Process to form fine features using photolithography and plasma etching
View Patent ↗Methods of making a sharp pointed structure ( 19 ), such as a sharp pointed structure in a semiconductor, includes providing a substrate ( 14 ) and then depositing an oxide layer ( 16 ), such as silicon oxide or silicon nitride, on the substrate ( 14 ) and depositing a low contrast photoresist ( 17 ) on the oxide layer ( 16 ). The low contrast photoresist ( 17 ) is then exposed to optical energy through a reticle ( 21 ), with the reticle ( 21 ) having a partially triangular shape ( 22 ), such as an equilateral triangle with a tip. The low contrast photoresist ( 17 ) is developed and the oxide layer ( 16 ) is etched to form the sharp pointed structure ( 19 ). Additionally, a film is deposited ( 15 ), such as a magnetoresistive layer, between the substrate ( 14 ) and the oxide layer ( 16 ). The low contrast photoresist ( 17 ) is removed and the film ( 15 ) is etched to create a sharp pointed film structure ( 23 ) in the film ( 15 ).
1. Method of making a sharp pointed structure comprising:
providing a substrate;
depositing an oxide layer on the substrate;
depositing a low contrast photoresist on the oxide layer;
exposing the low contrast photoresist to optical energy through a reticle with the reticle having a partially triangular shape;
developing the low contrast photoresist to leave a foot structure of the low contrast photoresist in the desired area of the sharp pointed structure; and
etching the oxide layer to form the sharp pointed structure, wherein the etching erodes the foot structure of the low contrast photoresist to cause formation of the sharp pointed structure.
2. The method of claim 1 with developing the low contrast photoresist including decontaminating the low contrast photoresist.
3. The method of claim 1 with developing the low contrast photoresist including decontaminating the low contrast photoresist with oxygen.
4. The method of claim 1 with providing the substrate comprising providing the substrate in the form of a semiconductor.
5. The method of claim 1 with depositing the oxide layer on the substrate comprising depositing a silicon dioxide layer on the substrate.
6. The method of claim 1 with depositing the oxide layer on the substrate comprising depositing a silicon nitride layer on the substrate.
7. The method of claim 6 with exposing the low contrast photoresist comprising exposing the low contrast photoresist to optical energy through the reticle having a partially triangular shape with a tip.
8. The method of claim 1 with exposing the low contrast photoresist comprising exposing the low contrast photoresist to optical energy through the reticle having a partially triangular shape with a tip.
9. The method of claim 1 wit exposing the low contrast photoresist comprising exposing the low contrast photoresist to optical energy through the reticle having a partially equilateral triangular shape with a tip.
10. Method of making a sharp pointed film structure comprising:
providing a substrate;
depositing a film on the substrate;
depositing an oxide layer on the film;
depositing a low contrast photoresist on the oxide layer;
exposing the low contrast photoresist to optical energy through a reticle, with the reticle having a partially triangular shape;
developing the low contrast photoresist to leave a foot structure of the low contrast photoresist in the desired area of the sharp pointed film structure;
etching the oxide layer to erode the foot structure of the low contrast photoresist to cause formation of a sharp pointed structure in the oxide layer;
removing the low contrast photoresist; and
etching the film to form the sharp pointed film structure.
11. The method of claim 10 with depositing the film comprising depositing a metal film.
12. The method of claim 10 with depositing the film comprising depositing a magnetoresistive film.
13. The method of claim 10 with developing the low contrast photoresist including decontaminating the low contrast photoresist.
14. The method of claim 10 with developing the low contrast photoresist including decontaminating the low contrast photoresist wit oxygen.
15. The method of claim 10 with providing the substrate comprising providing the substrate in the form of a semiconductor.
16. The method of claim 10 with depositing the oxide layer on the substrate comprising depositing a silicon dioxide layer on the substrate.
17. The method of claim 16 with exposing the low contrast photoresist comprising exposing the low contrast photoresist to optical energy through the reticle having a partially triangular shape with a tip.
18. The method of claim 10 depositing the oxide layer on the substrate comprising depositing a nitric oxide layer on the substrate.
19. The method of claim 10 with exposing the low contrast photoresist comprising exposing the low contrast photoresist to optical energy through the reticle having a partially triangular shape with a tip.
20. The method of claim 10 with exposing the low contrast photoresist comprising exposing the low contrast photoresist to optical energy through the reticle having a partially equilateral triangular shape with a tip.