Method for fabricating nitride semiconductor, method for fabricating nitride semiconductor device, and nitride semiconductor device
View Patent ↗The method for fabricating a nitride semiconductor of the present invention includes the steps of: (1) growing a first semiconductor layer made of a first group III nitride over a substrate by supplying a first group III source and a group V source containing nitrogen; and (2) growing a second semiconductor layer made of a second group III nitride on the first semiconductor layer by supplying a second group III source and a group V source containing nitrogen. At least one of the steps (1) and (2) includes the step of supplying a p-type dopant over the substrate, and an area near the interface between the first semiconductor layer and the second semiconductor layer is grown so that the density of the p-type dopant locally increases.
1. A method for fabricating a nitride semiconductor, comprising the steps of:
(1) growing a first semiconductor layer made of a first group III nitride over a substrate by supplying a first group III source and a group V source containing nitrogen; and
(2) growing a second semiconductor layer made of a second group III nitride on the first semiconductor layer by supplying a second group III source of a plurality of group III elements and a group V source containing nitrogen,
wherein at least one of the steps (1) and (2) includes the step of supplying a p-type dopant over the substrate before the growth of the semiconductor layer begins such that an area near the interface between the first p-type semiconductor layer and the second p-type semiconductor layer is grown so that the density of the p-type dopant locally increases to a peak in the second p-type semiconductor layer at a position adjacent the interface.
2. The method of claim 1 , wherein the first group III source mainly contains gallium, and the second group III source contains gallium and either one of aluminum and indium.
3. The method of claim 1 , wherein when both the step (1) and the step (2) include the step of supplying a p-type dopant, the supply amount of the p-type dopant is roughly the same in the two steps.
4. The method of claim 1 , wherein the supply amount of the p-type dopant is different between the step (1) and the step (2).
5. The method of claim 1 , wherein when the p-type dopant is supplied during the growth of the first semiconductor layer, the supply of the p-type dopant is started ahead of the growth of the first semiconductor layer.
6. The method of claim 1 , wherein when the p-type dopant is supplied during the growth of the second semiconductor layer, the supply of the p-type dopant is started ahead of the growth of the second semiconductor layer.
7. The method of claim 1 , wherein the peak position of the density of the element having a smaller mole fraction among the plurality of group III elements is different from the peak position of the density of the p-type dopant.
8. The method of claim 1 , wherein the density of the p-type dopant is about 3×10 19 cm −3 or less.
9. The method of claim 1 , wherein the thickness of the second semiconductor layer is about 1.5 nm or more.