IP Library Granted Patent US 6,924,540
Granted Patent B2
US 6,924,540 · App. 10/388,617 · Granted Aug 2, 2005

Integrated circuit device installed structure and installation method

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Quick Facts
Patent No.
US 6,924,540
App. No.
10/388,617
Granted
Aug 2, 2005
Kind
B2
Abstract

A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. The integrated circuit device having a photo detecting part, leads and wires for connection therebetween are encapsulated in an encapsulation section. A recess is formed on the light incident surface of the encapsulation section above the photo detecting part, to thin the encapsulation section on the surface of the photo detecting part and thereby reduce the energy of light absorbed by the encapsulation section.

Claims (13)

1. A packaging structure of an integrated circuit device having a photo detecting part, comprising:

a lead electrically connected with the integrated circuit device; and

an encapsulation section for encapsulating the integrated circuit device and the lead, wherein the encapsulation section has a recess formed on a light incident surface above the photo detecting part,

wherein the recess has an outline allowing discernment of the position of a predetermined pin of the integrated circuit device when viewed from top.

2. The structure of claim 1 , wherein the outline of an open top end of the recess is a rectangle, and one corner of the rectangle is different in shape from the other corners.

3. The structure of claim 2 , wherein the one corner protrudes toward the center of the rectangle.

4. A packaging structure of an integrated circuit device having a photo detecting part, comprising:

a lead electrically connected with the integrated circuit device; and

an encapsulation section for encapsulating the integrated circuit device and the lead,

wherein the encapsulation section has a hole formed above the photo detecting part, and

wherein the hole has an outline allowing discernment of the position of a predetermined pin of the integrated circuit device when viewed from top.

5. The structure of claim 4 , wherein the outline of an open top end of the hole is a rectangle, and one corner of the rectangle is different in shape from the other corners.

6. The structure of claim 5 , wherein the one corner protrudes toward the center of the rectangle.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2014
From: PANASONIC CORPORATION
To: COLLABO INNOVATIONS, INC.
Reel/Frame 033021/0806 →
LIEN Recorded Jan 13, 2014
From: COLLABO INNOVATIONS, INC.
To: PANASONIC CORPORATION
Reel/Frame 031997/0445 →
CHANGE OF NAME Recorded Jan 8, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 031947/0358 →
REQUEST FOR CORRECTION OF NOTICE OF RECORDATION OF ASSIGNMENT DOCUMENT Recorded Oct 14, 2003
From: SHIRAKAWA, YASUFUMI; TANIGUCHI, MASAKI; FUKUDA, HIDEO; SHIMIZU, YUZO; ESAKI, SHINYA
To: MATSUSHITA ELECTRIC INDUSTRIAL CO LTD.
Reel/Frame 014587/0504 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2003
From: SHIRAKAWA, YASUFUMI; TANIGUCHI, MASAKI; FUKUDA, HIDEO; SHIMIZU, YUZO; ESAKAI, SHINYA
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 013883/0409 →