Stimulation sensitive composition and compound
View Patent ↗A stimulation sensitive composition comprising: (A) a compound represented by the specific formula which is capable of generating an acid or a radical by stimulation from the external.
1. A positive type photosensitive or heat sensitive composition comprising:
(A) a compound represented by formula (I) which is capable of generating an acid by irradiation of actinic ray or by heat, and
(B) a resin increasing the solubility in an alkali developing solution by the action of an acid, wherein the resin has a hydroxystyrene unit:
wherein Ar represents an aryl group or an aromatic group containing a hetero atom,
R 6 represents a hydrogen atom, a cyano group, an alkyl group or an aryl group,
R 7 represents a monovalent organic group,
Y 1 and Y 2 may be the same or different, and represents an alkyl group, an aryl group, an aralkyl group or an aromatic group containing a hetero atom, Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and at least one of Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and R 6 may be bonded to each other to form a ring,
R 6 and R 7 may be bonded to each other to form a ring,
Ar, R 6 , R 7 , Y 1 or Y 2 may be bonded at any one position through a linking group, so that the component (A) may have 2 or more of the structures of formula (I), and
X − represents a non-nucleophilic anion.
2. A positive type photosensitive or heat sensitive composition comprising:
(A) a compound represented by formula (I) which is capable of generating an acid by irradiation of actinic ray or by heat,
(D) a resin which is soluble in an alkali developing solution, and
(C) a compound having a molecular weight of not more than 3000 which is capable of decomposing by the action of acid to increase solubility in an alkali developing solution:
wherein Ar represents an aryl group or an aromatic group containing a hetero atom,
R 6 represents a cyano group, an alkyl group or an aryl group,
R 7 represents a monovalent organic group selected from the group consisting of an alkyl group, a cyano group, an alkoxy group, an alkylthio group, an alkoxycarbonyl group and an oxoalkyl group,
Y 1 and Y 2 may be the same or different, and represents an alkyl group, an aryl group, an aralkyl group or an aromatic group containing a hetero atom, Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and at least one of Y 1 and Y 2 may be bonded to form a ring,
Ar and R 6 may be bonded to each other to form a ring,
R 6 and R 7 may be bonded to each other to form a ring,
Ar, R 6 , R 7 , Y 1 or Y 2 may be bonded at any one position through a linking group, so that the component (A) may have 2 or more of the structures of formula (I), and
X − represents a non-nucleophilic anion.
3. A negative type photosensitive or heat sensitive composition comprising:
(A) a compound represented by formula (I) which is capable of generating an acid by irradiation of actinic ray or by heat,
(D) a resin which is soluble in an alkali developing solution, and
(E) a crosslinking agent which is capable of crosslinking with the alkali-soluble resin by the action of an acid:
wherein Ar represents an aryl group or an aromatic group containing a hetero atom,
R 6 represents a hydrogen atom, a cyano group, an alkyl group or an aryl group,
R 7 represents a monovalent organic group,
Y 1 and Y 2 may be the same or different, and represents an alkyl group, an aryl group, an aralkyl group or an aromatic group containing a hetero atom, Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and at least one of Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and R 6 may be bonded to each other to form a ring,
R 6 and R 7 may be bonded to each other to form a ring,
Ar, R 6 , R 7 , Y 1 or Y 2 may be bonded at any one position through a linking group, so that the component (A) may have 2 or more of the structures of formula (I), and
X − represents a non-nucleophilic anion.
4. A positive type photosensitive or heat sensitive composition comprising:
(A) a compound represented by formula (I) which is capable of generating an acid by irradiation of actinic ray or by heat, and
(B) a resin increasing the solubility in an alkali developing solution by the action of an acid, wherein the resin has a fluorine atom:
wherein Ar represents an aryl group or an aromatic group containing a hetero atom,
R 6 represents a hydrogen atom, a cyano group, an alkyl group or an aryl group,
R 7 represents a monovalent organic group,
Y 1 and Y 2 may be the same or different, and represents an alkyl group, an aryl group, an aralkyl group or an aromatic group containing a hetero atom, Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and at least one of Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and R 6 may be bonded to each other to form a ring,
R 6 and R 7 may be bonded to each other to form a ring,
Ar, R 6 , R 7 , Y 1 or Y 2 may be bonded at any one position through a linking group, so that the component (A) may have 2 or more of the structures of formula (I), and
X − represents a non-nucleophilic anion.
