IP Library Granted Patent US 7,227,748
Granted Patent B2
US 7,227,748 · App. 10/403,670 · Granted Jun 5, 2007

Cooling module

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Quick Facts
Patent No.
US 7,227,748
App. No.
10/403,670
Granted
Jun 5, 2007
Kind
B2
Abstract

A cooling module is provided for an electrically powered apparatus. The cooling module comprises a non-volatile memory arranged to store a module identifier code for the module.

Claims (9)

1. A cooling module for a computer system, the cooling module comprising:

a fan;

a cooling module housing coupled to the fan;

at least one mounting pin coupled to the housing, wherein the at least one mounting pin is operable to couple the cooling module to the computer system and support the cooling module on a computer system housing;

an electrical connector integrated in the mounting pin; and

a rewriteable non-volatile memory inside the cooling module housing and coupled to the electrical connector.

2. The cooling module of claim 1 , further comprising a data interface coupled to the electrical connector and to the rewriteable non-volatile memory; wherein the computer system comprises an integrated circuit coupled to the rewriteable non-volatile memory through the data interface.

3. The cooling module of claim 2 , further comprising a data circuit for transmitting information stored on the rewriteable non-volatile memory to the computer system via the data interface.

4. The cooling module of claim 2 , wherein the rewriteable non-volatile memory is an Electrically Erasable Programmable Read-Only Memory (EEPROM).

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037302/0772 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2003
From: GARNETT, PAUL JEFFREY; SUN MICROSYSTEMS LIMITED
To: SUN MICROSYSTEMS INC.
Reel/Frame 014259/0848 →