Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object on first substrate with light through mask

1. A method of manufacturing an electronic device, the method comprising:

selecting one of a mask substrate, a first substrate on which a physical object to be transferred is formed, and a second substrate to which the physical object is to be transferred, as a reference substrate for alignment;

adjusting positions of the mask substrate, the first substrate and the second substrate so that an alignment mark formed on the reference substrate and alignment marks formed on other two of the mask substrate, the first substrate and the second substrate are aligned with each other; and

transferring the physical object from the first substrate to the second substrate, the transferring of the physical object including irradiating the physical object to be transferred with light transmitted through the mask substrate.

2. The method according to claim 1 , the mask substrate having a plurality of windows that transmit light to the physical object to be transferred.

3. The method according to claim 2 , the irradiating of the physical object to be transferred including branching a beam of light with a branching unit including at least one of a diffraction grating and a plurality of optical fibers.

4. The method according to claim 1 , further comprising:

adhering the first substrate and the second substrate, the adhering of the first substrate and the second substrate being carried out before the transferring of the physical object from the first substrate to the second substrate.

5. The method according to claim 4 , the transferring of the physical object from the first substrate to the second substrate further including separating the first substrate and the second substrate.

6. The method according to claim 1 , further comprising:

transporting the second substrate to a bed using a substrate transporting unit; and

fixing the second substrate on the bed.

7. A method of manufacturing an electronic device, the method comprising:

providing a first substrate on which a physical object to be transferred and a first alignment mark are formed, a second substrate on which a second alignment mark is formed, and a mask substrate on which a third alignment mark is formed;

aligning the second alignment mark formed on the second substrate and the third alignment mark formed on the mask substrate;

aligning the first alignment mark formed on the first substrate with the second alignment mark formed on the second substrate; and

transferring the physical object from the first substrate to the second substrate, the transferring of the physical object including irradiating the physical object to be transferred with light transmitted through the mask substrate.

8. The method according to claim 7 , further comprising:

adhering the first substrate and the second substrate, the adhering of the first substrate and the second substrate being carried out before the transferring of the physical object from the first substrate to the second substrate.

9. The method according to claim 8 , the transferring of the physical object from the first substrate to the second substrate further including separating the first substrate and the second substrate.

10. The method according to claim 7 , further comprising:

transporting the second substrate to a bed using a substrate transporting unit; and

fixing the second substrate on the bed.

11. A method of manufacturing an electronic device, the method comprising:

providing a first substrate on which a physical object to be transferred and a first alignment mark are formed, a second substrate on which a second alignment mark is formed, and a mask substrate on which a third alignment mark is formed;

aligning the first alignment mark formed on the first substrate with the third alignment mark formed on the mask substrate;

aligning the second alignment mark formed on the second substrate with the first alignment mark formed on the first substrate; and

transferring the physical object from the first substrate to the second substrate, the transferring of the physical object including irradiating the physical object to be transferred with light transmitted through the mask substrate.

12. The method according to claim 11 , further comprising:

adhering the first substrate and the second substrate, the adhering of the first substrate and the second substrate being carried out before the transferring of the physical object from the first substrate to the second substrate.

13. The method according to claim 12 , the transferring of the physical object from the first substrate to the second substrate further including separating the first substrate and the second substrate.

14. The method according to claim 11 , further comprising:

transporting the second substrate to a bed using a substrate transporting unit; and

fixing the second substrate on the bed.

15. A method of manufacturing an electronic device, the method comprising:

providing a first substrate on which a physical object to be transferred and a first alignment mark are formed, a second substrate on which a second alignment mark is formed, and a mask substrate on which a third alignment mark is formed;

aligning the first alignment mark formed on the first substrate with the third alignment mark formed on the mask substrate;

aligning the second alignment mark formed on the second substrate with the third alignment mark formed on the mask substrate; and

transferring the physical object from the first substrate to the second substrate, the transferring of the physical object including irradiating the physical object to be transferred with light transmitted through the mask substrate.

16. The method according to claim 15 , further comprising:

adhering the first substrate and the second substrate, the adhering of the first substrate and the second substrate being carried out before the transferring of the physical object from the first substrate to the second substrate.

17. The method according to claim 16 , the transferring of the physical object from the first substrate to the second substrate further including separating the first substrate and the second substrate.

18. The method according to claim 15 , further comprising:

transporting the second substrate to a bed using a substrate transporting unit; and

fixing the second substrate on the bed.