Adherent all-gold electrode structure for lithium niobate based devices and the method of fabrication
View Patent ↗An electrode structure wherein galvanic corrosion at adhesion layers formed between electrodes and electronic or electro-optic substrates is eliminated. The electrode structure includes an electro-optic crystalline substrate, an amorphous layer disposed on the crystalline substrate, the amorphous layer having a composition substantially similar to a composition of the crystalline substrate, and a gold layer disposed directly on the amorphous layer. The amorphous layer is created using ion sputtering etching techniques that clean and activate the surface of the crystalline substrate such that the gold layer is able to adhere to it.
1. A method of providing an electrode on a substrate comprising:
a) exposing at least a portion of the substrate to a plasma so as to create an amorphous portion on a surface thereof; and
b) depositing an electrode directly on a surface of the amorphous portion.
2. A method according to claim 1 , wherein the electrode comprises gold.
3. A method according to claim 1 , wherein the plasma comprises argon ion.
4. A method according to claim 1 , wherein step (a) comprises exposing the substrate using a power above 200 Watts.
5. A method according to claim 1 , wherein step (a) comprises exposing the substrate using a power of about 600 Watts.
6. An electrode structure comprising:
a substrate including a crystalline portion and an amorphous portion, wherein the amorphous portion is formed by a surface modification, for activation and roughening of an upper layer of the crystalline portion;
a homogeneous electrode deposited on the substrate such that it is in direct contact with the amorphous portion.
7. An electrode structure according to claim 6 , wherein the substrate comprises one of an electronic and an electro-optic substrate.
8. An electrode structure according to claim 6 , wherein the electrode comprises gold.
9. An electrode structure according to claim 6 , wherein the substrate comprises one of lithium niobate, lithium tantalite, silicon, and gallium arsenide.
10. An electrode structure according to claim 9 , wherein the electrode comprises one of gold, copper, silver, platinum, and alloys thereof.
11. An electrode structure according to claim 6 , wherein the electrode comprises one of gold, copper, silver, platinum, and alloys thereof.
12. An electrode structure according to claim 6 , wherein the amorphous portion comprises an amorphous layer ion plasma etched from a surface of the crystalline portion.
13. An electrode structure comprising:
a substrate including a crystalline portion and an amorphous portion;
a homogeneous electrode deposited on the substrate, whereby the homogeneous electrode is in direct contact with the amorphous portion;
wherein the substrate comprises lithium niobate.
14. An electrode structure according to claim 13 , wherein the electrode consists of gold.
15. An electrode structure comprising:
an electro-optic crystalline substrate;
an amorphous layer disposed on the crystalline substrate, the amorphous layer having a composition substantially similar to a composition of the crystalline substrate; and
an electrode layer disposed directly on the amorphous layer.
16. An electrode structure according to claim 15 , wherein the amorphous layer is in direct contact with both the crystalline substrate and the gold layer.
17. An electrode structure according to claim 15 , wherein the crystalline substrate comprises lithium niobate.
18. An electrode structure according to claim 15 , wherein the homogeneous electrode layer comprises a gold layer.
19. A method of preparing a lithium niobate substrate comprising:
a) exposing at least a portion of the substrate to a plasma so as to create an amorphous portion on a surface thereof; and
b) depositing gold directly on a surface of the amorphous portion.
20. A method according to claim 19 , wherein the plasma comprises an argon ion plasma at a power of about 600 W.
21. A method according to claim 19 , wherein the plasma comprises an ion plasma at a power greater than about 400 W.
22. A method according to claim 19 , wherein the plasma comprises a plasma at a power sufficient to promote bonding of the gold to the substrate in the absence of an adhesion layer.