Circuit board including isolated signal transmission channels
View Patent ↗A circuit board including a signal transmission channel includes a dielectric substrate and a signal transmission channel which may be formed on the dielectric substrate. The signal transmission channel may include a conductor, a lossy dielectric material which may longitudinally encapsulate the conductor and a conductive material which may longitudinally encapsulate the lossy dielectric.
1. A circuit board comprising:
a dielectric substrate; and
a signal transmission channel formed on said dielectric substrate, wherein said signal transmission channel includes:
a conductor;
a lossy dielectric material longitudinally encapsulating said conductor, wherein said lossy dielectric material includes a first leakage value along a first length of said signal transmission channel and a second leakage value along a second length of said signal transmission channel; and
a conductive material longitudinally encapsulating said lossy dielectric.
2. The circuit board as recited in claim 1 , wherein said lossy dielectric material has a leakage value that is substantially equal to the capacitance multiplied by the resistance divided by the inductance.
3. The circuit board as recited in claim 1 , wherein said lossy dielectric has a leakage value which is independent of a leakage value of said dielectric substrate.
4. The circuit board as recited in claim 1 , wherein said lossy dielectric material is a carbon-based resistive polymer paste.
5. The circuit board as recited in claim 1 further comprising a plurality of said signal transmission channels formed on said dielectric substrate.
6. The circuit board as recited in claim 1 further comprising a plurality of additional layers formed on said dielectric substrate.
7. The circuit board as recited in claim 6 , wherein said plurality of additional layers includes at least one power plane including a conductive layer formed on an additional dielectric substrate for conveying power.
8. The circuit board as recited in claim 6 , wherein said plurality of additional layers includes at least one ground plane including a conductive layer formed on an additional dielectric substrate for providing circuit ground.
9. The circuit board as recited in claim 6 , wherein said plurality of additional layers includes at least one signal layer including a plurality of said signal transmission channels formed on an additional dielectric substrate.
10. The circuit board as recited in claim 9 , wherein each of said plurality of said signal transmission channels includes a lossy dielectric material having a leakage value that is independent of each other signal transmission channel.
11. A method comprising:
transmitting a signal via a signal transmission channel of a circuit board;
wherein the circuit board includes:
a dielectric substrate; and
said signal transmission channel formed on said dielectric substrate, wherein said signal transmission channel includes:
a conductor;
a lossy dielectric material longitudinally encapsulating said conductor, wherein said lossy dielectric material includes a first leakage value along a first length of said signal transmission channel and a second leakage value along a second length of said signal transmission channel; and
a conductive material longitudinally encapsulating said lossy dielectric; and
receiving the signal.
12. The method as recited in claim 11 , wherein said lossy dielectric material has a leakage value that is substantially equal to the capacitance multiplied by the resistance divided by the inductance.
13. The method as recited in claim 11 , wherein said lossy dielectric has a leakage value which is independent of a leakage value of said dielectric substrate.
14. The method as recited in claim 11 , wherein said circuit board further comprises a plurality of additional layers formed on said dielectric substrate.
15. The method as recited in claim 14 , wherein said plurality of additional layers includes at least one power plane including a conductive layer formed on an additional dielectric substrate for conveying power.
16. The method as recited in claim 14 , wherein said plurality of additional layers includes at least one ground plane including a conductive layer formed on an additional dielectric substrate for providing circuit ground.
17. The method as recited in claim 14 , wherein said plurality of additional layers includes at least one signal layer including a plurality of said signal transmission channels formed on an additional dielectric substrate.
18. The method as recited in claim 17 , wherein each of said plurality of said signal transmission channels includes a lossy dielectric material having a leakage value that is independent of each other signal transmission channel.