Preparation method of exposure original plate

1. A preparation method of an exposure original plate, comprising:

subdividing a pattern constituting an exposure original plate into a plurality of rectangular patterns;

extracting at least one micro pattern having a side with a size smaller than a prescribed value from among the plurality of rectangular patterns;

forming a corrected micro pattern for the extracted micro pattern in which a size of a side of the extracted micro pattern perpendicular to another side of the extracted micro pattern making contact with an adjacent pattern is increased by at least the prescribed value;

correcting the adjacent pattern, to form a corrected adjacent pattern, by retreating the side of the adjacent pattern which has been in contact with said corrected micro pattern by said prescribed amount of increase;

finding Electron Beam (EB) exposure data for a pattern including said corrected micro pattern and said corrected adjacent pattern, and carrying out EB exposure by the variable shaped exposure system based on the EB exposure data.

2. The preparation method of an exposure original plate as claimed in claim 1 , further comprising:

determining whether or not there exists a side of one of at least one of the plurality of rectangular patterns which becomes the basis for a new micro pattern, when the pattern is subdivided into the plurality of rectangular patterns;

withdrawing the formation of said corrected micro pattern when it is found that there exists a side of at least one of the plurality of rectangular patterns which becomes the basis for the new micro pattern;

creating a first thickened pattern for the new micro pattern by increasing the size of the side which served as the basis for the new micro pattern;

creating a second thickened pattern by increasing the size of a side of one of said micro patterns adjacent to the new micro pattern;

creating a common thickened pattern by taking a logical product of said first and second thickened patterns;

creating another corrected micro pattern to replace the corrected micro pattern, by combining the common thickened pattern and remaining portions of said micro pattern.

3. The preparation method of an exposure original plate as claimed in claim 2 , wherein in the step of correcting the adjacent pattern to form the corrected adjacent pattern, for a case when there does not exist a side of any of said plurality of rectangular patterns which becomes the basis for said micro pattern, the retreated side of said corrected adjacent pattern is extended to an end position in a short side direction of the adjacent pattern to be given a notch at the end position.

4. A preparation method of an exposure original plate comprising:

subdividing a pattern constituting an exposure original plate into a plurality of rectangular patterns;

extracting at least one micro pattern having a side smaller than a prescribed size from among the plurality of rectangular patterns;

forming a corrected micro pattern by increasing a size of a side of the extracted micro pattern perpendicular to another side of the extracted micro pattern which is making contact with an adjacent pattern at least by the prescribed size;

finding Electron Beam (EB) exposure data for a pattern including said corrected micro pattern and said adjacent pattern, and carry carrying out exposure by a variable shaped exposure method system based on the EB exposure data.

5. The preparation method of an exposure original plate as claimed in claim 1 , wherein said micro pattern is a rectangular pattern with a micro width, which is making contact with adjacent patterns on both edges in a width direction of said micro pattern, and in the step of forming said correction micro pattern, the micro pattern is subjected to a processing of increasing a width size in said width direction on both sides of the micro pattern.

6. The preparation method of an exposure original plate as claimed in claim 1 , wherein said micro pattern is a rectangular pattern with a micro width which is making contact with an adjacent pattern on one edge of said micro pattern in the width direction, and in the step of forming said corrected micro pattern, the micro pattern is subjected to a processing of increasing a width size in the width direction on one side of the micro pattern.

7. The preparation method of an exposure original plate as claimed in claim 1 , wherein said micro pattern is a rectangular pattern with a micro width and a micro length which is making contact with adjacent patterns on edges on both sides in a width direction of said micro pattern, and in the step of forming said corrected micro pattern the micro pattern is subjected to a processing of increasing the size of the micro pattern toward both edges in the width direction and toward both edges in the length direction of the micro pattern, respectively.

8. The preparation method of an exposure original plate as claimed in claim 1 , wherein said step of extracting a micro pattern is on the basis of a minimum size at which EB exposure by the variable shaped exposure system which performs variable shaped beam exposure is possible in view of the optical proximity effect, and extracts a pattern with a size smaller than said minimum size as a micro pattern.

9. The preparation method of an exposure original plate as claimed in claim 1 , wherein said step of forming the corrected micro pattern is a step of increasing the size of the side of said micro pattern to a size of side larger than a minimum size of said variable shaped beam exposure system that carries out the EB exposure.

10. The preparation method of an exposure original plate as claimed in claim 9 , wherein said minimum size is 0.1 μm and the size of the side of said corrected micro pattern is increased to a size larger than 0.2 μm.

11. The preparation method of an exposure original plate as claimed in claim 1 , wherein the pattern constituting said exposure original plate is a pattern to which an optical proximity correction is applied to a pattern based on design data.

12. The preparation method of an exposure plate as claimed in claim 11 , wherein said optical proximity effect correction is at least an optical proximity effect correction by a bias method or an optical proximity effect correlation by an inner serif method.

13. The preparation method of an exposure original plate as claimed in claim 4 , wherein said micro pattern is a rectangular pattern with a micro width, which is making contact with adjacent patterns on both edges in a width direction of said micro pattern, and in the step of forming said correction micro pattern, the micro pattern is subjected to a processing of increasing the size in said width direction on both sides of the micro pattern.

14. The preparation method of an exposure original plate as claimed in claim 4 , wherein said micro pattern is a rectangular pattern with a micro width which is making contact with an adjacent pattern on one edge in a width direction of said micro pattern, and in the step of forming said corrected micro pattern, the micro pattern is subjected to a processing of increasing the size in the width direction on one side of the micro pattern.

15. The preparation method of an exposure original plate as claimed in claim 4 , wherein said micro pattern is a rectangular pattern with a micro width and a micro length which is making contact with adjacent patterns on edges on both sides in a width direction of said micro pattern, and in the step of forming said corrected micro pattern, the micro pattern is subjected to a processing of increasing the size of the micro pattern toward both edges in the width direction and toward both edges in a length direction of the micro pattern, respectively.

16. The preparation method of an exposure original plate as claimed in claim 4 , wherein said step of extracting a micro pattern is on the basis of a minimum size at which EB exposure by the variable shaped exposure system which performs variable shaped beam exposure is possible in view of the optical proximity effect, and extracts a pattern with a size smaller than said minimum size as a micro pattern.

17. The preparation method of an exposure original plate as claimed in claim 4 , wherein the pattern constituting said exposure original plate is a pattern to which an optical proximity correction is applied to a pattern based on design data.

18. The preparation method of an exposure original plate as claimed in claim 17 , wherein said minimum size is 0.1 μm and the size of the side of said corrected micro pattern is increased to a size larger than 0.2 μm.

19. The preparation method of an exposure original plate as claimed in claim 17 , wherein said optical proximity effect correction is at least an optical proximity effect correction by a bias method or an optical proximity effect correction by an inner serif method.