IP Library Granted Patent US 6,866,368
Granted Patent B2
US 6,866,368 · App. 10/400,457 · Granted Mar 15, 2005

Flexible circuit board

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Quick Facts
Patent No.
US 6,866,368
App. No.
10/400,457
Granted
Mar 15, 2005
Kind
B2
Abstract

A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and forming a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts. The material of the insulation tape can be polyimide, Teflon, polyamide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate copolymer, or any combination of the above materials. The material of the photo-polymer layer can be solder mask or polyimide.

Claims (12)

1. A flexible circuit board for ink jetting, comprising:

an insulation tape as a substrate;

conductive traces on the insulation tape; and

a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts.

2. The flexible circuit board according to claim 1 , wherein the insulation tape comprises a polymer film.

3. The flexible circuit board according to claim 2 , wherein the material of the polymer film comprising at least one of polyimide (PI), Teflon, polyamide, polymethyl methacrylate, polycarbonate, polyester, and polyamide polyethylene-terephthalate copolymer.

4. The flexible circuit board according to claim 1 , wherein the material of the photo-polymer layer is solder mask.

5. The flexible circuit board according to claim 1 , wherein the photo-polymer layer is made of solder mask and the solder mask comprises a main agent and a hardener with a ratio of about 7:3.

6. The flexible circuit board according to claim 1 , wherein a material of the photo-polymer layer is polyimide.

7. The flexible circuit board according to claim 1 , wherein a material of the conductive traces is copper.

8. The flexible circuit board according to claim 1 , wherein a material of the conductive traces is gold.

9. The flexible circuit board according to claim 1 , wherein a thickness of the conductive traces is about 10 μm to 50 μm.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2019
From: INTELLECTUAL VENTURES ASSETS 104 LLC
To: 92104 LLC
Reel/Frame 050114/0899 →
NUNC PRO TUNC ASSIGNMENT Recorded Jan 15, 2019
From: YOSHIKUNI HOLDINGS LLC
To: INTELLECTUAL VENTURES ASSETS 104 LLC
Reel/Frame 048014/0393 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2013
From: LEU, YI-JING; CHEN, CHIH-CHING; PENG, MING-CHUNG
To: BENQ CORPORATION
Reel/Frame 029580/0590 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 2, 2013
From: BENQ CORPORATION
To: YOSHIKUNI HOLDINGS LLC
Reel/Frame 029557/0884 →
CONFIRMATORY ASSIGNMENT Recorded Dec 9, 2012
From: QISDA CORPORATION
To: BENQ CORPORATION
Reel/Frame 029432/0965 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2009
From: QISDA CORPORATION
To: BENQ CORPORATION
Reel/Frame 022974/0828 →
CHANGE OF NAME Recorded Mar 24, 2008
From: BENQ CORPORATION
To: QISDA CORPORATION
Reel/Frame 020679/0952 →