Heat dissipation system used in electronic device
View Patent ↗A heat dissipation system used in an electronic device includes a casing, an inlet, an outlet, two thermal sensors, at least one fan, and a microprocessor. The fan is disposed in the casing and configured to guide airflow into the casing through the inlet and out of the casing through the outlet. The two thermal sensors are disposed in the casing and respectively located near the inlet and the outlet to measure a first temperature and a second temperature. The microprocessor has at least one relation table, which is a function of ratio of the second temperature to the first temperature, between the first temperature and speed of the fan. The microprocessor selects one relation table in accordance with the ratio of the second temperature value to the first temperature value to control the speed of the first fan according to the first temperature.
1. A heat dissipation system used in an electronic device, comprising:
a casing;
an inlet located on the casing;
an outlet located on the casing;
a first fan disposed in the casing for guiding an airflow into the casing through the inlet and out of the casing through the outlet;
a first thermal sensor disposed in the casing and near the inlet, the first thermal sensor detecting a first temperature value;
a second thermal sensor disposed in the casing and near the outlet, the second thermal sensor detecting a second temperature value; and
a microprocessor located in the casing to control a speed of the first fan, the microprocessor storing M groups of relation tables between the first temperature value and the speed of the first fan, M groups of relation tables are functions of a ratio of the second temperature value to the first temperature value;
wherein, the microprocessor chooses one relation table from the M groups of relation tables in accordance with the ratio of the second temperature value to the first temperature value, and the microprocessor controls the speed of the first fan in accordance with the first temperature.
2. The heat dissipation system of claim 1 , the microprocessor further storing a plurality of comparison values, the microprocessor determining the speed of the first fan by comparing the ratio of the second temperature value to the first temperature value with the comparison values.
3. The heat dissipation system of claim 1 , wherein the first fan is disposed near the outlet.
4. The heat dissipation system of claim 3 , further comprising a second fan near the inlet to guide the airflow into the casing through the inlet.
5. The heat dissipation system of claim 4 , wherein the microprocessor controls a speed of the second fan.
6. An electrical device having adaptive heat dissipation functions, comprising:
a casing;
an inlet located on the casing;
an outlet located on the casing;
a plurality of temperature N sensors located about the casing, wherein at least a first one of the temperature sensors is located proximate the inlet and at least a second one of the temperature sensors is located proximate the outlet; and
a microprocessor located within the casing to control a speed of a fan located proximate the inlet or outlet, the microprocessor storing M groups of relation tables, where M=N.