Method for controlling the ferric ion content of a plating bath containing iron
View Patent ↗A system and method for reducing ferric ion content in a plating solution by exposing hydrogen to an electrode in a plating solution for reducing a ferric ion content in the plating solution.
1. A method for reducing ferric ion content in a plating solution, comprising:
exposing hydrogen to an energized electrode in a plating solution for reducing a ferric ion content in the plating solution;
wherein the electrode is present in the plating solution in addition to an anode and a cathode.
2. The method as recited in claim 1 , wherein the electrode has a platinum surface.
3. The method as recited in claim 2 , wherein the electrode is a platinized titanium electrode.
4. The method as recited in claim 1 , wherein the hydrogen is bubbled over the electrode.
5. The method as recited in claim 1 , wherein the hydrogen is added to the plating solution, the hydrogen dissolving into the plating solution.
6. The method as recited in claim 1 , further comprising increasing a circulation of the plating solution near the electrode.
7. The method as recited in claim 1 , wherein the electrode is positioned in a plating reservoir.
8. The method as recited in claim 1 , wherein the electrode is positioned in a plating cell.
9. The method as recited in claim 1 , wherein the electrode is positioned in a filter housing.
10. A method, comprising:
energizing an electrode positioned in a plating solution;
wherein the electrode has a platinum surface;
wherein the plating solution has a partial iron content; and
exposing hydrogen to the electrode;
wherein the electrode is present in the plating solution in addition to an anode and a cathode.
11. The method as recited in claim 10 , wherein the hydrogen is bubbled over the electrode.
12. The method as recited in claim 10 , wherein the hydrogen is added to the plating solution, the hydrogen dissolving into the plating solution.
13. The method as recited in claim 10 , further comprising increasing a circulation of the plating solution near the electrode.
14. The method as recited in claim 10 , wherein the electrode is positioned in a plating reservoir.
15. The method as recited in claim 10 , wherein the electrode is positioned in a plating cell in the presence of a magnetic field.
16. The method as recited in claim 10 , wherein the electrode is positioned in a filter housing.
17. A method for reducing a ferric ion content in a plating solution, comprising:
energizing an electrode constructed of platinized titanium; and
exposing hydrogen to the electrode in the presence of a magnetic field for reducing a ferric ion content in the plating solution,
wherein the electrode is present in the plating solution in addition to an anode and a cathode.
18. A method for reducing ferric ion content in a plating solution, comprising:
exposing hydrogen to an energized electrode in a plating solution for reducing a ferric ion content in the plating solution;
wherein the electrode is present in the plating solution in addition to an anode and a cathode,
wherein the hydrogen is added to the plating solution, the hydrogen dissolving into the plating solution.
19. The method as recited in claim 18 , wherein the electrode has a platinum surface.
20. The method as recited in claim 19 , wherein the electrode is a platinized titaniun electrode.
21. The method as recited in claim 18 , wherein the hydrogen is bubbled over the electrode.
22. The method as recited in claim 18 , further comprising increasing a circulation of the plating solution near the electrode.
23. The method as recited in claim 18 , wherein the electrode is positioned in at least one of a plating reservoir, a plating cell, and a filter housing.