IP Library › Granted Patent US 7,168,157
Granted Patent B2
US 7,168,157 · App. 10/425,749 · Granted Jan 30, 2007

Method of fabricating a printhead

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Quick Facts
Patent No.
US 7,168,157
App. No.
10/425,749
Granted
Jan 30, 2007
Kind
B2
Abstract

A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.

Claims (16)

1. A method of fabricating a printhead comprising:

depositing a first layer of resistive material over a substrate;

depositing aluminum conductive material over the first layer of resistive material;

dry etching the conductive material to define at least one of a conductor trace and a resistor length, wherein the dry etching removes a portion of the first layer of resistive material in an area defining the resistor length;

depositing a second layer of resistive material over the conductor trace, wherein the at least one conductive trace is substantially completely encapsulated by the resistive material; and

depositing a top layer over the resistive material, wherein the top layer has an orifice through which fluid is capable of being ejected.

2. The method of claim 1 further comprising depositing photoresist over the conductive material and photomasking before etching the conductive material; and removing the photoresist material before depositing the resistive material.

3. The method of claim 1 further comprising:

depositing photoresist over the resistive material and photomasking;

etching the resistive material to define a resistor width and a cap width on the conductor traces; and

removing the photoresist material.

4. The method of claim 3 further comprising encapsulating the conductor trace, wherein the cap width is greater than a width of the conductor trace.

5. The method of claim 4 wherein the conductor trace has first and second sections, each section having an end surface and two opposing side surfaces, wherein the end surface of the first section faces the end surface of the second section, the method further comprising covering the side surfaces of the conductor traces with the cap width.

6. The method of claim 1 wherein the conductor trace has first and second sections, wherein an end surface of the first section faces an end surface of the second section, the method further comprising beveling the end surface of each section.

7. The method of claim 6 further comprising forming the end surface using photomasking techniques.

8. The method of claim 1 wherein the dry etching step removes a portion of the substrate underneath the first layer of resistive material in the area defining the resistor length.