Information recording medium and method of manufacturing same
View Patent ↗Two substrates are simultaneously produced by an injection molding apparatus, and the injection-molded substrates are alternately arranged and cooled by a cooling apparatus. The cooling apparatus has a feed screw mechanism for feeding the alternately arranged substrates in one direction while cooling air is being applied to the substrates. An information recording medium which includes a substrate is manufactured on a production line having a single injection molding apparatus for simultaneously injection-molding two substrates and four dye solution coating machines for forming a dye recording layer for recording information on each of the substrates.
1. A method of manufacturing an information recording medium, comprising the steps of:
simultaneously injecting-molding two substrates;
alternately arranging said two substrates with surfaces thereof oriented substantially vertically on one feed screw mechanism and at a pitch which is at least six times the thickness of each of the substrates; and
cooling said two substrates on said feed screw mechanism;
forming a dye recording layer on one of said two substrates; and
thereafter, bonding said two substrates to each other,
wherein the feed screw mechanism comprises straight feed screws having screw grooves,
wherein the screw grooves of the straight feed screws hold outer circumferential edges of the substrates and the feed screw mechanism feeds vertically oriented substrates in one direction.
2. A method according to claim 1 , wherein said information recording medium is manufactured by a manufacturing line comprising:
a single injection molding apparatus for simultaneously injection-molding said two substrates; and
four dye solution coating machines adjacent to the one of said two substrates,
wherein each of said dye solution coating machines form said dye recording layer.
3. A method according to claim 1 , wherein said alternately arranging comprises alternately arranging said two substrates at a pitch which is at most 100 times the thickness of each of the substrates.
4. A method according to claim 1 , wherein said alternately arranging comprises alternately arranging said two substrates at a pitch which is at least 8 times the thickness of each of the substrates.
5. A method according to claim 4 , wherein said alternately arranging comprises alternately arranging said two substrates at a pitch which is at most 30 times the thickness of each of the substrates.
6. A method according to claim 1 , wherein said cooling comprises intermittently feeding said two substrates by said feed screw mechanism at an interval ranging from 1 second to 60 seconds.
7. A method according to claim 1 , wherein said cooling comprises cooling each of said substrates for a period of time which is at least 3 minutes.
8. A method according to claim 1 , wherein said alternately arranging is performed after a temperature of said substrates is at most 115° C.