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App. No. 10/412,557 · Confirmation No. 9443

METHOD FOR FABRICATING MULTI-CHIP PACKAGE SEMICONDUCTOR DEVICE

Inventor: Yasufumi Uchida
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2003-12-08 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-08-13 CFILE Request for Corrected Filing Receipt 2 View
2003-04-14 TRNA Transmittal of New Application 1 View
2003-04-14 A.PE Preliminary Amendment 4 View
2003-04-14 SPEC Specification 33 View
2003-04-14 CLM Claims 12 View
2003-04-14 ABST Abstract 1 View
2003-04-14 DRW Drawings-only black and white line drawings 12 View
2003-04-14 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
10/412,557
Filed
2003-04-14
Granted
2004-02-03
Pub. No.
US20030211656A1
Art Unit
2822
PTA
0 days