IP Library Granted Patent US 6,956,012
Granted Patent B2
US 6,956,012 · App. 10/422,244 · Granted Oct 18, 2005

Method of depositing an electrically conductive oxide buffer layer on a textured substrate and articles formed therefrom

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Quick Facts
Patent No.
US 6,956,012
App. No.
10/422,244
Granted
Oct 18, 2005
Kind
B2
Abstract

An article with an improved buffer layer architecture includes a substrate having a textured metal surface, and an electrically conductive lanthanum metal oxide epitaxial buffer layer on the surface of the substrate. The article can also include an epitaxial superconducting layer deposited on the epitaxial buffer layer. An epitaxial capping layer can be placed between the epitaxial buffer layer and the superconducting layer. A method for preparing an epitaxial article includes providing a substrate with a metal surface and depositing on the metal surface a lanthanum metal oxide epitaxial buffer layer. The method can further include depositing a superconducting layer on the epitaxial buffer layer, and depositing an epitaxial capping layer between the epitaxial buffer layer and the superconducting layer.

Claims (19)

1. A method for preparing an epitaxial article, comprising the steps of:

providing a substrate with a textured non-noble metal surface;

depositing a single lanthanum metal oxide epitaxial buffer layer on and in contact with said surface of said substrate, and

depositing a superconducting layer on and in contact with said single lanthanum metal oxide epitaxial buffer layer, said superconducting layer providing a Jc of at least 0.5 MA/cm 2 at 77 K.

2. The method according to claim 1 , further comprising the step of providing a biaxially-textured metal surface.

3. The method according to claim 2 , further comprising the step of rolling and annealing a metal material to form said biaxially-textured substrate surface.

4. The method according to claim 1 , further comprising the step of rolling and annealing a metal substrate, said metal substrate comprising at least one metal selected from the group consisting of Cu, Cu-based alloy, Co, Mo, Cd, Pd, Pt, Ag, Al, Ni, and Ni-based alloys.

5. The method according to claim 1 , further comprising the step of rolling and annealing a metal substrate, said metal substrate comprising at least one metal selected from the group consisting of Ni and Ni-based alloy with at least one alloying agent selected from the group consisting of Co, Cr, V, Mo, W, and rare earth elements.

6. The method according to claim 1 , wherein said lanthanum metal oxide epitaxial buffer layer is selected from compounds having the general formula La 1−x A x MO 3 , wherein A and M are metals and 0<x<0.8.

7. The method according to claim 6 , wherein A is at least one selected from the group consisting of Sr, Ba and Ca.

8. The method according to claim 6 , wherein M is at least one selected from the group consisting of Mn and Co.

9. The method according to claim 1 , wherein said lanthanum metal oxide epitaxial buffer layer is electrically conductive and said superconducting layer is continuously electrically connected to said textured non-noble metal surface.

10. The method according to claim 1 , wherein said lanthanum metal oxide epitaxial buffer layer is Lao 0−7 Sr 0−3 MnO 3 .

11. The method according to claim 1 , wherein said lanthanum metal oxide epitaxial buffer layer is LaMnO 3 .

12. The method according to claim 1 , wherein said superconducting layer is selected from the group consisting of REBa 2 Cu 3 O 7 where RE is a rare earth element, Tl 1 Ba 2 Ca n−1 Cu n O 2n+3 , where n is an integer between 1 and 4, Tl 2 Ba 2 Ca n−1 Cu n O 2n+4 where n is an integer between 1 and 4, and Hg 1 Ba 2 Ca n−1 Cu n O 2n+2 , where n is an integer between 1 and 4.

13. The method according to claim 1 , wherein said lanthanum metal oxide epitaxial buffer layer is deposited by a sputtering process.

14. The method according to claim 13 , wherein said sputtering process comprises rf-magnetron sputtering.

15. The method according to claim 1 , wherein said superconducting layer is deposited by a process comprising pulsed laser ablation.

16. The method according to claim 1 , wherein said Jc at 77 K is between 0.5 MA/cm 2 and 1.0 MA/cm 2 .