5. A positive type photosensitive or heat sensitive composition comprising:
(A) a compound represented by formula (I) which is capable of generating an acid by irradiation of actinic ray or by heat, and
(B) a resin increasing the solubility in an alkali developing solution by the action of an acid, wherein the resin has a silicon atom:
wherein Ar represents an aryl group or an aromatic group containing a hetero atom,
R 6 represents a hydrogen atom, a cyano group, an alkyl group or an aryl group,
R 7 represents a monovalent organic group,
Y 1 and Y 2 may be the same or different, and represents an alkyl group, an aryl group, an aralkyl group or an aromatic group containing a hetero atom, Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and at least one of Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and R 6 may be bonded to each other to form a ring,
R 6 and R 7 may be bonded to each other to form a ring,
Ar, R 6 , R 7 , Y 1 or Y 2 may be bonded at any one position through a linking group, so that the component (A) may have 2 or more of the structures of formula (I), and
X − represents a non-nucleophilic anion.
6. A positive type photosensitive or heat sensitive composition comprising:
(A) a compound represented by formula (I) which is capable of generating an acid by irradiation of actinic ray or by heat, and
(B) a resin and increasing the solubility in an alkali developing solution by the action of an acid, wherein the resin has a monocyclic or polycyclic alicyclic hydrocarbon structure:
wherein Ar represents an aryl group or an aromatic group containing a hetero atom,
R 6 represents a hydrogen atom, a cyano group, an alkyl group or an aryl group,
R 7 represents a monovalent organic group,
Y 1 and Y 2 may be the same or different, and represents an alkyl group, an aryl group, an aralkyl group or an aromatic group containing a hetero atom, Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and at least one of Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and R 6 may be bonded to each other to form a ring,
R 6 and R 7 may be bonded to each other to form a ring,
Ar, R 6 , R 7 , Y 1 or Y 2 may be bonded at any one position through a linking group, so that the component (A) may have 2 or more of the structures of formula (I), and
X − represents a carboxylic acid anion, a sulfonyl imide anion, a bis(alkylsulfonyl)imide anion, a tris(alkylsulfonyl)methyl anion, an arylsulfonic acid anion or a camphorsulfonic acid anion.
7. The photosensitive composition according to claim 6 , wherein the formula (I) satisfies at least one of the following (a) to (b):
(a) R 6 and R 7 both represent an alkyl group, and
(b) R 6 represents a hydrogen atom and R 7 represents an alkyl group having 4-20 carbon atoms.
8. A positive type photosensitive or heat sensitive composition comprising:
(A) a compound represented by formula (Ia) which is capable of generating an acid by irradiation of actinic ray or by heat, and
(B) a resin increasing the solubility in an alkali developing solution by the action of an acid, wherein the resin has a monocyclic or polycyclic alicyclic hydrocarbon structure:
wherein R 1 to R 5 may be the same or different, and each represents a hydrogen atom, a nitro group, a halogen atom, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an aryl group or an acylamino group,
R 6 represents a hydrogen atom, a cyano group, an alkyl group or an aryl group,
R 7 represents a monovalent organic group,
Y 1 and Y 2 may be the same or different, and represents an alkyl group, an aryl group, an aralkyl group or an aromatic group containing a hetero atom, Y 1 and Y 2 may be bonded to each other to form a ring,
at least 2 of R 1 to R 5 may be bonded to each other to form a ring,
at least one of R 1 to R 5 is a linear, branched or cyclic alkyl group,
at least one of R 1 to R 5 and at least one of Y 1 and Y 2 may be bonded to each other to form a ring,
at least one of R 1 to R 5 and R 6 may be bonded to each other to form a ring,
R 6 and R 7 may be bonded to each other to form a ring,
R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , Y 1 or Y 2 may be bonded at any one position through a linking group, so that the component (A) may have 2 or more of the structures of formula (Ia), and
X − represents a non-nucleophilic anion.
9. The positive type photosensitive or heat sensitive composition according to any one of claims 1 and 4 - 8 , further comprising (C) a compound having a molecular weight of not more than 3000 which is capable of decomposing by the action of acid to increase solubility in an alkali developing solution.
10. The composition according to claim 9 , further comprising (F) a basic compound and/or (G) a surfactant containing at least one of a group consisting of a fluorine atom and a silicon atom.
11. The composition according to claim 10 , wherein the compound (F) is a compound having a structure selected from the group consisting of an imidazole structure, a diazabicyclo structure, an oniumhydroxy structure, an oniumcarboxylate structure, a trialkylamine structure, an aniline structure and a pyridine structure, or an alkylamine derivative having a hydroxy group and/or an ether bond, or an aniline derivative having a hydroxy group and/or an ether bond.
12. The composition according to any one of claims 1 , 3 and 4 - 8 , further comprising (F) a basic compound and/or (G) a surfactant containing at least one of a group consisting of a fluorine atom and a silicon atom.
13. The composition according to claim 12 , wherein the compound (F) is a compound having a structure selected from the group consisting of an imidazole structure, a diazabicyclo structure, an oniumhydroxy structure, an oniumcarboxylate structure, a trialkylamine structure, an aniline structure and a pyridine structure, or an alkylamine derivative having a hydroxy group and/or an ether bond, or an aniline derivative having a hydroxy group and/or an ether bond.
