Inkjet printhead with hollow drop ejection chamber formed partly of actuator material
View Patent ↗An inkjet drop ejection apparatus with a chamber, an actuator, and a nozzle, where drops of ink are ejected through the nozzle, and where the chamber comprises a hollow structure formed on a semiconductor substrate. The chamber is partly formed of the same material as the actuator, simplifying the fabrication process.
1. An inkjet drop ejection apparatus for ejecting drops of ink during a printing process, the inkjet drop ejection apparatus comprising:
a chamber for holding ink;
a nozzle;
an actuator having an ink engaging surface for moving towards the nozzle to impart enough kinetic energy to the ink such that a drop of ink ejects through the nozzle, and subsequently moves away from the nozzle as the chamber refills with ink during the printing process, the ink engaging surface being formed from the same material as at least one internal surface of the chamber, and,
a semiconductor substrate for supporting the chamber, the nozzle and the actuator, wherein,
the actuator is connected to the chamber in the same plane of deposition as said at least one internal surface of the chamber.
2. An inkjet drop election apparatus according to claim 1 wherein the semiconductor substrate has an ink ejection side incorporating the nozzle and an ink supply side opposite the ink ejection side, the ink supply side being in fluid communication with the chamber; wherein during use,
the ink engaging surface of the actuator moves towards the ink ejection side of the semiconductor substrate.
3. An inkjet drop ejection apparatus according to claim 2 wherein the actuator is connected to the chamber such that the ink engaging surface is suspended in the ink and during actuation it pushes ink out of the nozzle in a direction parallel to a flow of ink from the ink supply side of the semiconductor substrate to refill the chamber.
4. An inkjet drop ejection apparatus as claimed in claim 1 wherein said semiconductor substrate is formed of silicon and the bend actuator is a thermal bend actruator.
5. An inkjet drop ejection apparatus as claimed in claim 1 wherein said semiconductor substrate is silicon, and wherein a hole is formed through said substrate from the ink supply side to the ink ejection side such that at least part of the sidewalls of the hole forming pail of the chamber.
6. An inkjet drop ejection apparatus as claimed in claim 1 wherein the material forming said ink engaging surface of the actuator and said at least one internal surface of said chamber is deposited simultaneously.
7. An inkjet drop ejection apparatus as claimed in claim 1 wherein said actuator comprises a shape memory alloy which is thermally switched between its martensitic state and its austenic state, and wherein the resultant shape change of said actuator cause ejection of, or assists in causing ejection of, ink from said nozzle.