Thermal management in electronic displays

1. A display comprising:

a front panel;

a back panel spaced from the front panel, the front and back panels defining a space therebetween;

at least one pixel structure adjacent the front panel in the space between the front and back panels;

a plurality of electrical connections extending between the back panel and the at least one pixel structure; and

a plurality of thermo-mechanical elements extending between the back panel and the at least one pixel structure to dissipate heat from the at least one pixel structure toward the back panel, wherein at least one of the plurality of thermo-mechanical elements is positioned between adjacent pixel structures of the at least one pixel structure.

2. The display of claim 1 , wherein the plurality of thermo-mechanical elements are separate from the plurality of electrical connections.

3. The display of claim 1 , wherein the plurality of thermo-mechanical elements comprise a material selected from a group consisting of InSn solder and silver-filled epoxy adhesive.

4. The display of claim 1 , wherein the plurality of electrical connections are formed from materials used to form the plurality of thermo-mechanical elements.

5. The display of claim 1 , wherein at least one of the plurality of thermo-mechanical elements is larger than one or more of the plurality of electrical connections.

6. The display of claim 1 , wherein the back panel comprises a thermally conductive material for dissipating at least the heat received at the back panel via the plurality of thermo-mechanical elements.

7. The display of claim 1 , wherein the back panel is formed from a material selected from a group consisting of alumina and aluminum nitride.

8. The display of claim 1 , further comprising:

an underfill encapsulant filling the space between the front and back panels to further dissipate heat from the at least one pixel structure toward the back panel.

9. The display of claim 8 , wherein the underfill encapsulant is an alumina filled epoxy.

10. The display of claim 8 , wherein the underfill encapsulant includes a filler selected from a group consisting of diamond, BN, AlN, BeO, and SiC.

11. The display of claim 1 , wherein the at least one pixel structure comprises a display material selected from a group consisting of organic light emitting diodes (OLED), light emitting diodes, field emissive elements, plasma elements, cathodoluminescent elements, end bistable, reflective cholesteric (BRC) liquid crystal elements.

12. An electronic display comprising:

a front panel;

a back panel spaced from the front panel, the front and back panels defining a space therebetween;

at least one pixel structure having a top surface adjacent the front panel and a bottom surface, each of the at least one pixel structure having a first electrode on the top surface and a second electrode on the bottom surface;

a first electrical connection via extending between the back panel and the first electrode of one of the at least one pixel structure;

a second electrical connection via extending between the back panel and the second electrode of the one of the at least one pixel structure; and

at least one thermo-mechanical via extending between the back panel and the one of the at least one pixel structure to dissipate heat from the one of the at least one pixel structure to the back panel, wherein the at least one thermo-mechanical via is positioned between adjacent pixel structures of the at least one pixel structure.

13. The display of claim 12 , wherein the at least one thermo-mechanical via is electrically isolated from the first and second electrodes.

14. The display of claim 12 , wherein the at least one pixel structure comprises a display material selected from a group consisting of organic light emitting diodes (OLED), light emitting diodes, field emissive elements, plasma elements, cathodoluminescent elements, and bistable, reflective cholesteric (BRC) liquid crystal elements.

15. The display of claim 12 , wherein the at least one thermo-mechanical via is formed from a material selected from a group consisting of InSn solder and silver-filled epoxy adhesive.

16. The display of claim 12 , wherein the back panel comprises a thermally conductive material for dissipating at least the heat received at the back panel via the at least one thermo-mechanical via.

17. The display of claim 12 , wherein the back panel is formed from a material selected from a group consisting of alumina and aluminum nitride.

18. The display of claim 12 , further comprising:

an underfill encapsulant filling the space between the front and back panels to further dissipate heat from the at least one pixel structure toward the back panel.

19. The display of claim 18 , wherein the underfill encapsulant is an alumina filled epoxy.

20. The display of claim 18 , wherein the underfill encapsulant includes a filler selected from a group consisting of diamond, BN, AlN, BeO, and SiC.