IP Library Granted Patent US 7,235,512
Granted Patent B2
US 7,235,512 · App. 10/395,278 · Granted Jun 26, 2007

Heat-sensitive recording material

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Quick Facts
Patent No.
US 7,235,512
App. No.
10/395,278
Granted
Jun 26, 2007
Kind
B2
Abstract

The present invention provides a heat-sensitive recording material comprising a substrate; and at least two heat-sensitive recording layers provided on the substrate, the heat-sensitive recording layers including microcapsules encapsulating an electron-donating dye precursor, and an electron-accepting compound, which reacts with the electron-donating dye precursor to develop a color and is disposed outside of the microcapsules, wherein the microcapsules include at least two kinds of microcapsules having different glass transition temperatures. A difference between each of the glass transition temperatures of the at least two microcapsules having different glass transition temperatures is preferably in a range from 20° C. to 70° C. According to the invention, a heat-sensitive recording material, which is superior in the reproduction of the gradation of an image and enables recording at high density, is obtained.

Claims (13)

1. A heat-sensitive recording material comprising a substrate; and at least two heat-sensitive recording layers provided on the substrate, the heat-sensitive recording layers including microcapsules encapsulating an electron-donating dye precursor, and an electron-accepting compound, which reacts with the electron-donating dye precursor to develop a color and is disposed outside of the microcapsules,

wherein the microcapsules include at least two kinds of microcapsules having different glass transition temperatures and wherein the difference between the glass transition temperatures is in a range from 20° C. to 70° C.

2. A heat-sensitive recording material according to claim 1 , wherein the heat-sensitive recording layers include at least a heat-sensitive recording layer, in which a mass component ratio of microcapsules with a high glass transition temperature to microcapsules with a low glass transition temperature is from 85:15 to 55:45, and a heat-sensitive recording layer, in which a mass component ratio of microcapsules with a high glass transition temperature to microcapsules with a low glass transition temperature is from 20:80 to 50:50.

3. A heat-sensitive recording material according to claim 2 , wherein a capsule wall material of the microcapsule is made of a combination of tolylenediisocyanate and isophoronediisocyanate.

4. A heat-sensitive recording material according to claim 2 , wherein the microcapsules are produced by an interfacial polymerization method.

5. A heat-sensitive recording material according to claim 2 , wherein the electron-accepting compound is outside of the microcapsules in the form of an emulsion dispersion.

6. A heat-sensitive recording material according to claim 2 , in which the electron-accepting material is contained in an amount of 50 to 800% by weight of an amount of the electron-donating dye precursor.

7. A heat-sensitive recording material according to claim 1 , wherein a capsule wall material of the microcapsule is made of a combination of tolylenediisocyanate and isophoronediisocyanate.

8. A heat-sensitive recording material according to claim 7 , wherein the microcapsules are produced by an interfacial polymerization method.

9. A heat-sensitive recording material according to claim 7 , wherein the electron-accepting compound is outside of the microcapsules in the form of an emulsion dispersion.

10. A heat-sensitive recording material according to claim 1 , wherein the microcapsules are produced by an interfacial polymerization method.

11. A heat-sensitive recording material according to claim 1 , wherein the electron-accepting compound is outside of the microcapsules in the form of an emulsion dispersion.

12. A heat-sensitive recording material according to claim 1 , in which the electron-accepting material is contained in an amount of 50 to 800% by weight of an amount of the electron-donating dye precursor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2007
From: FUJIFILM HOLDINGS CORPORATION (FORMERLY FUJI PHOTO FILM CO., LTD.)
To: FUJIFILM CORPORATION
Reel/Frame 018904/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2003
From: KAMIKAWA, HIROSHI
To: FUJI PHOTO FILM CO., LTD.
Reel/Frame 013917/0167 →