Enhanced polyisobutylene modified hot melt adhesive formulation
View Patent ↗An improved hot melt adhesive includes a base polymer and a PIB modifier that is made up of a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position. The modifier may function to improve the loop tack and/or the peel adhesion of the hot melt adhesive.
1. An improved hot melt adhesive comprising a base polymer and a PIB modifier, said PIB modifier having a M N no greater than about 3000 and comprising a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position.
2. An improved hot melt adhesive comprising a base polymer and a PIB modifier, said PIB modifier having a polydispersity no greater than about 2.5 and comprising a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position.
3. An improved hot melt adhesive comprising a base polymer and a PIB modifier, said PIB modifier comprising a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position, and said base polymer comprising a natural rubber, a styrene-butadiene rubber, an ethylene vinyl acetate copolymer, a styrene-isoprene-styrene block copolymer, a styrene-butadiene-styrene block copolymer, or a low density polyethylene.
4. An improved hot melt adhesive as set forth in claim 1 , wherein said PIB modifier has a polydispersity no greater than about 2.5.
5. An improved hot melt adhesive as set forth in claim 4 , 1 or 2 , wherein said base polymer further comprises a natural rubber, a styrene-butadiene rubber, an ethylene vinyl acetate copolymer, a styrene-isoprene-styrene block copolymer, a styrene-butadiene-styrene block copolymer, or a low density polyethylene.
6. An improved hot melt adhesive as set forth in claim 4 or 1 , wherein said PIB modifier has a M N which is at least about 900.
7. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein at least about 95% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.
8. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein at least about 97% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.
9. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein at least about 99% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.
10. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein no more than about 1% of the monomeric units incorporated in the PIB modifier molecules are something other than isobutylene moieties.
11. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein at least about 40% of the double bonds of the PIB modifier molecules are in the alpha position.
12. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein at least about 50% of the double bonds of the PIB modifier molecules are in the alpha position.
13. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein at least about 60% of the double bonds of the PIB modifier are in the alpha position.
14. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein at least about 70% of the double bonds of the PIB modifier molecules are in the alpha position.
15. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein at least about 80% of the double bonds of the PIB modifier molecules are in the alpha position.
16. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein at least about 90% of the double bonds of the PIB modifier molecules are in the alpha position.
17. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein more than 90% of the double bonds of the PIP modifier molecules are in the alpha position.
18. An improved hot melt adhesive as set forth in claim 1 , 2 or 3 , wherein no more than about 1% of the double bonds of the PIB modifier molecules are in a position other than alpha or beta.
19. A method for improving the properties of a hot melt adhesive comprising providing a hot melt adhesive base polymer formulation and including in said base formulation a PIB modifier, said PIB modifier having a M N no greater than about 3000 and comprising a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position.
20. A method as set forth in claim 19 , wherein said PIB modifier has a polydispersity no greater than about 2.5.
21. A method for improving the properties of a hot melt adhesive comprising providing a hot melt adhesive base polymer formulation and including in said base formulation a PIB modifier, said PIB modifier having a polydispersity no greater than about 2.5 and comprising a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position.
22. A method for improving the properties of a hot melt adhesive comprising:
providing a hot melt adhesive base polymer formulation comprising a natural rubber, a styrene-butadiene rubber, an ethylene vinyl acetate copolymer, a styrene-isoprene-styrene block copolymer, a styrene-butadiene-styrene block copolymer, or a low density polyethylene; and
including in said base formulation a PIB modifier, said PIB modifier comprising a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position, and said base polymer.
23. A method as set forth in claim 20 , 19 or 21 , wherein said base polymer formulation comprises a natural rubber, a styrene-butadiene rubber, an ethylene vinyl acetate copolymer, a styrene-isoprene-styrene block copolymer, a styrene-butadiene-styrene block copolymer, or a low density polyethylene.
24. A method as set forth in claim 19 , 21 or 22 , wherein said PIB modifier has a M N which is at least about 900.
25. A method as set forth in claim 19 , 21 or 22 , wherein at least about 92% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.
26. A method as set forth in claim 19 , 21 or 22 , wherein at least about 95% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.
27. A method as set forth in claim 19 , 21 or 22 , wherein at least about 99% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.
28. A method as set forth in claim 19 , 21 or 22 , wherein no more than about 1% of the monomeric units incorporated in the PIB modifier molecules are something other than isobutylene moieties.
29. A method as set forth in claim 19 , 21 or 22 , wherein at least about 40% of the double bonds of the PIB modifier molecules are in the alpha position.
30. A method as set forth in claim 19 , 21 or 22 , wherein at least about 50% of the double bonds of the PIB modifier molecules are in the alpha position.
31. A method as set forth in claim 19 , 21 or 22 , wherein at least about 60% of the double bonds of the PIB modifier molecules are in the alpha position.
32. A method as set forth in claim 19 , 21 or 22 , wherein at least about 70% of the double bonds of the PIB modifier molecules are in the alpha position.
33. A method as set forth in claim 19 , 21 or 22 , wherein at least about 80% of the double bonds of the PIB modifier molecules are in the alpha position.
34. A method as set forth in claim 19 , 21 or 22 , wherein at least about 90% of the double bonds of the PIB modifier molecules are in the alpha position.
35. A method as set forth in claim 19 , 21 or 22 , wherein more than 90% of the double bonds of the PIB modifier molecules are in the alpha position.
36. A method as set forth in claim 19 , 21 or 22 ,wherein no more than about 1% of the double bonds of the PIB modifier molecules are in a position other than the alpha or beta.
37. An improved hot melt adhesive as set forth in claim 19 , 21 or 22 , wherein said hot melt adhesive comprises from about 5 to about 25% by weight of said PIB modifier.
38. A method as set forth in claim 19 , 21 or 22 , wherein from about 5 to about 25% by weight of said PIB modifier is included in said hot melt adhesive.
39. An improved hot melt adhesive as set forth in claim 19 , 21 or 22 , wherein said hot melt adhesive has improved loop tack properties relative to hot melt adhesives containing conventional polybutene.
40. An improved hot melt adhesive as set forth in claim 19 , 21 or 22 , wherein said hot melt adhesive has improved peel adhesion properties relative to hot melt adhesives containing conventional polybutene.
41. An improved hot melt adhesive as set forth in claim 19 , 21 or 22 , wherein said hot melt adhesive has improved peel adhesion properties and improved loop tack properties relative to hot melt adhesives containing conventional polybutene.