Manufacturing method for ink jet pen
View Patent ↗The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.
1. A method for attaching a semiconductor chip to an ink jet pen body which comprises:
dispensing a first adhesive having a cure time greater than about 15 minutes in a predetermined pattern in one or more chip pockets of an ink jet pen body;
dispensing beads containing a second adhesive in two or more discrete locations around an inside perimeter of each chip pocket, the second adhesive having a substantially shorter cure time than the first adhesive;
attaching a semiconductor chip having chip edges in each of the chip pockets to the second adhesive; and
curing the first adhesive using heat or radiation.
2. The method of claim 1 wherein the second adhesive is selected from the group consisting of a heat curable adhesive, a radiation curable adhesive, a pressure sensitive adhesive and a hot melt adhesive.
3. The method of claim 1 wherein the adhesive beads of the second adhesive have a diameter ranging from about 300 to about 800 microns.
4. The method of claim 3 wherein the adhesive beads have a height ranging from about 50 to about 500 microns.
5. The method of claim 4 wherein the adhesive beads have a length ranging from about 0.25 to about 1 millimeter.
6. The method of claim 1 wherein the adhesive beads of the second adhesive have a height ranging from about 50 to about 500 microns.
7. The method of claim 1 wherein the adhesive beads of the second adhesive have a length ranging from about 0.25 to about 1 millimeter.
8. The method of claim 1 wherein the chip is attached in the chip pocket such that the first adhesive is displaced and encapsulates the chip edges.
9. The method of claim 1 wherein a multi-fingered glue pin applies beads of the second adhesive to the chip pocket in the discrete locations.
10. The method of claim 1 wherein a pneumatic ink jet dispense unit applies beads of the second adhesive to the chip pocket in the discrete locations.
11. The method of claim 1 wherein the first adhesive is displaced in the chip pocket by the chip to fill voids in the pocket between the chip and sidewalls of the pocket.
12. The method of claim 1 wherein the chip is attached in the chip pocket such that the second adhesive is displaced and encapsulates the chip edges.
13. The method of claim 1 wherein the adhesive beads have a height to width ratio of from about 0.12:1 to about 1.667:1.
14. The method of claim 1 wherein the first adhesive is a die attach adhesive.