Contact grid array system
A scalable, low cost, reliable, compliant, low profile, low insertion force, high-density, separable and reconnectable electrical connection for high speed, high performance electronic circuitry and semiconductors. The electrical connection can be used to make, for example, electrical connections from one Printed Circuit Board (PCB) to another PCB, MPU, NPU, or other semiconductor device.
1. An electrical contact interposer, comprising:
an electrically insulating substrate having a through hole, wherein the through hole supports an electrically conducting contact element, the contact element comprising
a first portion that extends along an inner wall of the through hole,
a second portion that extends along a first surface of the substrate,
a third portion that extends along a second surface of the substrate opposite the first surface,
a fourth portion that extends away from the first surface and from an intersection of the first and second portions, toward a center area of the through hole,
a fifth portion that extends away from the second surface and from an intersection of the first and third portions, toward a center area of the through hole,
the first through the fifth portions having a unitary structure, and
the first, fourth and fifth portions define a substantially continuous arc.
2. The interposer of claim 1 , the contact element having a plurality of flexible arms disposed at the first surface of the substrate, the fourth portion comprising one flexible arm.
3. The interposer of claim 1 , the contact element having two flexible arms disposed at the first surface of the substrate, the fourth portion comprising one flexible arm.
4. The interposer of claim 1 , the contact element having three flexible arms disposed at the first surface of the substrate, the fourth portion comprising one flexible arm.
5. The interposer of claim 1 , the contact element having four flexible arms disposed at the first surface of the substrate, the fourth portion comprising one flexible arm.
6. The interposer of claim 1 , an elasticity-to-size ratio of said fourth portion being in an approximate range of between 0.5 and 1.0.
7. The interposer of claim 1 , a pitch between contact elements of the interposer being 1 mm or less.
8. The interposer of claim 1 , a pitch between contact elements of the interposer being less than approximately 20 mils.
9. The interposer of claim 1 , said substrate comprising embedded thermal dissipation elements.
10. The interposer of claim 1 , wherein when said interposer is clamped between electronic members having electrical contacts in registration with said through hole, said fourth portion is depressed to the insulating substrate no further than said first surface.
11. The interposer of claim 1 , the unitary structure provided by a plated layer deposited in a single plating process.