14. The photosensitive or heat sensitive composition according to any one of claims 1 , 3 , 4 - 5 and 8 , wherein the formula (I) or (Ia) satisfies at least one of the following (a) to (c):
(a) R 6 and R 7 both represent an alkyl group,
(b) R 6 represents a hydrogen atom and R 7 represents an alkyl group having 4-20 carbon atoms, and
(c) X − represents a non-nucleophilic anion selected from the group consisting of a sulfonic acid anion, a carboxylic acid anion, a sulfonyl imide anion, a bis(alkylsulfonyl)imide anion, and a tris(alkylsulfonyl)methyl anion.
15. The positive type photosensitive or heat sensitive composition according to claim 6 or 8 , wherein the resin (B) has further a repeating unit having a lactone structure.
16. The composition according to claim 15 , further comprising (F) a basic compound and/or (G) a surfactant containing at least one of a group consisting of a fluorine atom and a silicon atom.
17. The composition according to claim 16 , wherein the compound (F) is a compound having a structure selected from the group consisting of an imidazole structure, a diazabicyclo structure, an oniumhydroxy structure, an oniumcarboxylate structure, a trialkylamine structure, an aniline structure and a pyridine structure, or an alkylamine derivative having a hydroxy group and/or an ether bond, or an aniline derivative having a hydroxy group and/or an ether bond.
18. A compound represented by formula (I):
wherein Ar represents an aryl group or an aromatic group containing a hetero atom,
R 6 represents a hydrogen atom, a cyano group, an alkyl group or an aryl group,
R 7 represents a monovalent organic group,
Y 1 and Y 2 may be the same or different, and each represents an alkyl group, an aryl group, an aralkyl group or an aromatic group containing a hetero atom, provided that Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and at least one of Y 1 and Y 2 may be bonded to each other to form a ring,
Ar and R 6 may be bonded to each other to form a ring,
R 6 and R 7 may be bonded to each other to form a ring,
Ar, R 6 , R 7 , Y 1 or Y 2 may be bonded at any one position through a linking group, so that the compound may have 2 or more of the structures of formula (I), and
X − represents a carboxylic acid anion, a sulfonyl imide anion, a bis(alkylsulfonyl)imide anion, a tris(alkylsulfonyl)methyl anion, an arylsulfonic acid anion substituted by a fluorine atom or a group containing a fluorine atom or a camphorsulfonic acid anion.
19. A compound represented by formula (Ia):
wherein R 1 to R 5 may be the same or different, and each represents a hydrogen atom, a nitro group, a halogen atom, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an aryl group or an acylamino group,
R 6 represents a hydrogen atom, a cyano group, an alkyl group or an aryl group,
R 7 represents a monovalent organic group,
Y 1 and Y 2 may be the same or different, and each represents an alkyl group, an aryl group, an aralkyl group or an aromatic group containing a hetero atom, provided that Y 1 and Y 2 may be bonded to each other to form a ring,
at least 2 of R 1 to R 5 may be bonded to each other to form a ring,
at least one of R 1 to R 5 is a linear, branched or cyclic alkyl group,
at least one of R 1 to R 5 and at least one of Y 1 and Y 2 may be bonded to each other to form a ring,
at least one of R 1 to R 5 and R 6 may be bonded to each other to form a ring,
R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , Y 1 or Y 2 may be bonded at any one position through a linking group, so that the component (A) may have 2 or more of the structures of formula (Ia), and
X − represents a non-nucleophilic anion.
20. The compound according to claim 19 , wherein both R 6 and R 7 represent an alkyl group.
21. A compound represented by formula (I):
wherein Ar represents an aryl group or an aromatic group containing a hetero atom,
R 6 represents a hydrogen atom,
R 7 represents an alkyl group,
Y 1 and Y 2 may be the same or different, and each represents an alkyl group, an aryl group, an aralkyl group or an aromatic group containing a hetero atom provided that Y 1 and Y 2 are bonded to each other to form a ring,
Ar and at least one of Y 1 and Y 2 may be bonded to each other to form a ring,
Ar, R 7 , Y 1 or Y 2 may be bonded at any one position through a linking group, so that the compound may have 2 or more of the structures of formula (I), and
X − represents a non-nucleophilic anion selected from the group consisting of a sulfonic acid anion substituted with a fluorine atom at the α position of the sulfonic acid, an arylsulfonic acid anion substituted with a fluorine atom or a group having a fluorine atom, a bis(alkylsulfonyl)imide anion in which the alkyl group is substituted with a fluorine atom, and a tris(alkylsulfonyl)methyl anion in which the alkyl group is substituted with a fluorine atom.