are both thermally coupled to the heat sink, and
the access mount for the laser driver is formed in the layered ceramic assembly, and the heat sink is mounted to the layered ceramic assembly on the side opposite the access mount to the layered ceramic assembly.
2. The assembly of claim 1 , wherein the sealant ring includes a spacer mounted on the layered ceramic assembly, at least one support that can be formed around and sealed to the layered ceramic assembly, the heat sink, and the spacer, and a sealant ring attached to the at least one support.
3. The assembly of claim 1 , wherein the layered ceramic assembly includes at least one layer of ceramic insulator metallized to form a electrical connections between the laser driver mounted in the access mount for the laser driver and the laser assembly.
4. The assembly of claim 1 , wherein the laser assembly is mounted directly on the heat sink.
5. The assembly of claim 4 , wherein the laser assembly includes a laser, a spiral inductor, and a resistor.
6. The assembly of claim 5 , wherein the spiral inductor and resistor are chosen to match an output impedance of the laser driver to an input impedance of the laser.
7. The assembly of claim 1 , further including a photodiode coupled opposite a laser of the laser assembly, the photodiode being electrically coupled to provide feedback signals to a laser driver mounted in the access mount for the laser driver.
8. The assembly of claim 1 , further including a cap with a ball lens connected to the sealant ring, wherein the laser driver is enclosed between the cap and the sealant ring.
9. The assembly of claim 8 , wherein the cap is positioned according to a type, wherein the type represents various zones of the location of the laser beam with respect to the feed-through assembly.
10. A method of producing an optical assembly, comprising:
forming a feed-through assembly, including assembling insulating ceramic layers, the feed-through assembly including an access for a laser driver formed in the assembled insulating ceramic layers wherein the laser driver will be thermally coupled to a heat sink;
forming a laser assembly;
mounting the laser assembly on the feed-through assembly such that the laser assembly is thermally coupled to the heat sink;
attaching the heat sink to the assembled insulating ceramic layers on the side opposite the access;
sealing supports to the insulating ceramic layers and the heat sink; and
attaching a sealant ring to the supports.
11. The method of claim 10 , wherein assembling insulating ceramic layers include metallizing at least one insulating ceramic layer and cofiring the at least one insulating ceramic layer to form a single unit.
12. The method of claim 10 , wherein forming the laser assembly includes forming a submount, mounting a laser on the submount, and mounting a spiral inductor on the submount.
13. The method of claim 12 , wherein a resistor formed on the submount and the spiral inductor are chosen to match an output impedance of the laser driver with the input impedance of the laser.
14. An optical assembly, comprising:
means for electrically coupling a laser driver to a laser assembly with a feed-through assembly, the feed-through assembly including a layered ceramic assembly, an access mount for a laser driver formed in the layered ceramic assembly, and a heat sink mounted to the layered ceramic assembly on the side opposite the access mount to the layered ceramic assembly; and
means for thermally coupling the laser driver and the laser assembly to a heat sink.
15. The assembly of claim 14 , further including means for coupling laser emission from the laser assembly to an optical fiber.
16. The assembly of claim 15 , wherein the means for coupling laser emission includes means for sealing the laser assembly within a hermetic seal.
17. The assembly of claim 14 , wherein the means for electrically coupling a laser driver to a laser assembly includes means for providing impedance matching between the laser driver and a laser on the laser assembly.