An IC card includes a first support; a second support; an IC module including an IC chip, a reinforcing structural member neighboring to the IC chip and an antenna; the IC module providing between the first and second supports; a first adhesive layer provided between the first support and the IC chip; and a second adhesive layer provided between the first support and the IC chip. The IC card has a rebound coefficient (h/h 0 ) of 0.52 to 0.70, where h 0 is a dropping height from which a steel ball is dropped onto the IC card and h is a rebound height to which the steel ball rebounds from the IC card.
1. An integrated circuit (IC) card, comprising:
a first support;
a second support;
an IC module including an IC chip, a reinforcing structural member neighboring to the IC chip and an antenna; the IC module provided between the first and second supports;
a first adhesive layer provided between the first support and the IC chip; and
a second adhesive layer provided between the first support and the IC chip,
wherein the IC card has a rebound coefficient (h/h 0 ) of 0.52 to 0.70, where h 0 is a dropping height of 60 cm from which a steel ball made of S45C steel and having a top edge diameter of 20 mm and a weight of 50 g is free dropped onto the IC card and h is a rebound height to which the steel ball rebounds from the IC card which is rigidly fixed on a table having a hole of 27 mm diameter by being sandwiched from upside and downside of the IC card.
2. The IC card of claim 1 , wherein an adhesive used for the first and second adhesive layer has a 2% elastic modulus of 5 kg/mm 2 to 55 kg/mm 2 .
3. The IC card of claim 2 , wherein the adhesive is a reactive-type hot-melt adhesive.
4. The IC card of claim 1 , wherein when the total thickness of the first and second supports is Tsupport and the thickness of the IC card is Tcard, the ratio (Tsupport/Tcard) is 0.33 to 0.55.
5. The IC card of claim 1 , wherein when the total thickness of the first and second supports is Tsupport and the thickness of the IC chip is Tchip, the ratio (Tchip/Tsupport) is 0.05 to 0.40.
6. The IC card of claim 1 , wherein the thickness of each of the first and second support is 30 μm to 300 μm.
7. The IC card of claim 6 , wherein the thickness of each of the first and second support is 50 μm to 200 μm.
8. The IC card of claim 1 , wherein the thickness of each of the first and second adhesive layers is 10 μm to 600 μm.
9. The IC card of claim 8 , wherein the thickness of each of the first and second adhesive layers is 10 μm to 500 μm.
10. The IC card of claim 9 , wherein the thickness of each of the first and second adhesive layers is 10 μm to 450 μm.
11. The IC card of claim 1 , wherein the thickness of the IC chip is 10 μm to 300 μm.
12. The IC card of claim 11 , wherein the thickness of the IC chip is 30 μm to 300 μm.
13. The IC card of claim 12 , wherein the thickness of the IC chip is 30 μm to 250 μm.
14. The IC card of claim 1 , wherein the reinforcing structural member is a metallic reinforcing plate provided through an adhesive in contact with a non-circuit surface of the IC chip.
15. The IC card of claim 1 , wherein one of the first and second adhesive layers is arranged to directly neighbor to a part of the IC chip.
16. The IC card of claim 1 , wherein one of the first and second supports includes an image receiving layer on which ID information including a name and a facial image is provided and other one of the first and second supports includes a writable layer.
17. The IC card of claim 1 , further comprising:
a cushion layer between an image receiving layer and the IC module.
18. The IC card of claim 17 , where the cushion layer is made of a resin.
19. The IC card of claim 1 , where the IC card has a thickness of 760 μm.